Lakefield CPUs and Devices Coming To Market

With Intel teasing Lakefield from late 2018 and stating 2020 availability, naturally we had been expecting an announcement at some point this year, and in early June the company officially announced the two processors that would be coming to the Lakefield family. Technically this is four SKUs, which I’ll get on to.

Both the parts feature ‘Core i5/i3’ branding, however they will not fall into a traditional Core generation naming. So where Skylake was 6th Gen Core, Comet Lake was 10th Gen Core, these are just ‘Intel Core Processors with Intel Hybrid Technology’. Rolls off the tongue, doesn’t it.

Both CPUs are the same silicon underneath, just with different core frequencies and GPU configurations with the Core i3 having it partly disabled.

Intel Lakefield Processors
AnandTech Cores Base
Freq
1C
Turbo
nT
Turbo
Gen11
IGP
IGP
Freq
DRAM
LP4
TDP
i5-L16G7 1+4 1400 3000 1800 64 EUs 500 4267 7 W
i3-L13G4 1+4 800 2800 1300 48 EUs 500 4267 7 W

Intel confirmed that the base frequency and all-core turbo values are unified frequencies across all the cores, while the single core turbo applies to the Sunny Cove core. Support for LPDDR4X-4267 is given for both processors, and is a frequency notch above the support found in Ice Lake. The graphics is wide and slow, running at only 500 MHz, and both CPUs have a TDP of 7W. The amount of PoP memory does not affect the TDP.

However, it’s the PoP memory that will provide each one of these processors with two variants. The memory for Lakefield is being provided by a third party (Intel won’t say who, so I guess we’ll find out when we put the CPU in acid), and assembly is done by Intel. Intel will offer both processors in 4 GB and 8 GB configurations, running at a maximum memory bandwidth of 34 GB/s, indicative of dual 16-bit memory controllers. So despite the frequency of the memory being higher than Ice Lake, Ice Lake can address 4x16-bit memory controllers, giving an overall higher memory bandwidth.

Intel will debut these two SKUs in its first generation of Lakefield. Even those these CPUs are a 1+4 configuration, operating mainly in a 0+4 as mentioned on the previous pages, Intel is placing them in the premium market spaces due to the increased complexity of construction but also on the basis of the low idle power. Intel claims a 2-3 mW idle power (initially said 2 mW, then said 3 mW, then settled on 2.6 mW, depending on who you ask) while in connected standby modes. This will help any systems using them achieve long periods of sleep modes without needing to worry about casual drain.

As a result, these CPUs will find homes in premium, always-connected laptops, such as the Samsung Galaxy Book S expected in markets this month, the Lenovo ThinkPad X1 Fold, coming later this year, and in the Microsoft Surface Book Neo.

Samsung Galaxy Book S

As per our announcement piece:

First teased by Samsung late last year, the Lakefield-based version of the laptop is set to join their existing Qualcomm 8cx-based model, swapping out the Arm SoC for x86, providing a very interesting point of competition if we’re able to compare the two in the same chassis. The Intel Galaxy Book S will be the first device to ship with Lakefield, putting the new processor to the test in seeing if Intel can match the kind of all-day battery life that the existing Galaxy Book S is known for.

Taking a look at the specifications, the Intel-based version of the Galaxy Book S is a spitting image of the Qualcomm version. Samsung appears to be using the same chassis here, so the 13.3-inch laptop retains the same dimensions as the current model, as well as the same two USB-C ports. The battery capacities are identical as well at 42 Wh, and I expect that the Intel model is also using the same 1080p LCD. Curiously though, the Intel model does end up being ever so lighter than the Qualcomm model – Samsung puts the former at 950g, 10g lighter than the 960g Qualcomm model.

Samsung Galaxy Book S Family
  Galaxy Book S (Intel) Galaxy Book S (Qualcomm)
CPU Intel Core with Hybrid Technology
1x Sunny Cove (Core)
4x Tremont (Atom)
Qualcomm Snapdragon 8cx
4x Kryo 495 Gold @ 2.84 GHz
4x Kryo 495 Silver @ 1.8 GHz
GPU Intel UHD Graphics Adreno 680
Display 13.3 Inch, 1920×1080
Full HD Touchscreen
Memory 8 GB LPDDR4X
Storage 256/512 GB eUFS
+ microSD Card Slot
256/512 GB
+ microSD Card Slot
Networking Wi-Fi 6 (802.11ax)
BT 5.0
Wi-Fi 5 (802.11ac)
BT 5.0
Modem Discrete LTE
Cat 16
Integrated Qualcomm X20 LTE
Cat 18
Battery 42 Wh
Ports 2 x USB-C
1 x 3.5 mm (phono/mic)
Dimensions 305.2 x 203.2 x 11.8 mm
Weight (Approx) 950g 960g
Price (USD) N/A Starts at $999

As for memory and storage, because the memory is part of the Lakefield package, Samsung is only offering a single 8GB configuration here. Unfortunately Samsung’s spec sheet doesn’t list memory frequencies, so we’ll have to wait and see what Intel has Lakefield’s memory clocked at. Meanwhile Samsung provides the storage, using 256GB or 512GB of their eUFS flash memory. To my knowledge this is the first x86 laptop to ship with eUFS, reflecting the mobile roots of the devices Intel is targeting with Lakefield. Further storage expansion is then available through a microSD card slot.

One specification that’s notably missing from Samsung’s announcement is the expected battery life of the Intel-based model, and this is perhaps going to be the most interesting aspect of Lakefield. Intel has worked very hard to get their idle power consumption down to be able to match what Qualcomm has achieved with the 8cx, with the company claiming that Lakefield draws just ~2-3mW at idle. At the same time, however, Lakefield lacks an integrated modem, and as a result Samsung is relying on an Intel Cat 16 external modem here. So in the battle of the Galaxy Books, Qualcomm will have the advantage in regards to requiring fewer chips.

As for other wireless connectivity, the new Intel model will ship with a 2x2 Wi-Fi 6 radio, giving it an edge there over the Qualcomm model with Wi-Fi 5. And both models ship with Bluetooth 5.0 support.

Rounding out the package, the Intel-based Galaxy Book S has a 720p webcam, a built-in microphone as well as Dolby Atmos-badged stereo speakers co-designed with AKG. The laptop also has a Windows Hello-compatible fingerprint reader. Price is currently unknown.

 

Lenovo ThinkPad X1 Fold

From our news announcement coverage:

The new Fold is a true high-end Thinkpad, with a flexible 13.3-inch OLED display split across the two halves of the design, essentially becoming the size of a notepad when folded. This means that when unfolded, it offers 2x more screen real estate than a Samsung foldable smartphone. The construction of the foldable display includes metal frames and supports combined with carbon fiber plates. The hinge mechanism claims to provide friction free folding, but also allows for rigid support at a variety of angles when unfolded like a standard clamshell.

When folded, the device is just over an inch thick (27.8 mm) at its widest point, but when unfolded becomes only 7.8 mm thick, or 11.5 mm with the included cover. The reason that the folded dimension is more than 2x the unfolded is because there will be a slight ridge on the hinge where the fold is, so the display isn’t crisply folded.

Inside the unit beats the heart of a properly built laptop. We’ve got one of the first new outings for Intel’s Lakefield processor, featuring 1 big Sunny Cove core and 4 smaller Tremont Atom cores, combined with Intel’s Gen11 HD Graphics (the ones that come with Ice Lake, although it doesn’t mention frequencies or EUs). Memory is a full 8 GB of LPDDR4X-2133 with storage provided by a standard M.2 2242 NVMe drive, although Lenovo will offer variants up to 1 TB. There’s an inbuilt 5 MP camera, and the battery is a proper 50 Wh, good for 11+ hours according to Lenovo.

The exact specifications on the display is a 13.3-inch flexible OLED with a 2048x1536 resolution, with brightness up to 300 nits and color gamut support up to 95% of DCI-P3. Touch is also implemented.

For IO, the device has two USB Type-C ports (one USB 3.1, one USB 3.2), and a Displayport over Type-C port for external displays. There is also a SIM slot in order to use the onboard modem. Lenovo lists the modem as 4G/5G, although doesn’t state which modem this is – it’s likely to be Qualcomm’s X55 at this point. The device also supports 802.11ax and BT5.0.

The price according to Lenovo is $2499 for the 1 TB model. All units will come with an Active Pen and an external keyboard in the box, and altogether the unit weighs 999g / 2.2 lbs (cover included). The keyboard can be off the notebook, or placed on one half of the screen:

The Lenovo ThinkPad X1 Fold looks like a crazy device that I’d love to test. Lenovo has a tentative date of ‘Mid 2020’ for the product, which will likely depend on display availability as well as Intel’s production of Lakefield processors.

 

Microsoft Surface Book Neo

Less is known about the Surface Book Neo. It was presented by Microsoft at an event in October 2019, featuring dual 9-inch screens and a fully rotatable hinge, and according to Microsoft’s website should be available by the end of the Holiday 2020 season.

The Neo is a true dual screen device, rather than something foldable, but will still use the external keyboard. We expect some form of pen support, and it should be running Windows 10X, a special build of Windows built for multi-screen devices like this one. However, it has been reported that Windows 10X has been delayed until next year due to the additional complexities of working from home during the pandemic as well as a focus more on single screen devices.

Lakefield in Terms of Laptop Size Performance Numbers: How To Interpret Them
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  • Quantumz0d - Sunday, July 5, 2020 - link

    PC gaming marketcap is supposed to be at $40Bn by 2022, total gaming market is $120Bn including everything, and Consoles are built on AMD x86 technology and now DX12U and you think that is a niche ?

    ARM is not going to do anything just because Apple did, there are so many trials by so many companies and the best company which is known for it's ROI with R&D, Qualcomm abandoned all of it's Server ARM marketshare dreams with the death of their full custom Centriq. x86 runs blazingly fast and optimized with Linux which is what the world is powered just because ARM is good in thin and light garbage doesn't make it a superstar.

    ARM is not going to get into Desktop at all, no one is going to write their programs again to suppor that HW, and no company is going to invest in DIY market before Server/DC market. Supercomputer market is not the DIY or Enterprise, look at the Top Supercomputers, Chinese Tianhe and 2 positions are with Chinese only, AMD CRAY Zen based IF supercomputer is about to come as well.
  • Wilco1 - Sunday, July 5, 2020 - link

    The #1 supercomputer is Arm, and Arm servers beat x86 servers on performance, cost and power, so not a single "fact" in your post is correct.
  • lmcd - Sunday, July 5, 2020 - link

    That first statement is hilariously disconnected from the second. Fugaku at 3x the cost per flop of its next competitor hardly backs up your assertion.

    ARM servers might beat x86 servers on performance, cost, and power but it's not looking that good vs x86_64. The latter arch is commodity hardware, software, and talent hiring.
  • Wilco1 - Monday, July 6, 2020 - link

    Just looking at the peak FLOPS in comparisons is deceiving. Fugaku is a very different design as it does not use GPU accelerators like most supercomputers. That means it is far better than the rest in terms of ease of programming and efficiency. So even if the upfront cost is higher, they expect to get far more out of it than other super computers.

    I'd say Arm servers are doing really well in 2020, clearly companies want a change from the x86 duopoly. Much of the talent is at companies that do Arm designs. How else do you think Arm CPUs are getting 20-30% faster per year, and mobile phones already outperform the fastest x86 desktops?
  • Quantumz0d - Tuesday, July 7, 2020 - link

    No company wants to develop an in house IP, that R&D and ROI is not easy, Amazon did it because to chop off some costs and set up a plan for the low end AWS instances with Graviton 2, Altera is still yet to show, Centriq abandoned by Qcomm with so much of marketing done around Cloudflare and top class engineering work, the team which made 820's full custom core.

    AND What the fuck you are babbling on fastest x86 desktops (Like Threadripper 3990X, or 3950X, 10900K) outperformed by mobile phones ? Ooof, you are gulping down the AT's SPEC scores aren't you ?

    ARM servers LMAO, like how AMD upped their DC marketshare with EPYC7742, dude stop posting absolute rubbish. ARM marketshare in data centers is in 0.5% area where IBM also resides.
  • Quantumz0d - Monday, July 6, 2020 - link

    Tiahu is fucking Chinese Sunway Processor based Supercomputer and it's top #3 so what did they do ? jack off to Zen with Hygon or did they make all Chinese use Chinese made processors ? Stop that bullshit of Supercomputer nonsense, IBM has been there since ages and they had SMT8 with Power9 uarch which came in 2017 (Summit which is #2, it was first since 2018) what did they do ? x86 is consumer based and DC market is relying only on that. ARM DC market-share is less than fucking 2%, AMD is at 4.5%, Intel is at 95% that is 2019 Q4.

    I don't know why people hate x86 as if it's like their life is being threatened by them, the fact that x86 machines are able to run vast diverse rich software selection and more freedom based computing, people want ARM based proprietary dogshit more, Apple series trash wich their APIs or the Bootloader locked (much worse like chastity) or Unlocked Android phones, even with GNU GPL v2 and Qcomm's top OSS CAF the godddamned phones do not get latest updates or anything but a Core2Quad from decade ago can run a fucking Linux or Win7 / Win10 without any bullshit issue.

    Wait for the SPEC A series iPhone 12 benchmarks and then you be more proud of that garbage device which cannot compute anything outside what Apple deems it.
  • Wilco1 - Friday, July 3, 2020 - link

    It would be good to run benchmarks on the 2 variants of Galaxy Book S. One comparison I found:

    https://browser.geekbench.com/v5/cpu/compare/25848...

    So Lakefield wins by only 21% on single-threaded (that's a bad result given it is Cortex-A76 vs IceLake at similar clocks), and is totally outclassed on multithreaded...
  • lmcd - Sunday, July 5, 2020 - link

    Current scheduler doesn't even guarantee that's the Sunny Cove core.
  • Wilco1 - Monday, July 6, 2020 - link

    Given Tremont can't get anywhere near Cortex-A76 performance, we can be sure single-threaded result is the Sunny Cove core.
  • PaulHoule - Friday, July 3, 2020 - link

    This is an example of the "Innovator's Dilemma" scenario where it is harder to move upmarket (in terms of performance) than downmarket.

    Put a phone processor into a box with a fan and people will be blown away by how fast it is -- they've never seen an ARM processor cooled by a fan before.

    Put a desktop processor into a thin tablet with little thermal headroom and people will be blown away by how slow it is.

    So first it is a situation that Intel can't win, but second it is a disaster that this low performance (downmarket) chip is expensive to produce and has to be sold upmarket. Sure you can stick any number of dies together and "scale up" a package in a way that looks as if you scaled up the chip by reducing the feature size, but when you reduce the feature size the cost per feature goes down in the long term -- when you stick a bunch of cheap chips together you get an expensive chip.

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