Storage

SK Hynix today announced that they’ve begun sampling of its first ever PCIe 4.0 enterprise SSDs in the form of the new 96-layer 3D-NAND U.2/U.3 form-factor PE8010 and PE8030 eSSDs, as well as announcing plans to sample the new PE81111 EDSFF E1.L SSDs based on their 128-layer “4D NAND” flash modules later in the year. We had expected the new PE8111 eSSD for some time know as we reported about SK Hynix’s plans to introduce such a product last November. The biggest change here is the company’s use of new 128-layer 3D NAND modules that the company dubs as “4D-NAND” because of a new denser cell structure design and higher per-die I/O speeds. 16TB Enterprise EDSFF E1.L SSD The PE8111 still retains as PCIe 3.0 interface and...

KINGMAX Joins PCIe 4.0 SSD Club with PX4480 Drives

As AMD’s latest Ryzen 3000/X570 platforms with PCIe 4.0 support become more widespread on the market, SSD vendors are continuing to ramp up the releaes of their matching PCIe...

9 by Anton Shilov on 4/1/2020

Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter

As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...

9 by Anton Shilov on 4/1/2020

Best Consumer Hard Drives: Q1 2020

Data storage requirements have kept increasing over the last several years. While SSDs have taken over the role of the primary drive in most computing systems, hard drives continue...

34 by Ganesh T S on 3/30/2020

Dell & HPE Issue Updates to Fix 40K Hour Runtime Flaw in Enterprise SSDs

In a second SSD snafu in as many years, Dell and HPE have revealed that the two vendors have shipped enterprise drives with a critical firmware bug, one will...

47 by Anton Shilov on 3/27/2020

Greenliant Launches 1.92 TB M.2 Industrial SSDs

Greenliant revealed on Wednesday that it has started shipments of its new industrial-grade ArmourDrive M.2 SSDs. The enhanced-durability drives are rated to operate in a much wider range of...

2 by Anton Shilov on 3/27/2020

OWC Refreshes Mercury Elite Pro DAS: Up to 16 TB over USB 3.2

OWC has announced a new version of its Mercury Elite Pro DAS, the company's entry-level external storage box. The refreshed DAS can house one 3.5-inch hard drive, allowing it...

12 by Anton Shilov on 3/25/2020

GOODRAM Announces Entry-Level PX500 SSDs: Bringing NVMe to Budget Drives

As more SSD manufacturers introduce their inexpensive NVMe PCIe drives, the market of entry-level SSDs is slowly but surely moving away from SATA altogether. Case in point this week...

14 by Anton Shilov on 3/24/2020

TerraMaster D5 Thunderbolt 3: A ‘Mega DAS’ with 5 Bays for 80 TB

TerraMaster this week introduced its first DAS featuring a Thunderbolt 3 interface. The D5 Thunderbolt 3 DAS with five bays is aimed at professionals who need a vast storage...

13 by Anton Shilov on 3/20/2020

SanDisk Launches Max Endurance microSD Cards: 3 to 15 Years Warranty

In a world where NAND storage density, capacity, and low cost matter the most, key metrics that take a back seat include endurance and retention rates. For users who...

22 by Anton Shilov on 3/19/2020

Samsung Begins Mass Production of 512 GB eUFS 3.1 Storage: Up to 2.1 GB/s

Samsung has kicked off mass production of its new, high-performance eUFS 3.1 storage modules. Designed primarily with high-end smartphones in mind, the embedded storage drives offer some of Samsung's...

15 by Anton Shilov on 3/17/2020

Synology Unveils DiskStation DS220j Dual-Bay NAS: A Basic NAS For the Home

Coming in on the heels of TerraMaster's recently introduced entry-level dual-bay NAS, Synology has announced its own basic NAS, the DiskStation DS220j. Synology's latest NAS can store up to...

23 by Anton Shilov on 3/17/2020

Seagate Introduces IronWolf 510 M.2 NVMe SSDs for NAS Systems

Seagate was one of the first vendors to introduce SSDs targeting the consumer / SMB / SME NAS markets with the IronWolf SSD 110 series at the 2019 CES...

11 by Ganesh T S on 3/17/2020

Intel & Micron Sign New 3D XPoint Wafer Supply Agreement

Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as...

20 by Anton Shilov on 3/16/2020

GlobalFoundries & Everspin Extend MRAM Pact to 12nm

GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...

4 by Anton Shilov on 3/13/2020

Micron Develops uMCP with LPDDR5 & 96L 3D NAND for Midrange 5G Smartphones

Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device...

11 by Anton Shilov on 3/11/2020

Buffalo Launches Miniature Rugged External SSD w/ USB Type-A & Type-C

SSDs can survive drops and other kinds of hostile treatment much better than hard drives, but they can still be broken if their PCB or one of the chips...

24 by Anton Shilov on 3/6/2020

SSSTC Launches CL1 M.2-2230 SSD: SMI, Up to 512 GB, Up to 2 GB/s

As notebooks are getting thinner and smaller, PC manufacturers require smaller components and therefore demand tinier SSDs as well as densely-packed SoCs. BGA SSDs are of course among the...

5 by Anton Shilov on 3/5/2020

Western Digital Introduces WD Gold Enterprise SSDs

On what would have been the first day of the Open Compute Project's annual Global Summit, Western Digital is bringing out a new line of enterprise SSDs. The WD...

20 by Billy Tallis on 3/4/2020

UFS 3.1 Storage Devices for Smartphones Unveiled by Kioxia & Western Digital

Less than a month after JEDEC published its UFS 3.1 specification, Kioxia and Western Digital have introduced their first UFS 3.1-compliant storage devices for smartphones. Samples of Kioxia’s UFS...

6 by Anton Shilov on 3/2/2020

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