Lakefield

In 2019 we were exposed to the first foldable display smartphones and wearables, with the Samsung Galaxy Fold, Huawei Mate X, and Xiaomi Mi Mix all demonstrating various themes of a foldable display in a hand-held device. Two of the main concerns with those devices is longevity of a display opened 50+ times a day, and durability if the display is on the outside. Clamshell Notebooks arguably don’t have those restrictions, so it makes sense to bring the technology to something more for business use (especially with the costs). Enter Lenovo’s ThinkPad X1 Fold.

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

13 by Dr. Ian Cutress on 1/3/2020

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

Samsung Develops Intel Lakefield-Based Galaxy Book S: Always-Connected x86 PC

Among several items at its developers conference this week, Samsung revealed that it was working on a version of its always-connected Galaxy Book S laptop powered by Intel’s Lakefield...

29 by Anton Shilov on 10/31/2019

Intel's new Atom Microarchitecture: The Tremont Core in Lakefield

While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many...

101 by Dr. Ian Cutress on 10/24/2019

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...

31 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 (2019) Programme Announced: Zen, Navi, POWER, Lakefield, Gen-Z, Turing, Lisa Su Keynote

There are two trade shows every year that I love. Computex in June is great, because the scale of the industry it covers, and Taipei is a wonderful location...

17 by Ian Cutress on 5/16/2019

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...

10 by Ian Cutress on 1/7/2019

Intel’s Keynote at CES 2019: 10nm, Ice Lake, Lakefield, Snow Ridge, Cascade Lake

This year it seems that Intel is finally ready to talk about 10nm. After next-to-nothing on the subject at CES 2018, Intel is now talking about three new processor...

61 by Ian Cutress on 1/7/2019

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