Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros is to have a base ‘interposer’ that also integrates common I/O functionality, while using connections through the chip to another piece of silicon on top that has the CPU cores and the graphics subsystem. We saw chips that were working and processing data, and it all looked really cool. The reason this chip exists is because one of Intel’s customers requested a processor with integrated graphics that can idle at 2 milliwatts. After a few years of engineering, Intel is finally there. There’s also another trick at play here. The chip uses a combination of Intel’s high...

Intel’s Keynote at CES 2019: 10nm, Ice Lake, Lakefield, Snow Ridge, Cascade Lake

This year it seems that Intel is finally ready to talk about 10nm. After next-to-nothing on the subject at CES 2018, Intel is now talking about three new processor...

60 by Ian Cutress on 1/7/2019

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