Lakefield

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is called Foveros, and today we have a talk on the chip.

Hot Chips 31 (2019) Programme Announced: Zen, Navi, POWER, Lakefield, Gen-Z, Turing, Lisa Su Keynote

There are two trade shows every year that I love. Computex in June is great, because the scale of the industry it covers, and Taipei is a wonderful location...

17 by Ian Cutress on 5/16/2019

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...

10 by Ian Cutress on 1/7/2019

Intel’s Keynote at CES 2019: 10nm, Ice Lake, Lakefield, Snow Ridge, Cascade Lake

This year it seems that Intel is finally ready to talk about 10nm. After next-to-nothing on the subject at CES 2018, Intel is now talking about three new processor...

61 by Ian Cutress on 1/7/2019

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