Lakefield

For the past eighteen months, Intel has paraded its new ‘Lakefield’ processor design around the press and the public as a paragon of new processor innovation. Inside, Intel pairs one of its fast peak performance cores with four of its lower power efficient cores, and uses novel technology in order to build the processor in the smallest footprint it can. The new Lakefield design is a sign that Intel is looking into new processor paradigms, such as hybrid processors with different types of cores, but also different stacking and packaging technologies to help drive the next wave of computing. With this article, we will tell you all you need to know about Lakefield.

Intel Discloses Lakefield CPUs Specifications: 64 Execution Units, up to 3.0 GHz, 7 W

Over the past 12 months, Intel has slowly started to disclose information about its first hybrid x86 platform, Lakefield. This new processor combines one ‘big’ CPU core with four...

79 by Dr. Ian Cutress on 6/10/2020

Samsung Unveils Intel-based Galaxy Book S: Intel’s Lakefield Inbound

Samsung this morning is taking the wraps off of the long-awaited Intel (x86) version of the company’s popular ultraportable, always-connected laptop, the Galaxy Book S. First teased by Samsung...

49 by Ryan Smith on 5/29/2020

Lenovo’s ThinkPad X1 Fold: Combining Foldable Displays, 5G and Lakefield into a… Laptop?

In 2019 we were exposed to the first foldable display smartphones and wearables, with the Samsung Galaxy Fold, Huawei Mate X, and Xiaomi Mi Mix all demonstrating various themes...

16 by Dr. Ian Cutress on 1/6/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

Samsung Develops Intel Lakefield-Based Galaxy Book S: Always-Connected x86 PC

Among several items at its developers conference this week, Samsung revealed that it was working on a version of its always-connected Galaxy Book S laptop powered by Intel’s Lakefield...

29 by Anton Shilov on 10/31/2019

Intel's new Atom Microarchitecture: The Tremont Core in Lakefield

While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many...

101 by Dr. Ian Cutress on 10/24/2019

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...

31 by Dr. Ian Cutress on 8/20/2019

Hot Chips 31 (2019) Programme Announced: Zen, Navi, POWER, Lakefield, Gen-Z, Turing, Lisa Su Keynote

There are two trade shows every year that I love. Computex in June is great, because the scale of the industry it covers, and Taipei is a wonderful location...

17 by Ian Cutress on 5/16/2019

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...

10 by Ian Cutress on 1/7/2019

Intel’s Keynote at CES 2019: 10nm, Ice Lake, Lakefield, Snow Ridge, Cascade Lake

This year it seems that Intel is finally ready to talk about 10nm. After next-to-nothing on the subject at CES 2018, Intel is now talking about three new processor...

61 by Ian Cutress on 1/7/2019

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