Memory

G.Skill has launched a new series of memory module kits optimized for Intel’s new 8th Generation Core processors. The new DIMMs belong to G.Skill’s Trident Z and Trident Z RGB families and are guaranteed to operate at 3733 – 4600 MT/s data transfer rates when paired with Intel's Coffee Lake processors. Some of the modules need significantly increased voltages and thus require higher-end motherboards that can deliver “clean” power. Getting right down to business, the fact that G.Skill even announced memory kits specifically for Coffee Lake got an eyebrow raise out of us. At first blush, it seemed like a marketing stunt, especially since they're using the same Samsung’s B-die chips that they've been using for some time now. But according to the company, Coffee...

Corsair Weds RGB Lighting and White Heat Spreaders in Vengeance RGB White DDR4 DIMMs

Corsair has once again expanded its lineup of Vengeance RGB memory modules, this time with a new series of white DIMMs that incorporate RGB lighting. Dubeed the Vengeance RGB...

35 by Anton Shilov on 9/30/2017

Memory Scaling on Ryzen 7 with Team Group's Night Hawk RGB

A large number of column inches have been put towards describing and explaining AMD's new underlying scalable interconnect: the Infinity Fabric. A superset of HyperTransport, this interconnect is designed...

64 by Ian Cutress & Gavin Bonshor on 9/27/2017

GSkill Announces New AMD Compatible Trident Z RGB Kits

With both AMD Ryzen and Threadripper platforms continuing to mature, we’ve seen an increase in the two platform’s ability to handle higher capacity and faster RAM and be stable...

13 by Joe Shields on 9/22/2017

Corsair Announces 16GB DDR4-4600 Vengeance LPX DRAM Kits

Corsair on Thursday announced two fresh Vengeance LPX memory kits that set new performance records for the product family. The new dual-channel memory kits are intended for Intel’s Kaby...

16 by Anton Shilov on 9/15/2017

G.Skill Ups the Ante on Memory Speed and Voltage: 16 GB DDR4-4600 1.5v Kit for Kaby Lake-X

G.Skill on Friday introduced its fastest dual-channel memory kit designed specifically for Intel’s Kaby Lake-X processors and Intel’s X299 HEDT platforms. The new Trident Z DDR4-4600 DIMMs not only...

14 by Anton Shilov on 9/8/2017

Longsys Acquires Lexar Brand from Micron

Longsys on Thursday announced that it has acquired the Lexar brand name from Micron. The China-based supplier of NAND flash memory-based products will use the trademark to sell Lexar’s...

5 by Anton Shilov on 9/1/2017

Samsung & SK Hynix Graphics Memory Prices Increase Over 30% In August

In the midst of a global DRAM shortage, Digitimes reports that the market prices for graphics memory from Samsung and SK Hynix have increased by over 30% for August...

54 by Nate Oh on 8/16/2017

Geil Announces EVO Spear Series DRAM: Up to DDR4-3466

Geil recently announced the availability of its new EVO Spear series of memory, with kits labeled specifically for either Intel and AMD Ryzen based systems. Geil states the EVO...

6 by Joe Shields on 8/15/2017

G.Skill Unwraps Flare X 32 GB and 128 GB DDR4 Kits for AMD Threadripper: Up to 3600 MT/s

G.Skill has announced its lineup of DDR4 memory kits compatible with AMD’s new Ryzen Threadripper CPUs. The Flare X quad-channel kits are offered in 32 GB and 128 GB...

24 by Anton Shilov on 8/11/2017

SK Hynix: Customers Willing to Pay 2.5 Times More for HBM2 Memory

SK Hynix was the first DRAM manufacturer to start producing HBM Gen 1 memory in high volume back in 2015. However, the company is somewhat behind its rival Samsung...

23 by Anton Shilov on 8/4/2017

EagleTree and Partners Acquire Majority Stake in Corsair for $525 Million

EagleTree Capital, the Investment Management Corp. of Ontario (IMCO), and the Honeywell pension fund on Wednesday announced that they had reached an agreement to acquire a majority stake in...

7 by Anton Shilov on 7/27/2017

Samsung Increases Production Volumes of 8 GB HBM2 Chips Due to Growing Demand

Samsung on Tuesday announced that it is increasing production volumes of its 8 GB, 8-Hi HBM2 DRAM stacks due to growing demand. In the coming months the company’s 8...

34 by Anton Shilov on 7/19/2017

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...

6 by Anton Shilov on 7/14/2017

Patriot Publishes List of AMD Ryzen Compatible DIMMs: Up to DDR4-3400, 64 GB

Patriot has published a list of its memory modules that are verified and compatible with AMD Ryzen processors. This includes the Viper 4 and Viper Elite modules that are...

3 by Anton Shilov & Joe Shields on 7/13/2017

Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND

Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...

17 by Anton Shilov on 7/6/2017

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...

36 by Anton Shilov on 7/3/2017

G.Skill Announces Quad-Channel DDR4-4200 Kit for Intel Skylake-X CPUs

G.Skill this past week has formally announced its quad-channel memory kits designed for the latest Intel Core i7 (Skylake-X) CPUs and the Intel X299 platform. The flagship 64 GB...

11 by Anton Shilov on 6/29/2017

Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products

Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...

18 by Anton Shilov on 6/28/2017

Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip

Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital...

22 by Anton Shilov on 6/28/2017

Log in

Don't have an account? Sign up now