Memory

Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s 7 nm process technology, and is designed to enable SoC developers to begin on their DDR5 memory subsystems now and get them to market in 2019-2020, depending on high-volume DDR5 availability. At a special event, Cadence teamed up with Micron to demonstrate their DDR5 DRAM subsystem. In the meantime, Micron has started to sample its preliminary DDR5 chips to interested parties. DDR5-4400 Initially, DDR5-6400 Eventually Cadence’s DDR5 memory controller and PHY achieve a 4400 MT/s data rate with CL42 using Micron’s prototype 8 Gb DDR5 memory chips. Compared to DDR4 today, the supply voltage of DDR5 is...

Mini-Jellyfish: ADATA Launches XPG Spectrix D80 DDR4 RGB Memory

ADATA has started shipments of its new memory modules that feature hybrid air and liquid-based cooling systems along with RGB lighting. The new XPG Spectrix D80 DDR4 RGB modules...

28 by Anton Shilov on 5/2/2018

HyperX Now Shipping Predator DDR4 RGB with IR Sync

Back in January during CES week, Hyper X announced new Predator DDR4 which includes IR communication channels in each of their modules allowing multiple modules to synchronize their LED...

3 by Joe Shields on 4/30/2018

Chinese DRAM Industry Spreading Its Wings: Two More DRAM Fabs Ready

Two more DRAM makers based in China, Innotron Memory and Fujian Jin Hua Integrated Circuit, are gearing up for volume production of computer memory in the coming month. Both...

20 by Anton Shilov on 4/25/2018

Corsair Unveils "Pearlescent White" Dominator Platinum Special Edition Contrast DIMMs

Corsair this week introduced its new Dominator Platinum series memory modules designed for modders and enthusiasts primarily interested in style. The new Dominator Platinum Special Edition Contrast DDR4 DIMMs...

11 by Anton Shilov on 4/13/2018

Micron Starts Construction of Its Third NAND Fab in Singapore

Micron this week broke ground on its new fab in Singapore that will be dedicated to manufacturing 3D NAND flash memory. Set to be completed late next year, Micron...

11 by Anton Shilov on 4/6/2018

Samsung Demos 64 GB RDIMM Based on 16 Gb Chips, Promises 256 GB LRDIMMs

Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...

11 by Anton Shilov on 3/22/2018

Power Outage at Samsung’s Fab Destroys 3.5% of Global NAND Flash Output For March

A half-hour power outage at Samsung’s fab near Pyeongtaek, South Korea, disrupted production and damaged tens of thousands of processed wafers. Media reports claim that the outage destroyed as...

62 by Anton Shilov on 3/16/2018

Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek

Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands, and if unofficial...

16 by Anton Shilov on 3/1/2018

Apacer Adds DDR4-3600 CL17 and DDR4 3466 CL16 Memory to Commando Series

The new Apacer Commando series DDR4 comes in 16 GB (2x8GB) dual-channel kits with frequencies reaching up to DDR4-3466 CL16 and DDR4-3600 CL17. The sticks were announced late last...

13 by Joe Shields on 2/26/2018

Chinese Xi’an UniIC Semiconductors Starts to Sell DDR4 Chips and Modules

Xi’an UniIC Semiconductors, a memory producer based in China, has started to sell DDR4 DRAM chips and modules that were developed and made in-house. This is the first time...

30 by Anton Shilov on 2/24/2018

Gen-Z Interconnect Core Specification 1.0 Published

The first major release of the Gen-Z systems interconnect specification is now available. The Gen-Z Consortium was publicly announced in late 2016 and has been developing the technology as...

22 by Billy Tallis on 2/13/2018

SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs

SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...

9 by Anton Shilov on 2/6/2018

SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs

SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...

14 by Anton Shilov on 1/25/2018

Samsung Updates on GDDR6 Portfolio: 8 Gb and 16 Gb at Multiple Speeds

Samsung has issued an update to the GDDR6 announcement earlier this month. The company’s GDDR6 lineup will include chips featuring 8 Gb and 16 Gb capacities as well as...

19 by Anton Shilov on 1/25/2018

Micron, Rambus, & Others Team Up To Spur GDDR6 Adoption in Non-GPU Products

For regular AnandTech readers, the drums of GDDR6 have been beating loudly for most of the last year now. The new memory standard replaces the venerable GDDR5 memory, which...

15 by Ryan Smith on 1/23/2018

HyperX at CES 2018: Predator DDR4 with IR Sensors for Better RGB Sync

HyperX announced it has designed IR communication channels into each of their new HyperX Predator DDR4 RGB modules which will allow multiple modules to sync in LED lighting. In...

10 by Joe Shields on 1/19/2018

Samsung Starts Mass Production of 16Gb GDDR6 Memory ICs with 18 Gbps I/O Speed

This week, Samsung has announced that it has started mass production of its GDDR6 memory chips for next-generation graphics cards and other applications. The new chips will be available...

27 by Anton Shilov on 1/18/2018

ADATA at CES 2018: Jellyfish DRAM

LAS VEGAS, NV – Over the years, DRAM heatsinks have gone from non-existent, to gaudy, to death traps with jagged edges, to some form of LED hell. In the...

19 by Ian Cutress on 1/16/2018

Samsung Starts Production of HBM2 “Aquabolt” Memory: 8 GB, 2.4 Gbps

Samsung this week announced that it had started mass production of its second-generation HBM2 memory code-named “Aquabolt”. The new memory devices have 8 GB capacity and operate at 2.4...

17 by Anton Shilov on 1/11/2018

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