FOVEROS

In 2019 we were exposed to the first foldable display smartphones and wearables, with the Samsung Galaxy Fold, Huawei Mate X, and Xiaomi Mi Mix all demonstrating various themes of a foldable display in a hand-held device. Two of the main concerns with those devices is longevity of a display opened 50+ times a day, and durability if the display is on the outside. Clamshell Notebooks arguably don’t have those restrictions, so it makes sense to bring the technology to something more for business use (especially with the costs). Enter Lenovo’s ThinkPad X1 Fold.

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

Intel’s Xe for HPC: Ponte Vecchio with Chiplets, EMIB, and Foveros on 7nm, Coming 2021

Today is Intel’s pre-SC19 HPC Devcon event, and with Raja Koduri on stage, the company has given a small glimpse into its high-performance compute accelerator strategy for 2021. Intel...

16 by Dr. Ian Cutress on 11/17/2019

Hot Chips 31 Live Blogs: Intel Lakefield and Foveros

One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...

31 by Dr. Ian Cutress on 8/20/2019

Intel Details Manufacturing through 2023: 7nm, 7+, 7++, with Next Gen Packaging

At Intel's Investor Day today, CEO Bob Swan and Murthy Renduchintala spoke to the ability of the company with respect to its manufacturing capabilities. Intel has historically been strong...

237 by Ian Cutress & Anton Shilov on 5/8/2019

Intel's Interconnected Future: Combining Chiplets, EMIB, and Foveros

While Intel works on getting its main manufacturing process technology on track, it is spending just as much time and effort in researching and developing the rest of the...

117 by Ian Cutress on 4/17/2019

CES 2019 Quick Bytes: Intel’s 10nm Hybrid x86 Foveros Chip is Called Lakefield

At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...

10 by Ian Cutress on 1/7/2019

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