While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many commercial verticals. Last year at Intel’s Architecture Summit, the company unveiled an extended roadmap showing the next three generations of Atom following Goldmont Plus: Tremont, Gracemont, and ‘Future Mont’. Tremont is set to be launched this year, coming first in a low powered hybrid x86 design called Lakefield for notebooks, and using a new stacking technology called Foveros built on 10+ nm. At the Linley Processor Conference today, Intel unveiled more about the microarchitecture behind Tremont.
Intel has already disclosed that it will have a next generation Atom core, code named Tremont, which is to appear in products such as the Foveros-based hybrid Lakefield, as...67 by Dr. Ian Cutress on 7/15/2019
At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...10 by Ian Cutress on 1/7/2019
Intel has recently updated its developer documentation for instruction set extensions, and in the process has disclosed information on both new instructions for and the codename of its next-generation...56 by Anton Shilov on 4/23/2018