CPUs

Samsung this morning is taking the wraps off of the long-awaited Intel (x86) version of the company’s popular ultraportable, always-connected laptop, the Galaxy Book S. First teased by Samsung late last year, the Intel-based version of the laptop is set to join their existing Qualcomm 8cx-based model, swapping out the Arm SoC for Intel’s latest foray into ultra-mobile processors, Lakefield. The Intel Galaxy Book S will be the first device to ship with Lakefield, putting the new processor to the test in seeing if Intel can match the kind of all-day battery life that the existing Galaxy Book S is known for. As a quick refresher, for the last couple of years now we’ve been reporting on Intel’s forthcoming die stacked CPU, codenamed Lakefield. Officially...

TRX80 and WRX80 Don’t Exist: Neither Does the ‘Intel LGA1159’ Socket

For anyone that isn’t following the minutiae of desktop computing, one of the more prominent rumors in AMD land is the presence of upcoming sockets called TRX80 and WRX80...

48 by Dr. Ian Cutress on 1/13/2020

I Ran Off with Intel’s Tiger Lake Wafer. Who Wants a Die Shot?

One of the surprises at CES from Intel was the presence of Tiger Lake, Intel’s next generation platform beyond Ice Lake. Tiger Lake is Intel’s vehicle for delivering the...

107 by Dr. Ian Cutress on 1/13/2020

Intel: 28 W Ice Lake Core i7-1068G7 Coming Q1

One of most frequent questions I’ve had in my personal inbox over the last few weeks has been questioning the existence of the fastest Ice Lake processor. Back when...

186 by Dr. Ian Cutress on 1/10/2020

AMD at CES 2020: Q&A with Dr. Lisa Su

This week AMD took the wraps off of its latest generation of mobile processors. The company is being aggressive, offering up to eight cores for both the traditional ultra-portable...

93 by Dr. Ian Cutress on 1/7/2020

Intel CES 2020 Keynote Live Blog: Ice, Comets, and Tigers To Come

We're here at the Mandalay Bay Convention Center for Intel's CES 2020 keynote. Intel always makes their CES presentations exciting affairs, and we're expecting much the same this year...

26 by Ryan Smith & Gavin Bonshor on 1/6/2020

AMD Ryzen 4000 Mobile APUs: 7nm, 8-core on both 15W and 45W, Coming Q1

At last year’s CES, AMD showcased its then Ryzen 3000 mobile processors as part of the announcements. In what is becoming a trend, at this year’s CES, the company...

406 by Dr. Ian Cutress on 1/6/2020

AMD’s 64-Core Threadripper 3990X, only $3990! Coming February 7th

At the tail end of last year, one of the key launches in the creator/workstation processor market was AMD’s latest 3rd Generation Threadripper portfolio, which started with 24-core and...

109 by Dr. Ian Cutress on 1/6/2020

AMD Keynote Presentation Press Event at CES 2020: The AnandTech Live Blog

We're here ready to Live Blog the annual CES keynote from AMD. We expect to see Lisa Su, Frank Azor, and others take to the stage to discuss what's...

19 by Dr. Ian Cutress & Gavin Bonshor on 1/6/2020

Intel at CES 2020: 45W 10th Gen Mobile CPUs Soon, Tiger Lake with Xe Graphics Later

As we move into 2020, there is a lot of talk about what Intel’s 2020 plans will be. Discussions about the expansion of Intel’s 10nm process node products, such...

57 by Dr. Ian Cutress on 1/6/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

15 by Dr. Ian Cutress on 1/3/2020

How to Tarnish Platinum: Sell It as Xeon 9200

in 2019, Intel announced its Cascade Lake family of enterprise processors, and sitting at the top of the stack was the Cascade Lake-AP family: a quartet of parts that...

99 by Dr. Ian Cutress on 1/2/2020

An Interview with AMD’s CTO Mark Papermaster: ‘There’s More Room At The Top’

On the back of a very busy 2019, AMD is gaining market share and is now a performance leader in a lot of CPU segments. The company has executed...

68 by Dr. Ian Cutress on 12/30/2019

AnandTech Year In Review 2019: Lots of CPUs

Throughout 2019, we’ve had quite the reverse of performance when it comes to the competitiveness of the modern performance-oriented desktop processor. This year we’ve seen AMD introduce its Zen...

25 by Dr. Ian Cutress on 12/27/2019

Western Digital Rolls-Out Two New SweRV RISC-V Cores For Microcontrollers

Western Digital has added two new processor cores — the SweRV Core EH2 and the SweRV Core EL2 — into its SweRV portfolio of microcontroller CPUs. And, keeping in...

9 by Anton Shilov on 12/13/2019

The Microsoft Surface Laptop 3 Showdown: AMD's Ryzen Picasso vs. Intel's Ice Lake

Occasionally the stars align. It is very rare in the laptop space that we're able to test two devices, with two very different CPU platforms, with the fewest number...

174 by Brett Howse & Andrei Frumusanu on 12/13/2019

Samsung to Use SiFive RISC-V Cores for SoCs, Automotive, 5G Applications

At the annual RISC-V Summit this week, Samsung disclosed the use SiFive’s RISC-V cores for upcoming chips for a variety of applications. The company is joining a growing list...

18 by Anton Shilov on 12/12/2019

Early TSMC 5nm Test Chip Yields 80%, HVM Coming in H1 2020

Today at the IEEE IEDM Conference, TSMC is presenting a paper giving an overview of the initial results it has achieved on its 5nm process. This process is going...

62 by Dr. Ian Cutress on 12/11/2019

EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look

One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...

29 by Dr. Ian Cutress on 12/11/2019

Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this...

137 by Dr. Ian Cutress on 12/11/2019

Intel: Lakefield in 2020, Possible 5G on Foveros

At the IEEE International Electron Devices Meeting (IEDM) 2019, Intel had two package integration presentations, one on its Omni-Directional Interconnect and one on its 3D stacking Foveros technology. In...

37 by Dr. Ian Cutress on 12/11/2019

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