CPUs
Samsung this morning is taking the wraps off of the long-awaited Intel (x86) version of the company’s popular ultraportable, always-connected laptop, the Galaxy Book S. First teased by Samsung late last year, the Intel-based version of the laptop is set to join their existing Qualcomm 8cx-based model, swapping out the Arm SoC for Intel’s latest foray into ultra-mobile processors, Lakefield. The Intel Galaxy Book S will be the first device to ship with Lakefield, putting the new processor to the test in seeing if Intel can match the kind of all-day battery life that the existing Galaxy Book S is known for. As a quick refresher, for the last couple of years now we’ve been reporting on Intel’s forthcoming die stacked CPU, codenamed Lakefield. Officially...
AMD’s New EPYC 7F52 Reviewed: The F is for ᴴᴵᴳᴴ Frequency
Everyone wants a fast processor. The ability to get more stuff done is one of a number of guiding principles of business. However, business also needs consistency, safety and...
100 by Dr. Ian Cutress on 4/14/2020
AMD’s Mobile Revival: Redefining the Notebook Business with the Ryzen 9 4900HS (A Review)
At every turn in the story of AMD’s notebook portfolio, we’ve been there to document the highs and lows. Five years ago, AMD was definitely suffering from a combination...
261 by Dr. Ian Cutress on 4/9/2020
AMD Drops StoreMI Software; Developing New Software for Later This Quarter
In a blink-and-you’ll-miss-it moment, AMD quietly dropped distribution and support for the company’s StoreMI software at the start of this month. The technology, launched back in 2018, was AMD’s...
18 by Ryan Smith on 4/6/2020
Intel Details 10th Gen Comet Lake-H for 45 W Notebooks: Up to 5.3 GHz*
Two of the big announcements out of CES this year were both mobile related: Intel and AMD announced they would be launching new gaming laptop processors into the market...
158 by Dr. Ian Cutress on 4/2/2020
Intel H81 Chipset EOL'd: Long Lived Haswell Chipset to be Retired
Intel has announced that it will be discontinuing some of its Lynx Point based chipsets which are most commonly associated with its Haswell processors on socket LGA 1150. Along...
6 by Gavin Bonshor on 4/1/2020
Intel Updates ISA Manual: New Instructions for Alder Lake, also BF16 for Sapphire Rapids
As with any processor vendor, having a detailed list of what the processor does and how to optimize for it is important. Helping programmers also plan for what’s coming...
34 by Dr. Ian Cutress on 4/1/2020
Intel’s new ‘Single Customer’ Ice Lake Mobile CPUs: Are These in the Macbook Air?
It was recently brought to our attention that three new Ice Lake CPUs were listed on Intel’s online ARK database of products: the Core i7-1060NG7, the Core i5-1030NG7, and...
38 by Dr. Ian Cutress on 3/25/2020
Microsoft Now Offers Azure NVv4 Virtual Machines with AMD EPYC & Radeon Instinct
AMD’s 2nd Generation EPYC processors have gained a strong recognition among cloud computing companies, and today numerous instances are powered by AMD’s latest server CPUs. By contrast, however, the...
19 by Anton Shilov on 3/18/2020
Intel’s Cooper Lake Plans: The Chip That Wasn’t Meant to Exist, Fades Away
Following an exclusive report from SemiAccurate, and confirmed by Intel through ServeTheHome, the news on the wire is that Intel is set to can wide-spread general availability to its...
41 by Dr. Ian Cutress on 3/17/2020
AMD Details Renoir: The Ryzen Mobile 4000 Series 7nm APU Uncovered
The notebook market has not been kind to AMD over the last decade – for a long, long time the company was only ever seen as the discount option...
94 by Dr. Ian Cutress on 3/16/2020
AMD Announces Ryzen 9 4900H and 4900HS: The Halo 35 W and 45 W Mobile APUs
As part of the disclosures on AMD’s Ryzen Mobile 4000 portfolio, the company is also lifting the lid on perhaps one of the worst kept secrets in mobile computing...
37 by Dr. Ian Cutress on 3/16/2020
Marvell Announces ThunderX3: 96 Cores & 384 Thread 3rd Gen Arm Server Processor
The Arm server ecosystem is well alive and thriving, finally getting into serious motion after several years of false-start attempts. Among the original pioneers in this space was Cavium...
45 by Andrei Frumusanu on 3/16/2020
AMD Drop's Ryzen 3000 Pricing By Up to $50: Official Price Drop Until 31st March
AMD has started a new promotion and will sell its latest 3rd Generation Ryzen desktop processors with a noticeable discount for a few weeks. The campaign is effective worldwide...
32 by Anton Shilov on 3/13/2020
New Comet Lake Mobile CPU Spotted in Intel Documents: Core i7-10810U
Intel today published a new Product Change Notification today stating that it has started using an additional Assembly, Test, and Finish site to build its mobile Comet Lake CPUs...
22 by Anton Shilov on 3/13/2020
Load Value Injection: A New Intel Attack Bypasses SGX with Significant Performance Mitigation Concerns
Microarchitectural attacks have been all the rage. For the past two years, we’ve seen attacks like Meltdown, Spectre, Foreshadow/L1TF, Zombieload, and variants all discuss different ways to probe or...
43 by Dr. Ian Cutress on 3/11/2020
Amazon's Arm-based Graviton2 Against AMD and Intel: Comparing Cloud Compute
It’s been a year and a half since Amazon released their first-generation Graviton Arm-based processor core, publicly available in AWS EC2 as the so-called 'A1' instances. While the processor...
92 by Andrei Frumusanu on 3/10/2020
AMD Financial Analyst Day 2020 Round-Up: Laying A Path For Bigger & Better Things
AMD’s first Financial Analyst Day since 2017 has just wrapped up. In the last three years AMD has undergone a dramatic change, launching its Zen CPU architecture, and greatly...
54 by Ryan Smith on 3/5/2020
AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified
As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with...
35 by Dr. Ian Cutress on 3/5/2020
Updated AMD Ryzen and EPYC CPU Roadmaps March 2020: Milan, Genoa, and Vermeer
Everyone is interested in roadmaps – they give us a sense of an idea of what is coming in the future, and for the investors, it gives a level...
60 by Dr. Ian Cutress on 3/5/2020
AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D
One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...
11 by Dr. Ian Cutress on 3/5/2020
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