CPUs
AMD has accidentally published its Product Master list - a list with all of its consumer, enterprise, and OEM parts listed. In the latest publication, it reveals multiple CPUs that could potentially be released in the future. The document, which is dated September 2019, indicates that AMD may be mulling to launch its Ryzen 7 3750X product with a 105 W TDP, though does not disclose its specifications or if it is OEM-only. From AMD's Master Product Document As the product number suggests, AMD’s Ryzen 7 3750X will sit between the eight-core Ryzen 7 3800X and the eight-core Ryzen 7 3700X, which leads to a suggestion that we are dealing with another eight-core CPU with SMT. Meanwhile, the base frequency difference between the Ryzen 7 3700X...
AMD: Next Gen Threadripper and Ryzen 9 3950X, Coming November
In a shock email late on Friday, AMD has released a statement to clarify the situation it is in with the manufacturing of its latest Ryzen processors. And, depending...
82 by Dr. Ian Cutress on 9/20/2019
Intel Core i9-9900KS TDP Details: ASUS Maximus XI Apex Support
Intel announced plans to launch its eight-core Core i9-9900KS processor along with its performance specifications quite a while ago, but the company did not disclose the TDP. As the...
47 by Anton Shilov on 9/18/2019
AMD’s New 280W 64-Core Rome CPU: The EPYC 7H12
If there’s something that gets everyone excited, it is more performance. On the Enterprise side, AMD has made big strides with its latest EPYC processor stack, featuring up to...
54 by Dr. Ian Cutress on 9/18/2019
Reaching for Turbo: Aligning Perception with AMD’s Frequency Metrics
For those that keep a close eye on consumer hardware, AMD recently has been involved in a minor uproar with some of its most vocal advocates about the newest...
144 by Dr. Ian Cutress on 9/17/2019
Intel’s Next-Generation ‘Cascade Lake-X’ HEDT CPUs Due in October
Intel said Wednesday that its next-generation codenamed Cascade Lake-X processors for high-end desktops will be revealed next month. The company says that the new CPUs will provide a significant...
64 by Anton Shilov on 9/4/2019
Intel to Launch Core i9-9900KS Next Month: 5 GHz on All Cores
At its pre-IFA press event, Intel confirmed that its new enthusiast-class Core i9-9900KS processor will launch in October. The CPU will be very similar to the Core i9-9900K introduced...
32 by Anton Shilov on 9/4/2019
Intel’s LGA4189-4 and LGA4189-5 for Cooper Lake & Ice Lake CPUs Now Available
TE Connectivity, a maker of various connectivity solutions, has introduced its newly-developed LGA4189 sockets for Intel’s next-generation Xeon Scalable processors supporting PCIe Gen 4. The products have been validated...
31 by Anton Shilov on 9/2/2019
AMD Bulldozer 'Core' Lawsuit: AMD Settles for $12.1m, Payouts for Some
AMD this month has agreed to pay compensation that totals $12.1 million to users who purchased FX-8000/9000 CPUs via its website or in the state of California. The case...
78 by Anton Shilov on 8/28/2019
Intel Launches Comet Lake-U and Comet Lake-Y: Up To 6 Cores for Thin & Light Laptops
Capping off a busy few weeks for processors for Intel, today the company is announcing the second half of their product stack for their low-power 10th generation Core processors...
133 by Ryan Smith on 8/21/2019
Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon
The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.
5 by Dr. Ian Cutress on 8/20/2019
Hot Chips 31 Live Blogs: Intel/Tsinghua Xeon Jintide Security CPU
Doing custom x86 CPUs is nothing new: presenting one at Hot Chips is new. Here we have Tsinghua University giving a presentation on Jintide, its custom solution built upon...
9 by Dr. Ian Cutress on 8/20/2019
Hot Chips 31 Live Blogs: Intel Lakefield and Foveros
One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is...
31 by Dr. Ian Cutress on 8/20/2019
Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...
9 by Dr. Ian Cutress on 8/20/2019
Hot Chips 31 Keynote Day 1: Dr. Lisa Su, CEO of AMD Live Blog (1:45pm PT)
The keynote for day one at Hot Chips is from Dr. Lisa Su, AMD of CEO. AMD is riding high after successful Ryzen 3000 and 2nd Gen EPYC Rome...
21 by Dr. Ian Cutress on 8/19/2019
Hot Chips 31 Live Blogs: IBM's Next Generation POWER
We're here at Hot Chips 31 / 2019, and the first talk to be live blogged is IBM's newest variant of its POWER CPUs. This talk starts at 10am...
17 by Dr. Ian Cutress on 8/19/2019
Retailers Begin to Sell Pre-Binned AMD Ryzen 3000 CPUs
For many PC enthusiasts, overclocking means a lot of fun, both in terms of process and the end result. To a large degree overclocking is a lottery that is...
40 by Anton Shilov on 8/14/2019
The Biostar A10N-8800E Motherboard Review: Carrizo in 2019?!
The Biostar A10N-8800 motherboard is a mini-ITX SoC option with an integrated AMD FX-8800P processor. Also featured is support for up to 32 GB of DDR4-2133 memory, a single...
74 by Dr. Ian Cutress & Gavin Bonshor on 8/14/2019
AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked
If you examine the CPU industry and ask where the big money is, you have to look at the server and datacenter market. Ever since the Opteron days, AMD's...
184 by Johan De Gelas on 8/7/2019
The AMD 2nd Gen EPYC "Rome" Launch Live Blog
The second – and arguably largest – shoe in the Zen 2 launch is dropping today: AMD’s EPYC 7002-series “Rome” processor. Based on all the things that made 3rd...
28 by Ryan Smith on 8/7/2019
Rick Bergman Returns to AMD to Lead Computing & Graphics Business
AMD has announced that Rick Bergman had rejoined the company and will lead its Computing and Graphics business. Mr. Bergman’s focus will be high-performance PCs, gaming and semi-custom businesses...
39 by Anton Shilov on 8/6/2019
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