Xiaomi Launches Redmi Note 5 & Redmi Note 5 Pro with 18:9 5.99-Inch LCDs

Xiaomi on Wednesday introduced its new Redmi Note 5 and Redmi Note 5 Pro smartphones in India. The key difference between the new phablets and their predecessors is a...

35 by Anton Shilov on 2/15/2018

Intel Adds Mobile Core i3-8130U to Lineup: Increased Cache and Turbo

Intel on Tuesday introduced the Core i3-8130U, its first mobile 8th Generation Core i3 processor. The new chip features two cores operating at a high frequency and supports Turbo...

11 by Anton Shilov on 2/14/2018

AKiTiO’s Thunder3 10G Adapter Now Available: TB3-to-10GbE for Sub-$300

AKiTiO has quietly begun to sell its Thunderbolt 3 to 10 GbE network adapter, which it first demonstrated at Computex 2017. The device is based on a 10 GbE...

23 by Anton Shilov on 2/13/2018

Panasonic Unveils Let’s Note SV7: 12.1-Inch, Quad-Core CPU, TB3, ODD, 21 Hrs, 2.4 Lbs

Panasonic has upgraded its 12.1-inch series laptops with Intel’s quad-core 8th Generation Core i5/i7 CPUs. The new Panasonic Let’s Note CF-SV7-series notebooks are the only ultra-compact PCs to feature...

25 by Anton Shilov on 2/13/2018

Micron Readies 3D QLC NAND-Based Datacenter SSDs for Nearline Storage

Micron has revealed plans to release datacenter-class SSDs based on 3D QLC NAND memory in an effort to compete in the nearline storage market. Briefly announced at a conference...

29 by Anton Shilov on 2/12/2018

AMD Readies Ryzen 3 2200GE & Ryzen 5 2400GE APUs with Reduced TDP

AMD is preparing to release low-power versions of its Ryzen APUs with built-in Radeon Vega graphics. The new Ryzen 3 2200GE and Ryzen 5 2400GE chips will have a...

24 by Anton Shilov on 2/12/2018

VAIO S Laptops Updated With 8th Gen Core CPUs & TruePerformance to Prolong Turbo Time

VAIO has updated its popular 13-inch VAIO S laptops sold in the U.S. with Intel’s latest 8th Generation Core i5/i7 processors featuring four cores. Besides new CPUs, the systems...

10 by Anton Shilov on 2/12/2018

Samsung Begins Mass Production of 256 GB eUFS Devices for Automotive Applications

Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles...

6 by Anton Shilov on 2/12/2018

SK Hynix Announces SSDs with 72-Layer 3D NAND ICs, Own Controllers

SK Hynix this week has said it has completed development of its enterprise-grade SSDs based on its 512 Gb 72-layer 3D TLC NAND chips as well as its own...

7 by Anton Shilov on 2/8/2018

Patriot Demos Viper M.2 SSDs with Phison E12, Up to 2 TB

In January, Patriot demonstrated its upcoming Viper M.2-branded high-end SSDs. The new drives are powered by Toshiba’s 64-layer BICS 3D NAND flash memory and Phison’s latest PS5012-E12 controller. The...

2 by Anton Shilov on 2/8/2018

Intel Adds New Coffee Lake CPUs to Online Database

Intel has recently added eight unannounced desktop Coffee Lake processors to its MDDS (material declaration datasheet) database. Three new chips belong to the Core i3/i5 lineup are targeting mainstream...

11 by Anton Shilov on 2/7/2018

FSP’s Liquid-Cooled Power Supply: The Hydro PTM+ 1200W, Only $700, With RGB

FSP this week has announced that its Hydro PTM+ 1200 W/1400 W power supply, featuring a liquid cooling block that was originally demonstrated at Computex 2017, would hit the...

12 by Anton Shilov on 2/7/2018

Lenovo Recalls Some ThinkPad X1 Carbon Laptops Due to Potential Overheating

Lenovo this week has began a voluntarily recall of some of its 5th Generation (Kaby Lake, Intel 7000-series) ThinkPad X1 Carbon notebooks because of an unfastened screw that can...

7 by Anton Shilov on 2/7/2018

SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs

SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...

8 by Anton Shilov on 2/6/2018

ATP Launches M.2 NVMe SSDs: 3D MLC, SMI, Extreme Temps, Up to 2.5 GB/s

ATP has introduced its new lineup of SSDs aimed at industrial applications and are designed to withstand harsh environmental conditions, such as extreme temperatures and humidity. The new ATP...

7 by Anton Shilov on 2/2/2018

Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group

Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...

19 by Anton Shilov on 2/2/2018

Azio Ships Retro Classic Bluetooth Keyboard: Expensive Luxury for Windows & Mac

Azio has started to sell wireless versions of its old-fashioned typewriter-like Retro Classic mechanical keyboard. The devices look the same as their wired brethren and are available in four...

7 by Anton Shilov on 2/2/2018

TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...

25 by Anton Shilov on 1/31/2018

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...

12 by Anton Shilov on 1/31/2018

NEC 2018 LaVie Note Mobile: Fanless 12.5” Core i7 with 12hr Battery, Under 2 Lbs

This month, NEC has introduced its first 2018 LaVie notebook: The LaVie Note Mobile. The LaVie line is known due to its design philosophy of being lightweight: when we...

32 by Anton Shilov on 1/29/2018

Log in

Don't have an account? Sign up now