How To Treat a 1+4 Hybrid CPU

At the top of the article, I explained that the reason for using two different types of processor core, one big on performance and the other big on efficiency, was that users could get the best of both worlds depending on if a workload could be run efficiently in the background, or needed the high performance for a user experience interaction. You may have caught onto the fact that I also stated that because Intel is using a 1+4 design, it actually makes more sense for multi-threaded workloads to run on the four Atom cores.

Using a similar power/performance graphs, the effect of having a 1+4 design is quite substantial. On the left is the single core power/performance graphs, but on the right is when we compare 1 Sunny Cove to all 4 Tremont cores working together.

 

Where the previous graph considered a 1+1 design, which is more relevant in those user experience scenarios listed above, on the right is the 1+4 design for when the user demands a heavier workload that might not be latency critical. Because there are four Atom cores, the blue line multiplies by four in both directions.

Now obviously the real world scenario is somewhere between the two, as it is possible to use only one, two, or three of the smaller cores at any given time. The CPU and the OS is expected to know this, so it can govern when workloads that can be split across multiple cores end up on either the big core or the small core.

In this graph from Intel, we have three distinct modes on which threads can operate.

  • ‘Sunny Cove/SNC’ is for responsiveness and user experience threads,
  • ‘Tremont/TNT Foreground’, for user related tasks that require multiple threads that the user is waiting on.
  • ‘Tremont/TNT Background’, for non-user related tasks run in efficiency mode

Even though the example here is web browsing, it might be best to consider something a bit beefier, like video encoding.

If we run video encoding, because it is a user related task that requires multiple threads, it will run on the four Tremont cores (TNT FG). Anything that Windows wants to do alongside that gets scheduled as TNT BG. If we then open up the start menu, because that is a responsiveness task, that gets scheduled on the SNC core.

Is 1+4 the Correct Configuration?

Intel here has implemented a 1+4 core design, however in the smartphone space, things are seen a little differently. The most popular configuration, by far, is a 4+4 design, simply because a lot of smartphone code is written to take advantage of multiple foreground or multiple background threads. There are a number of cost-down designs that reduce die area and power by going for a 2+4 implementation. Everyone seems adamant that 4 is a good number for the smaller cores, partly because they are small and cheap to add, but because Arm’s quad-core implementation is a base unit for its IP.

The smartphone space in recent quarters has also evolved from a two tier system of cores. In some of the more leading edge designs, we now have three types of core: a big, a middle, and a small. Because of the tendency to stay with eight core designs, we now get 1+3+4 or 2+2+4 designs, powered by complex schedulers that manage where to put the threads for the best user experience, the best battery life, or somewhere in the middle. Mediatek has been famously dabbling in 10 core designs, going for a 2+4+4 approach.

One thing missing from all of these implementations is an SoC with one big core and four small cores. Smartphone vendors don’t seem to be interested in 1+4 silicon, and yet Intel has decided on it for Lakefield. This is borne out of decisions made on both sides.

From the smartphone perspective, when hybrid designs came about, the big cores just weren’t powerful enough on their own. In order to offer something more than simply basic, at least two cores were needed, but because of how Arm architected the big and little designs, it almost became standard to look into 4+4 implementations of big and small cores. It was only until this configuration was popularized over a couple of years, and Arm big cores got more powerful, that chip designs started looking at 2+4, or 1+3+4 designs.

On Intel’s side of the fence, the biggest problem it has is the size of the Sunny Cove core. By comparison, it’s really, really big. Because the graphics core is the same as Ice Lake and reuses its design, there simply isn’t enough room within the 82 mm2 compute die to add another core. Not only that, but there is a question of power. Sunny Cove wasn’t built for sub-1W operation, even in the Tremont design. We see big smartphone silicon pulling 4-5W when all eight cores are active – there is no way, based on our understanding of Intel’s designs, that we could see four (or even two) Sunny Cove cores being in the optimal performance per watt range while being that low. Intel’s Lakefield graphics, with 64 EUs, is running at only 500 MHz – a lot lower than the Ice Lake designs. Even if Intel moved that down to a 32 EU design to make space for another Sunny Cove core, I reckon that it would eat the power budget for breakfast and then some.

Intel has made the 1+4 design to act as a 0+4 design that sometimes has access to a higher performance mode. Whereas smartphone chips are designed for all eight cores to power on for sustained periods, Lakefield is built only for 0+4 sustained workloads. And that might ultimately be its downfall. This leads onto a deep discussion about Lakefield’s performance, and what we should expect from it.

Hybrid CPUs: Sunny Cove and Tremont Lakefield in Terms of Laptop Size
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  • PaulHoule - Saturday, July 4, 2020 - link

    @DrK,

    the engineering on this part is like what you'd get if you contracted out to Rockwell or Litton Industries for a brain for a Stinger missile. Compact, brilliantly packaged, with adequate performance, but no concern at all about thermal dissipation because the missile is going to hit or miss its target before the CPU fries.

    Foveros is an expensive technology for a mass market device (cheap tablet) because the fabrication cost depends on the total area and there is an expensive step of stitching the chips together at the end. If you could avoid fabricating "glue" components and just snap together chips from a library this might be an amazing technology to build 500 of something at low development cost and time (e.g. weeks) If you have to make a new mask for the chip, however, it is a lot less fun.

    So far as AVX the problem is as you say: "who cares about AVX?" Intel has shipped a backlog of features that people don't use because of overhead and complexity. As a software dev I get paid to work on certain aspect of my products, and maximizing performance with the latest instructions may or may not be on my agenda. If it is easy to do I will push for it but it means debugging compatibility problems it is a tough ask. "Optimal" performance for a range of users can mean shipping many versions of a function; the performance of loading, installing, updating, those libraries will be not in the least optimal.

    Intel is like that Fatboy Slim album, 'We're #1, Why Try Harder?' The world has changed and Intel is not the #1 CPU firm any more. Intel has to get more Paranoid or it might not Survive.
  • Spunjji - Monday, July 6, 2020 - link

    Why start with "I'm not one to criticise" and then do it? Clearly you are, and as a rhetorical flourish it's tedious in the extreme.

    1 - It's a first-gen product and it shows, but they're putting it in premium products.
    2 - No deep-dive, for sure, but Intel's own figures are not very encouraging.
    3 - Citation needed here. There's no sign of it being used outside of low-power premium devices.
    4 - Who cares about AVX indeed! Tell that to the Intel fanboys pissing all over the AMD threads?

    I'm entirely in favour of your final conclusion, but it's not really supported by the previous statements. 🤷‍♂️
  • Oxford Guy - Friday, July 3, 2020 - link

    Bricklake or bust.
  • Meteor2 - Friday, July 3, 2020 - link

    Ultimately this is another attempt by Intel to stay relevant in a space where it's always struggled: mobile. With the progress being made by Apple, Microsoft, and Qualcomm using ARM, Intel is looking at losing an ever-growing chunk of what was the laptop market.

    But whatever Intel tries, bottom line is that ARM is more efficient than x86.
  • Beaver M. - Friday, July 3, 2020 - link

    Thats not the issue. The issue is that theres not much software in that sector for x86.
  • Valantar - Sunday, July 5, 2020 - link

    A few errors in the article: 2 16-bit channels of LPDDR4X should be 2 32-bit channels of LPDDR4X, given that Renoir (with 4 32-bit LP4X channels at the same clock speed) delivers exactly 2x the bandwidth. Right?

    You should also proofread the pasted-in laptop descriptions; a lot of stuff in them clashes with the previous text.

    Beyond that though: great article! Part of the reason why I love AT is for these technical yet understandable deep-dives. Looking forward to the next one.
  • Pixelpusher6 - Sunday, July 5, 2020 - link

    Interesting choice to place the DRAM right over the core, seems like it would make more sense to move it next to the chip but on package. I guess my question is was it worth the complexity to implement this Foveros design to save a little space? It seems like they could have gotten the same benefit by using a traditional packaging i.e. with a little large package. Can you imagine paying $2500 like the price of that Lenovo and having Atom-esque performance?
  • Pixelpusher6 - Sunday, July 5, 2020 - link

    *larger
  • Farfolomew - Monday, July 6, 2020 - link

    Agreed on the DRAM placement. It seems really out of place. Another "dime size" piece of silicon right next to the Lakefield CPU doesn't seem like it would take up much more board space, and would alleviate a ton of the heat dissipation problems by allowing the compute-layer die to be directly connected to a heatsink
  • serendip - Monday, July 6, 2020 - link

    It seems to be an interesting technical answer to a question nobody asked. Board space is a lot cheaper than what Lakefield would cost. It could also cost more for Intel to produce and they'd be stuck carrying multiple RAM SKUs.

    Heat dissipation could be a major issue. The slow chip could become even slower if it has to constantly throttle down because of thermal loads. Intel is sadly mistaken if this is supposed to be an ARM competitor.

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