Semiconductors

GlobalFoundries this week announced that it has spun off its ASIC Solutions division, establishing Avera Semiconductor, a wholly owned subsidiary that will help fabless chip developers to design their products. Avera will work closely with GlobalFoundries' customers to enable them take advantage of various process technologies that GF has, but the company will also establish ties with other contract makers of semiconductors to help their clients develop chips to be made using leading edge process technologies at 7 nm and beyond. Avera Semi will inherit a rich portfolio of silicon-proven IP containing Arm cores, performance and density-optimized SRAMs, embedded TCAMs, high-speed SerDes, interfaces, and other necessary things. In addition, Avera will offer production-proven design methodologies as well as advanced packaging options. Right now, Avera naturally...

Samsung Starts Mass Production of Chips Using Its 7nm EUV Process Tech

Samsung Foundry on Wednesday said that it had started production of chips using its 7LPP manufacturing technology that uses extreme ultraviolet lithography (EUVL) for select layers. The new fabrication...

39 by Billy Tallis & Anton Shilov on 10/17/2018

TSMC: First 7nm EUV Chips Taped Out, 5nm Risk Production in Q2 2019

Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). First up, the company has successfully taped out its first customer chip using its...

50 by Anton Shilov on 10/9/2018

GlobalFoundries Enables Connectivity IP: New RF SOI and Ensigma BLE on 22FDX

GlobalFoundries this week made two important announcements concerning its radio and connectivity-related capabilities. First up, the company said that Imagination’s Ensigma connectivity IP is now available for its 22FDX...

2 by Anton Shilov on 9/27/2018

Cadence Announces The Tensilica DNA 100 IP: Bigger Artificial Intelligence

Cadence is an industry player we don’t mention nearly enough as much as we should - they make a lot of IP and specialises in accelerator blocks which augment...

10 by Andrei Frumusanu on 9/19/2018

Samsung Foundry Updates: 8LPU Added, EUVL on Track for HVM in 2019

Samsung recently hosted its Samsung Foundry Forum 2018 in Japan, where it made several significant foundry announcements. Besides reiterating plans to start high-volume manufacturing (HVM) using extreme ultraviolet lithography...

29 by Anton Shilov on 9/6/2018

Micron to Expand Its Fab 6 in Virginia, Build New R&D Center

Micron this week announced plans to expand production of DRAM and NAND memory at its fab in Manassas, Virginia. In total, Micron intends to invest $3 billion into the...

11 by Anton Shilov on 8/31/2018

AMD's 7nm CPUs & GPUs To Be Fabbed by TSMC, on Track for 2018 - 2019

With the announcement that its long-time manufacturing partner (and outright former fab) GlobalFoundries is dropping out of the race for bleeding-edge manufacturing nodes, the second big question of the...

28 by Ryan Smith & Anton Shilov on 8/27/2018

GlobalFoundries Stops All 7nm Development: Opts To Focus on Specialized Processes

GlobalFoundries on Monday announced an important strategy shift. The contract maker of semiconductors decided to cease development of bleeding edge manufacturing technologies and stop all work on its 7LP...

123 by Anton Shilov & Ian Cutress on 8/27/2018

Hot Chips 2018: Xilinx DNN Processors Live Blog

Xilinx has several talks this year at Hot Chips, and aside from the ACAP earlier in the day, the talk about their Deep Neural Network processor also looks interesting...

3 by Ian Cutress on 8/21/2018

Hot Chips 2018: Going Deep on NVSwitch Live Blog (8:45am PT, 3:45pm UTC)

The first talk on Day 2 of Hot Chips is from NVIDIA, going into more detail about how the NVSwitch works with a lot more detail than from previous...

3 by Ian Cutress on 8/21/2018

TSMC: Outbreak of Malware That Triggered Delays & Losses Caused by Software for New Tool

TSMC announced this week that it suffered a computer malware outbreak, resulting in a roughly 3 day outage for parts of the fab while systems were restored. As a...

42 by Anton Shilov on 8/9/2018

MRAM Developer Day, GlobalFoundries Keynote Live Blog

Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.

1 by Ian Cutress on 8/6/2018

ASML Ships Twinscan NXT:2000i Scanner for 7nm and 5nm DUV

ASML, the company known for producing equipment for the manufacture of processors and semiconductors at foundries, has started to ship its new Twinscan NXT:2000i DUV (Deep Ultra Violet) scanner...

15 by Anton Shilov on 8/2/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Intel Provides Royalty-Free License for Data Bus to DARPA’s Modular Chips Initiative

Taking place this week is DARPA’s 2018 Electronic Resurgence Initiative (ERI) Summit, the defense research agency's first gathering to address the direction of US technology manufacturing as Moore's Law...

14 by Anton Shilov on 7/25/2018

GlobalFoundries Announces 22FDX Milestone: $2 Billion in Design Wins

GlobalFoundries on Monday announced a milestone concerning its 22FDX-branded fully-depleted SOI low-power planar transistor platform. The company initiated volume production using the technology with yields and performance meeting expectations...

13 by Anton Shilov on 7/10/2018

Arm and Samsung Extend Artisan POP IP Collaboration to 7LPP and 5LPE Nodes

Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. Under the terms of the agreement, Arm will offer Samsung Foundry...

5 by Anton Shilov on 7/6/2018

UMC Acquires Fujitsu’s Stake in Semiconductor Joint Venture

Fujitsu Semiconductor and UMC on Friday said that the latter will acquire 100% ownership of Mie Fujitsu Semiconductor (MIFS), a joint venture between two companies. The move essentially ends...

2 by Anton Shilov on 6/29/2018

Samsung to Pay $400 Million for Infringing FinFET Patent

A federal jury in Texas ordered Samsung Electronics to pay $400 million to a South Korean university for infringing one of fundamental patents related to double gate FinFET transistors...

33 by Anton Shilov on 6/19/2018

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