Semiconductors

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab complex. The fab cluster will be primarily used to build DRAM for PCs, mobile devices, and servers, using process technologies that rely on extreme ultraviolet lithography (EUV). The first fab in the complex will go online in 2025. The new cluster will house four huge semiconductor fabrication plants, which will be located on a 4.15 million square-meter site, reports The Korea Herald. The four fabs will have a planned capacity of around 800,000 wafer starts per month (WSPM), which will make the site one of the world's biggest semiconductor production hubs. Keeping in mind that we...

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

25 by Anton Shilov on 5/24/2018

Intel Discloses Plans to Spend $5 Billion on Fab 28 Expansion in Israel

Intel and two Israeli ministries this week announced that the chip giant plans to invest $5 billion in its Kiryat Gat fab complex – Fab 28 – through 2020...

35 by Anton Shilov on 5/18/2018

TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains

At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the...

10 by Anton Shilov on 5/8/2018

Intel Delays Mass Production of 10 nm CPUs to 2019

Intel on Thursday announced that it would delay mass production of its 10 nm processors from 2018 to 2019 due to yield issues. The company has claimed to be...

156 by Anton Shilov on 4/27/2018

TSMC Kicks Off Volume Production of 7nm Chips

TSMC last week announced that it had started high volume production (HVM) of chips using their first-gen 7 nm (CLN7FF) process technology. The contract maker of semiconductors says it...

63 by Anton Shilov on 4/24/2018

Cadence Announces Tensilica Vision Q6 DSP

Today’s announcement comes from Cadence, and we see the unveiling of a new DSP IP called the new Tensilica Vision Q6. The Q6 succeeds the Vision P6 which as...

20 by Andrei Frumusanu on 4/11/2018

Change of Strategy: A New GlobalFoundries CEO in Dr. Thomas Caulfield

In a surprising move, GlobalFoundries has announced that its CEO is stepping down. Sanjay Jha, who lead the world’s second largest foundry for four years, was in the past...

15 by Anton Shilov on 3/15/2018

Broadcom-Qualcomm Takeover Blocked By White House on National Security Grounds

Stepping into the increasingly wild saga that has been Broadcom’s efforts to purchase Qualcomm, the US government is now weighing in by issuing a new order to block the...

52 by Ryan Smith on 3/12/2018

Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek

Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands, and if unofficial...

16 by Anton Shilov on 3/1/2018

The GlobalFoundries Fab 8 Tour and a Junior Editor's Thoughts

For those who haven’t noticed the anti-contaminant “bunny suit” pictures floating around Twitter, this past weekend Ian and I took part in a tour of GlobalFoundries Fab 8 in...

18 by Nate Oh on 2/8/2018

Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group

Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...

19 by Anton Shilov on 2/2/2018

TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...

27 by Anton Shilov on 1/31/2018

Samsung Starts Mass Production of Chips Using 10nm Low Power Plus (10LPP) Process Tech

Samsung Foundry on Wednesday revealed that it has started mass production of SoC products using its second generation 10 nm Low Power Plus (10LPP) fabrication technology. The new manufacturing...

10 by Anton Shilov on 11/29/2017

Qualcomm Rejects Broadcom Offer to Buy the Company for $105 Billion

Qualcomm has announced today that the Board of Directors has rejected Broadcom’s proposal to acquire the company for around $105 billion. The BOD believes that Broadcom’s offering undervalues Qualcomm...

14 by Anton Shilov on 11/13/2017

Broadcom Makes Unsolicited $105 Billion Bid for Qualcomm

Broadcom on Monday said that it had proposed to acquire all of the outstanding shares of Qualcomm for $105 billion in total for cash and stock. If the buyout...

12 by Anton Shilov on 11/7/2017

Samsung’s 8LPP Process Technology Qualified, Ready for Production

Samsung this week announced that its 8LPP fabrication process, which it formally introduced earlier this year, had passed qualification tests. The manufacturing technology will be used to produce advanced...

35 by Anton Shilov on 10/19/2017

Samsung Details 11LPP Process Technology: 10 nm BEOL Meets 14 nm Elements

Samsung has added a new manufacturing technology into its roadmap. The 11LPP fabrication process is designed for mainstream and higher-end smartphone SoCs. The technology will come online next year...

23 by Anton Shilov on 9/29/2017

GlobalFoundries Weds FinFET and SOI in 14HP Process Tech for IBM z14 CPUs

GlobalFoundries this week formally introduced its new custom process technology that will be used to manufacture IBM's z14 CPUs, which in turn were announced earlier this year. The 14HP...

31 by Anton Shilov on 9/22/2017

GlobalFoundries Adds 12LP Process for Mainstream and Automotive Chips; AMD Planning 12LP CPUs & GPUs

GlobalFoundries on Wednesday announced its new 12LP (leading performance) fabrication process. The new manufacturing technology was designed to increase transistor density and improve frequency potential compared to GlobalFoundries’ current-gen...

32 by Anton Shilov on 9/21/2017

TSMC Teams Up with ARM and Cadence to Build 7nm Data Center Test Chips in Q1 2018

TSMC has announced plans to build its first test chips for data center applications using its 7 nm fabrication technology. The chip will use compute cores from ARM, a...

12 by Anton Shilov on 9/14/2017

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