Semiconductors

TSMC announced this week that it suffered a computer malware outbreak, resulting in a roughly 3 day outage for parts of the fab while systems were restored. As a consequence of the downtime, the fab expects certain shipments delays and additional charges. Specifically, because of the interruptions and costs, the company’s Q3 revenue and gross margin will be 2% and 1% lower than anticipated respectively. TSMC later clarified that the outbreak was caused by “misoperation” during the software installation for a new piece of equipment. What Happened? TSMC’s personnel set up a new manufacturing tool on Friday, August 3, and then installed software for the device. The machine was not isolated and confirmed to be malware-free before connecting it to TSMC’s internal network. Consequently, the introduction...

Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group

Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...

19 by Anton Shilov on 2/2/2018

TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...

26 by Anton Shilov on 1/31/2018

Samsung Starts Mass Production of Chips Using 10nm Low Power Plus (10LPP) Process Tech

Samsung Foundry on Wednesday revealed that it has started mass production of SoC products using its second generation 10 nm Low Power Plus (10LPP) fabrication technology. The new manufacturing...

10 by Anton Shilov on 11/29/2017

Qualcomm Rejects Broadcom Offer to Buy the Company for $105 Billion

Qualcomm has announced today that the Board of Directors has rejected Broadcom’s proposal to acquire the company for around $105 billion. The BOD believes that Broadcom’s offering undervalues Qualcomm...

14 by Anton Shilov on 11/13/2017

Broadcom Makes Unsolicited $105 Billion Bid for Qualcomm

Broadcom on Monday said that it had proposed to acquire all of the outstanding shares of Qualcomm for $105 billion in total for cash and stock. If the buyout...

12 by Anton Shilov on 11/7/2017

Samsung’s 8LPP Process Technology Qualified, Ready for Production

Samsung this week announced that its 8LPP fabrication process, which it formally introduced earlier this year, had passed qualification tests. The manufacturing technology will be used to produce advanced...

35 by Anton Shilov on 10/19/2017

Samsung Details 11LPP Process Technology: 10 nm BEOL Meets 14 nm Elements

Samsung has added a new manufacturing technology into its roadmap. The 11LPP fabrication process is designed for mainstream and higher-end smartphone SoCs. The technology will come online next year...

23 by Anton Shilov on 9/29/2017

GlobalFoundries Weds FinFET and SOI in 14HP Process Tech for IBM z14 CPUs

GlobalFoundries this week formally introduced its new custom process technology that will be used to manufacture IBM's z14 CPUs, which in turn were announced earlier this year. The 14HP...

31 by Anton Shilov on 9/22/2017

GlobalFoundries Adds 12LP Process for Mainstream and Automotive Chips; AMD Planning 12LP CPUs & GPUs

GlobalFoundries on Wednesday announced its new 12LP (leading performance) fabrication process. The new manufacturing technology was designed to increase transistor density and improve frequency potential compared to GlobalFoundries’ current-gen...

32 by Anton Shilov on 9/21/2017

TSMC Teams Up with ARM and Cadence to Build 7nm Data Center Test Chips in Q1 2018

TSMC has announced plans to build its first test chips for data center applications using its 7 nm fabrication technology. The chip will use compute cores from ARM, a...

12 by Anton Shilov on 9/14/2017

GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018

Keeping an eye on the ever-evolving world of silicon lithography, GlobalFoundries has recently disclosed additional details about its 7 nm generation of process technologies. As announced last September, the...

75 by Anton Shilov on 6/23/2017

Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC

Samsung and TSMC have made several important announcements about the present and future of their semiconductor manufacturing technologies in March. Samsung revealed that it had shipped over 70 thousand...

89 by Anton Shilov on 5/5/2017

GlobalFoundries to Expand Capacities, Build a Fab in China

GlobalFoundries has announced plans to expand manufacturing capacities for its leading edge and mainstream production technologies in the U.S., Germany and Singapore. After the upgrades of the fabs are...

48 by Anton Shilov on 2/11/2017

Intel to Equip Fab 42 for 7 nm

Intel this week announced plans to bring its Fab 42 online to produce semiconductors using a 7 nm fabrication process. It will take three to four years, and the...

20 by Anton Shilov on 2/9/2017

Samsung Foundry Announces 10nm SoC In Mass-Production

Today Samsung announced mass production of a SoC built on its third-generation 10nm "10LPE" manufacturing node. It was only this January that Samsung announced mass production of its 14LPP...

92 by Andrei Frumusanu on 10/17/2016

GlobalFoundries Updates Roadmap: 7 nm in 2H 2018, EUV Sooner Than Later?

GlobalFoundries recently announced the first details about its next generation 7 nm manufacturing technology, which is being developed in-house, and revealed plans to start production of chips using the...

76 by Anton Shilov on 10/3/2016

ARM Announces 10FF "Artemis" Test Chip

Today in collaboration with TSMC, ARM's physical IP division is announcing the tapeout of a 10nm test chip demonstrating the company's readiness for the new manufacturing process. The new...

24 by Andrei Frumusanu on 5/18/2016

Samsung Foundry Updates: 7nm EUV, 10LPP, and 14LPC

Earlier this week, Samsung announced a number of updates on the foundry side of their business. While process technology might not be necessarily as interesting as the actual end...

54 by Joshua Ho on 4/22/2016

EUV Lithography Makes Good Progress, Still Not Ready for Prime Time

At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...

37 by Anton Shilov on 3/10/2016

Samsung Announces Second-Gen 14nm Low Power Plus (14LPP) Process Now In Mass Production

Today Samsung Semiconductor officialy announces mass production for its second generation 14nm FinFET manufacturing node. Early last year we saw Samsung announce mass production of its first generation FinFET...

32 by Andrei Frumusanu on 1/14/2016

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