Semiconductors

Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab complex. The fab cluster will be primarily used to build DRAM for PCs, mobile devices, and servers, using process technologies that rely on extreme ultraviolet lithography (EUV). The first fab in the complex will go online in 2025. The new cluster will house four huge semiconductor fabrication plants, which will be located on a 4.15 million square-meter site, reports The Korea Herald. The four fabs will have a planned capacity of around 800,000 wafer starts per month (WSPM), which will make the site one of the world's biggest semiconductor production hubs. Keeping in mind that we...

TSMC Boosts CapEx by $1 Billion, Expects N5 Node to Be Major Success

TSMC is on track to begin high-volume production of chips using its 5 nm technology in the coming months, the company said in its conference call last week. While...

40 by Anton Shilov on 1/22/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

Japan Partly Removes Restrictions on Photoresists Exports to South Korea

Marking a thawing of relations between the Japanese and South Korean governments, the Japanese Ministry of Economy, Trade and Industry (METI) has partially removed export restrictions on photoresists to...

16 by Anton Shilov on 12/23/2019

Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton

Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...

21 by Anton Shilov on 12/11/2019

Panasonic to Sell Semiconductor Business to Nuvoton

Panasonic has announced plans to almost completely withdraw from semiconductor business and sell all of its related assets to Taiwan-based Nuvoton Technology, a wholly owned subsidiary of Winbond Electronics...

4 by Anton Shilov on 11/29/2019

SMIC Begins Volume Production of 14 nm FinFET Chips: China’s First FinFET Line

SMIC has started volume production of chips using its 14 nm FinFET manufacturing technology. The largest contract maker of semiconductors in China is the first company in the country...

15 by Anton Shilov on 11/14/2019

GlobalFoundries and SiFive to Design HBM2E Implementation on 12LP/12LP+

GlobalFoundries and SiFive announced on Tuesday that they will be co-developing an implementation of HBM2E memory for GloFo's 12LP and 12LP+ FinFET process technologies. The IP package will enable...

13 by Anton Shilov on 11/5/2019

Sony to Build New Fab to Boost CMOS Sensor Output

Sony this week has revealed that the company will be building a new semiconductor fab to boost output of its CMOS sensors, as part of a broader effort to...

16 by Anton Shilov on 11/1/2019

GlobalFoundries and TSMC Sign Broad Cross-Licensing Agreement, Dismiss Lawsuits

GlobalFoundries and TSMC have announced this afternoon that they have signed a broad cross-licensing agreement, ending all of their ongoing legal disputes. Under the terms of the deal, the...

27 by Anton Shilov on 10/28/2019

Intel Files Antitrust Suit Against SoftBank-Controlled Firm Over Patent Aggregation

Intel this week filed an lawsuit against Fortress Investment Group, a patent assertion entity controlled by SoftBank. Responding to a series of patent infringement lawsuits that Fortress has brought...

21 by Anton Shilov on 10/23/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...

5 by Anton Shilov on 10/22/2019

TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019

Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...

18 by Anton Shilov on 10/18/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes

As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...

29 by Anton Shilov on 10/14/2019

New Tools & IP Accelerate Development of 5nm Arm ‘Hercules’ SoCs

Arm, Synopsys, and Samsung Foundry have developed a set of optimized tools and IP that will enable chip designers to build next-generation SoCs based on Arm’s Hercules processor cores...

9 by Anton Shilov on 10/10/2019

TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon

TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...

27 by Anton Shilov on 10/8/2019

GlobalFoundries Mulls IPO Plans for 2022

After a decade of being a privately-held contract maker of semiconductors, GlobalFoundries has revealed that it's mulling going public in 2022. The move will help GF’s current owners to...

9 by Anton Shilov on 10/2/2019

TSMC Counter-sues GlobalFoundries: Accuses US Fab of Infringing Patents Across Numerous Process Nodes

In a not-unexpected move, TSMC late on Monday filed a lawsuit against GlobalFoundries, its pure-play foundry rival, accusing the manufacturer of patent infringment. In the suit, a response to...

24 by Anton Shilov on 10/1/2019

Arm & TSMC Showcase 7nm Chiplet, Eight A72 at 4GHz on CoWoS Interposer

Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...

26 by Anton Shilov on 9/27/2019

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