Samsung

PCI-SIG, the standards committee behind PCI Express and related standards, has issued a warning about incompatibilities between their M.2 standard and Samsung's NGSFF/NF1 SSD form factor. The notice from PCI-SIG does not refer to Samsung by name, but does indirectly call them out for basing a new form factor on a mechanically identical M.2 connector without introducing a new keying option to prevent improper insertion of M.2 drives into NGSFF slots or vice versa. Samsung's NGSFF form factor was unveiled in 2017 as a proposed replacement for M.2 and U.2 SSDs in datacenter applications. The goals are similar to the competing EDSFF standards derived from Intel's Ruler: provide more power than can be delivered over M.2's 3.3V supply, allow hot-swapping of cards, and widen the...

Samsung Announces The Galaxy Note 9: 4000mAh And New S-Pen

Today at the Unpacked Event at the Barclays Center in New York Samsung launched alongside a new smartwatch, the Galaxy Watch and a new home speaker, the Galaxy Home...

50 by Andrei Frumusanu & Nate Oh on 8/9/2018

Samsung Unpacked 2018 Pt.2 - Live Blog (11am ET)

We're here in New York City for Samsung's second Unpacked event of the year. This time around it's no secret what Samsung will be presenting: the Galaxy Note 9...

16 by Andrei Frumusanu & Nate Oh on 8/9/2018

Samsung Starts Mass Production of QLC V-NAND-Based SSDs

Samsung on Monday announced the industry’s first consumer SSDs based on QLC V-NAND memory. The drives will be available with capacities of up to 4 TB and will target...

6 by Anton Shilov on 8/6/2018

Galaxy Note 9 Leaks In Officially Uploaded Video

Samsung is said to have uploaded a promotional Galaxy Note 9 video onto its New Zealand YouTube media channel, depicting the new design as well as a couple of...

19 by Andrei Frumusanu on 8/3/2018

Samsung Introduces Galaxy Tab S4: S835, 7300mAh Battery, Samsung DeX

Samsung this week introduced its new 10.5-inch Google Android-based tablet. The new Galaxy Tab S4 uses Qualcomm’s high-performance mobile SoC, is outfitted with a premium sAMOLED display, and an...

23 by Anton Shilov on 8/2/2018

Samsung Starts Production of 16 Gb LPDDR4X Chips Using 2nd Gen 10nm Tech

Samsung this week announced that it has begun manufacturing its new LPDDR4X memory chips using its second-generation 10 nm-class fabrication process (which is traditionally called 1y nm). The new...

12 by Anton Shilov on 7/27/2018

Samsung Discloses First Details About QLC-Based Client & Server SSDs

It is not a secret that Samsung deliberately avoided QLC NAND with its 64-layer V-NAND flash, in the process citing various reasons. With its 96-layer V-NAND however, the company...

16 by Anton Shilov on 7/25/2018

Samsung Announces First LPDDR5 DRAM Chip, Targets 6.4Gbps Data Rates & 30% Reduced Power

Samsung has been on a roll lately with memory & storage-related announcements, and that roll is continuing today with a new DRAM-related announcement out of the juggernaut. This afternoon...

14 by Ryan Smith on 7/16/2018

Samsung Begins Mass Production Of 96L 3D NAND

Samsung has started mass production of their fifth generation of 3D NAND flash memory, which they brand as V-NAND. This new generation bumps the layer count from 64 up...

26 by Billy Tallis on 7/9/2018

Best Android Phones: Q3 2018

In our series of best product guides, here’s the latest update to our recommended Android Smartphone list. All numbers in the text are updated to reflect pricing at the...

48 by Andrei Frumusanu on 7/6/2018

AIC Shows Dual NF1 to U.2 SSD Adapter

After the official announcement last week of Samsung’s new 8TB NF1 drive, I went back through my Computex photo kit to dig out a couple of images I snapped...

3 by Ian Cutress on 6/25/2018

MSI Optix MAG491C Hands-On: A 49-Inch 32:9 LCD with FreeSync

Earlier this month MSI demonstrated its ultrawide curved 49-inch gaming display at Computex. The unit uses a mass-produced panel and already has a model number, so its launch is...

17 by Anton Shilov on 6/22/2018

Samsung Kicks Off Mass Production of 8 TB NF1 SSDs with PCIe 3.0 x4 Interface [updated]

Samsung this week announced that it had started mass production of its new 8 TB NF1 SSDs. Samsung has been demonstrating prototype NF1 SSDs for slightly less than a...

20 by Anton Shilov on 6/21/2018

Samsung to Pay $400 Million for Infringing FinFET Patent

A federal jury in Texas ordered Samsung Electronics to pay $400 million to a South Korean university for infringing one of fundamental patents related to double gate FinFET transistors...

33 by Anton Shilov on 6/19/2018

Samsung Kicks Off Mass Production of 64GB RDIMMs Using 16Gbit Chips

Back in March, Samsung first demonstrated their next-generation 64GB DDR4 Registered DIMMs. Based on Samsung’s new 16Gbit DDR4 memory chips, these new RDIMMs would offer 64GB of memory capacity...

7 by Ryan Smith on 6/11/2018

Colorful Demonstrates a 49-Inch All-in-One PC

Colorful is showing off its prototype of an all-in-one computer with a 49-inch display. At present, the system is closer to a proof-of-concept than a real product, but if...

18 by Anton Shilov on 6/8/2018

Samsung Unveils 32 GB DDR4-2666 SO-DIMMs

Samsung on Wednesday introduced its first consumer products based on its 16 Gb DDR4 memory chips demonstrated earlier this year. The new SO-DIMMs are aimed at high-performance notebooks that...

16 by Anton Shilov on 5/30/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

24 by Anton Shilov on 5/24/2018

Samsung Posts Lowered MSRPs For 970 PRO And 970 EVO SSDs

Sales of the Samsung 970 PRO and 970 EVO M.2 NVMe SSDs are due to begin tomorrow (May 7), and it appears that Samsung may be making a last-minute...

32 by Billy Tallis on 5/6/2018

Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019

Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...

31 by Anton Shilov on 5/3/2018

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