7nm

We’re here in Maui for the second day of Qualcomm’s fourth annual Snapdragon summit, for what is probably the most exciting part of the event, as we cover the disclosure of the intricate details of the brand new Snapdragon 865 and 765 SoCs that the company had briefly announced yesterday. Indeed, this year, Qualcomm isn’t launching just one SoC, but rather two new platforms at the same time. The Snapdragon 865 is self-explanatory in its positioning; as a direct successor to the Snapdragon 855 we expect the new chip to represent the best Qualcomm is able to deliver, and be the silicon that powers most of 2020’s flagship devices. The new top-model this year is accompanied by the new Snapdragon 765 and 765G SoCs. As...

The AMD Ryzen Threadripper 3960X and 3970X Review: 24 and 32 Cores on 7nm

One of the constant themes of 2019 has been to ask AMD employees about the future of its Threadripper line of products. Since the start of the year we’ve...

230 by Dr. Ian Cutress, Andrei Frumusanu & Gavin Bonshor on 11/25/2019

AnandTech Exclusive: An Interview with Intel’s Raja Koduri about Xe

This week Raja gave the keynote at Intel’s HPC DevCon event, a precursor to Supercomputing, and I did my usual thing of asking for the interview, fully expecting the...

70 by Dr. Ian Cutress on 11/20/2019

Intel’s Xe for HPC: Ponte Vecchio with Chiplets, EMIB, and Foveros on 7nm, Coming 2021

Today is Intel’s pre-SC19 HPC Devcon event, and with Raja Koduri on stage, the company has given a small glimpse into its high-performance compute accelerator strategy for 2021. Intel...

14 by Dr. Ian Cutress on 11/17/2019

The AMD Ryzen 9 3950X Review: 16 Cores on 7nm with PCIe 4.0

Deciding between building a mainstream PC and a high-end desktop has historically been very clear cut: if budget is a concern, and you're interested in gaming, then typically a...

200 by Dr. Ian Cutress on 11/14/2019

AMD Q4: 16-core Ryzen 9 3950X, Threadripper Up To 32-Core 3970X, Coming November 25th

AMD is set to close out the year on a high note. As promised, the company will be delivering its latest 16-core Ryzen 9 3950X processor, built with two...

164 by Dr. Ian Cutress on 11/7/2019

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...

3 by Anton Shilov on 10/22/2019

AMD May Be Prepping More 280 W EPYC Enterprise CPUs

Back in September, AMD announced its 64-core EPYC 7H12 processor - a 280 W TDP behemoth with an increased base frequency designed specifically for the high-performance computing market. Based...

22 by Anton Shilov on 10/21/2019

TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019

Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...

18 by Anton Shilov on 10/18/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes

As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...

29 by Anton Shilov on 10/14/2019

TRX40 Chipset For Upcoming AMD Ryzen Threadripper Listed

In what is being put down to an inadvertent leak by MSI, it could be that the currently unannounced chipset for AMD's new 3rd Gen Ryzen Threadripper series processors...

21 by Gavin Bonshor on 10/10/2019

TSMC: N7+ EUV Process Technology in High Volume, 6nm (N6) Coming Soon

TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...

27 by Anton Shilov on 10/8/2019

Arm & TSMC Showcase 7nm Chiplet, Eight A72 at 4GHz on CoWoS Interposer

Arm and TSMC this week unveiled their jointly developed proof-of-concept chip that combines two quad-core Cortex-72-based 7 nm chiplets on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) interposer. The two chips are connected...

26 by Anton Shilov on 9/27/2019

AMD’s New 280W 64-Core Rome CPU: The EPYC 7H12

If there’s something that gets everyone excited, it is more performance. On the Enterprise side, AMD has made big strides with its latest EPYC processor stack, featuring up to...

54 by Dr. Ian Cutress on 9/18/2019

Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)

The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...

11 by Dr. Ian Cutress on 8/20/2019

AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked

If you examine the CPU industry and ask where the big money is, you have to look at the server and datacenter market. Ever since the Opteron days, AMD's...

185 by Johan De Gelas on 8/7/2019

Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track

Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...

42 by Anton Shilov on 7/31/2019

TSMC Announces Performance-Enhanced 7nm & 5nm Process Technologies

TSMC has quietly introduced a performance-enhanced version of its 7 nm DUV (N7) and 5 nm EUV (N5) manufacturing process. The company’s N7P and N5P technologies are designed for...

36 by Anton Shilov on 7/30/2019

The AMD Radeon RX 5700 XT & RX 5700 Review: Navi Renews Competition in the Midrange Market

There have been teasers, press conferences, architectural announcements, and pricing games all around – and all before the first card has even shipped. The run-up to the launch of...

137 by Ryan Smith on 7/7/2019

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