11:40AM EDT - Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday for our regular AnandTech Live Blogs. Today we start at 8:45am PT, so set your watches and notifications to return back here! The first set of talks is all about CPUs: Intel Alder Lake, AMD Zen 3, IBM Z, and Intel Sapphire Rapids.

11:45AM EDT - The stream should be starting momentarily

11:45AM EDT - It usually starts with 15 minutes of pre-show info to begin

11:47AM EDT - Here we go

11:48AM EDT - Apparently some attendees are having issues with too many from the same company on the same VPN

11:49AM EDT - There's a slack channel for all attendees

11:49AM EDT - Behind the scenes

11:51AM EDT - Lots of members on the committees

11:51AM EDT - Selecting the best talks

11:51AM EDT - These people identify keynote speakers, solicit papers for talks

11:52AM EDT - Tutorials were yesterday

11:54AM EDT - Three keynotes

11:55AM EDT - Synopsys is on AI in EDA

11:55AM EDT - Skydio on autonomous flight

11:55AM EDT - DoE on AI Chips and challenges

11:56AM EDT - 'Chips enabling Chips'

11:57AM EDT - For those attending

11:57AM EDT - Posters as part of the conference as well

11:58AM EDT - First session is CPUs, about to start

11:59AM EDT - 'State of the art CPUs'

11:59AM EDT - Efi Rotem for Intel on Alder Lake

12:00PM EDT - The why and how of Alder Lake

12:00PM EDT - Most apps are Single or lightly MT

12:01PM EDT - Increase in support of ML

12:01PM EDT - Working on smarter structures and new instructions for ML

12:01PM EDT - Duplicating multicore

12:02PM EDT - Moores Law and Dennard Scaling

12:02PM EDT - Same arch, different uArch, different opimization point

12:03PM EDT - This is what we saw in the Alder Lake part of the Architecture Day

12:03PM EDT - P-Core and E-Core

12:04PM EDT - E-core has shared L2

12:04PM EDT - P-core is +50% ST performance over the E-core

12:05PM EDT - Scalable SoC architecture

12:05PM EDT - UP3/UP4 for mobile, Desktop

12:05PM EDT - 2+8, 6+8 and 8+8 for P-core + E-core

12:06PM EDT - modular design

12:06PM EDT - mix and match for future products

12:06PM EDT - 96 EUs on mobile, 32 EUs on desktop

12:07PM EDT - Only mobile will get native Thunderbolt

12:08PM EDT - Smartness is built into the hardware

12:08PM EDT - Thread Director is mostly for Window 11

12:09PM EDT - Onboard microcontroller

12:10PM EDT - Thread Director will predict the class of workload and bucket it the classes for the OS scheduler on the oder of 30 microseconds

12:10PM EDT - Core-to-Core IPC is the main metric

12:11PM EDT - Intel EHFI

12:12PM EDT - This is more detail about Thread Director

12:12PM EDT - So every processor gets a section in the table, and it has a value for Perf and Efficiency, and workload is compared

12:14PM EDT - Sometimes it makes sense to coalesce a software thread to fewer cores, or one type of core

12:14PM EDT - Thread Director Table updated less often than thread classification

12:14PM EDT - OS has idea of priority of thread

12:15PM EDT - OS scheduler is final arbiter

12:15PM EDT - Table is topology agnostic

12:17PM EDT - Here's a scheduling example

12:18PM EDT - Helps with asymmetry between the threads

12:19PM EDT - All AI workloads go to P-Cores over anything else

12:19PM EDT - AVX + VNNI / INT8 get highest priority over anything

12:21PM EDT - EPP - Energy Performance Preference also takes a role in input to the scheduler

12:21PM EDT - For power constrained systems

12:21PM EDT - higher priority gets higher voltage and frequency regardless of P-core and E-core

12:22PM EDT - optimal P/V point is a function of phyiscal properties (thermal, binning)

12:22PM EDT - Q&A time

12:23PM EDT - Q: Security of side channel attacks with Thread Director A: No security effect, only performance

12:24PM EDT - Q; Die photo, PCIe - how many PCIe 5/4/3 lanes? A: As shown, slide 11, 16x PCIe 5, 4x lanes of PCIe 4, Desktop has PCH

12:25PM EDT - Q: TDT for Linux, when? A: First enabling was Windows 11, work with Linux for time - it is coming, which version and build will be published later

12:25PM EDT - Now AMD Zen 3 talk

12:26PM EDT - Mark Evers from AMD

12:26PM EDT - The Zen Journey from 2017

12:27PM EDT - New era in the market for AMD

12:27PM EDT - Zen3 says AMD 3D Cache support

12:27PM EDT - Exceeding Industry Trends

12:28PM EDT - Scale-out for servers and supercomptuers

12:28PM EDT - Socket compatibility for past products

12:29PM EDT - 4k op cache

12:30PM EDT - +19% IPC gains, which we verified at launch

12:31PM EDT - Large chunk of performance gain from the front end fetch/decode

12:31PM EDT - reduced bubble cycle latency

12:32PM EDT - supporting wider execution

12:32PM EDT - lower latencies for some instructions

12:33PM EDT - 10 issue per cycle up from 7

12:33PM EDT - More execution bandwidth ILP extraction

12:33PM EDT - Disaggregated the ALUs rather than just add more

12:34PM EDT - Without any additional increase in register file ports

12:34PM EDT - larger 6-wide FP unit

12:34PM EDT - Faster 4-cycle FMAC

12:34PM EDT - Reduced FMA latency

12:34PM EDT - Doubled INT8 throughput

12:35PM EDT - larger load-store

12:35PM EDT - L2 DTLB has 6 page walkers

12:36PM EDT - Changes from Zen2

12:36PM EDT - Removed bubble cycle with branch prediction

12:37PM EDT - Back on track faster when mispredict

12:37PM EDT - Quicker switching with I-cache overflow

12:38PM EDT - How AMD calculated IPC uplift

12:39PM EDT - Enterprise security additions

12:39PM EDT - SEV, SEV-ES, SEV-SNP

12:39PM EDT - SNP is the new feature for Zen 3

12:40PM EDT - Eliminates page table attack vectors through VMs/hypervisors

12:40PM EDT - No application modification needed

12:40PM EDT - New instruction support

12:41PM EDT - Double L3 cache

12:42PM EDT - access from cores, better for gaming

12:42PM EDT - reduction in effective L3 memory latency

12:42PM EDT - 2x32B data channels in opposite directions

12:43PM EDT - L3 is an non-inclusive cache

12:43PM EDT - L2 tags in L3

12:43PM EDT - support 192 misses from L3 to memory

12:44PM EDT - Built in support for AMD V-Cache

12:44PM EDT - Already demoed +64 MB L3

12:44PM EDT - +15% faster on gaming

12:47PM EDT - Ryzen performance gains in the same TSMC 7nm

12:47PM EDT - All from uarch and physical design

12:47PM EDT - Gaming was a main target for Zen 3

12:48PM EDT - Performance that matters for the user

12:49PM EDT - Summing up

12:49PM EDT - Zen4 by end of 2022

12:49PM EDT - On track in TSMC N5

12:50PM EDT - Time for Q&A

12:51PM EDT - Q: V-Cache is applicable all the segments, all just for desktop/server A: Lot of different workloads, benefit from v-cache, Havenlt announced specific products with v-cache, but some workloads across segments that benefit

12:52PM EDT - Q: Primary motication for tripling table walkers A: some workloads with large DRAM access footprint with outstandling TLB misses. Lots of workloads won't need more than 2, but benefits a few pages, but a clever way to add more without excessive

12:54PM EDT - Q: Is the chiplet technology technology scalable? A: When it comes to the 3D Vcache - latency is not large. For chiplets of having CCDs and IODs, it can give you more flexibility than monolithic. Build best products with chiplets

12:55PM EDT - Next presentation is from IBM

12:55PM EDT - IBM Telum Processor

12:55PM EDT - Optimized from AI

12:55PM EDT - Next Gen Z processor

12:55PM EDT - This would be IBM z16, but this one gets a name

12:56PM EDT - How often do you use a mainframe? Probably yes if you've used your credit card

12:57PM EDT - Chief Architect

12:57PM EDT - Starting with background on IBM z

12:57PM EDT - large part of IT infrastructure

12:58PM EDT - Even startups with NFTs

12:58PM EDT - Insights with AI models are needed

12:58PM EDT - Telum is based for this

12:59PM EDT - Enterprise workloads sensitive to ST performance and scalability

12:59PM EDT - Lots of workloads are heterogeneous

01:00PM EDT - Need embedded accelerators

01:00PM EDT - New AI accelerator

01:00PM EDT - New cache hierarchy and fabric design

01:00PM EDT - Encrypted memory and trusted execution environment

01:00PM EDT - Enclaves

01:01PM EDT - Reilability and Availability, 7x9 on z15

01:02PM EDT - 8 cores + 4 MB L2

01:02PM EDT - 5 GHz+ with SMT2

01:02PM EDT - New branch prediction

01:02PM EDT - 270000 branch target table entries

01:02PM EDT - Private 32 MB of L2 cache

01:03PM EDT - 19-cycle load-use latency

01:03PM EDT - Moved away for shared L3 and off-chip L4

01:04PM EDT - 4 pipelines on L2 allowing overlapped traffic

01:04PM EDT - L3 and L4 are now virtual

01:05PM EDT - 320 GB/s ring bandwidth

01:06PM EDT - 8 GB L4 cache

01:07PM EDT - 2-cycle transfer path between chips

01:07PM EDT - 2:1 sync clock grids

01:08PM EDT - 8-chip has flat topology - direct connect to all 8 chips

01:08PM EDT - 40% socket performance over z15

01:08PM EDT - Some of this comes from the AI workload

01:09PM EDT - AI algorithms make machines more efficient

01:09PM EDT - Using the AI to increase security

01:10PM EDT - very low inference latency - every core has access

01:11PM EDT - Kinda like the Centaur CNS core

01:12PM EDT - 6 TFLOPs per chip per AI accelerator

01:13PM EDT - Accelerator is extensible with firmware releases as AI evolves

01:13PM EDT - New instructions for AI accelerator

01:13PM EDT - simpler instructions

01:13PM EDT - But you have to use the libraries to use the instructions

01:14PM EDT - supports virtualization and memory translation

01:14PM EDT - Manages all the data with the new instructions

01:14PM EDT - 6 TF per chip, 200 TF in 32-chip system

01:15PM EDT - 8-way SIMD engine, 128 tiles, MAC array on MatMul and convolution. 32 tioles for activation

01:15PM EDT - focused on FP16

01:16PM EDT - 100 GB/s bandwidth to the AI accelerator

01:16PM EDT - 100 per core, 600 total

01:16PM EDT - Software is all through ONNX

01:17PM EDT - TensorFlow or through IBM Deep Learning Compiler through ONNX

01:18PM EDT - Client proxy model performance

01:19PM EDT - Samsung 7nm, 530 sq mm, 22.5B transistors

01:19PM EDT - 5 GHz+ base clock frequency

01:20PM EDT - Q&A time

01:21PM EDT - Q: Use ring for AI accelerator? A: yes

01:21PM EDT - Firmware does additional management through dedicated buses

01:22PM EDT - Q: Packaing technology for dual die A: Standard, no bridges, put them close together, less than 0.5mm, some intresting thermal and mechanical, but signalling is through the package. Cool innovation on signalling due to clock synchronization.

01:23PM EDT - Q: BW of Inter-socket and Intra-drawer links A: 320 GB/s between chips, draw in each direction is 45 GB/s

01:25PM EDT - Q: Memory ordering preserved between cores and accelerators - A: magic! keep track of data, on a cache miss, broadcasts, memory state bits tracked to broadcast further out, even go across whole system, when data arrives, have to make sure it can be used, invalidate all other copies confirmed before working on data

01:29PM EDT - Q: How does Telum maintain linear scaling A: lots of scaling work on generic workloads, fabric design etc, optimize latency between chips and across drawers, that's standard. Investment in latency and bandwidth. AI chart shows almost perfect linear, because those are parallel tasks, and data is local

01:30PM EDT - Now for Sapphire Rapids from Intel

01:31PM EDT - Laucnhing 1H 22

01:32PM EDT - Xeon is optimized for performance and CD Perf

01:33PM EDT - Still calling the cores P-cores even though there's no E-cores

01:33PM EDT - Modular SoC architecture

01:34PM EDT - CXL 1.1

01:34PM EDT - Virtualization and VM telemetry

01:34PM EDT - Low Jitter Architecture

01:34PM EDT - Next-Gen QoS

01:35PM EDT - THIS IS SAPPHIRE RAPIDS

01:35PM EDT - Here's the die shot

01:36PM EDT - We've been told there is two types of tile on SPR

01:36PM EDT - Every thread has full access to all resources on all tiles

01:37PM EDT - NUME Clustering

01:37PM EDT - NUMA*

01:37PM EDT - UPI 2.0

01:38PM EDT - One of the issues here is that each tile has two memory channels - we've been told each SPR core will have 8 channels, that means each SPR product will have to have 4 tiles

01:39PM EDT - New instructions

01:39PM EDT - AMX for Matrix

01:39PM EDT - AIA instructions for Acceelrators

01:39PM EDT - HFNI for FP16 half precision

01:39PM EDT - CLDEMOTE

01:40PM EDT - Accelerator Engine improvements

01:41PM EDT - Avoid kernel mode overheads with AIA

01:41PM EDT - Providing base functions for deployment of acceleration engines

01:42PM EDT - DSA and QAT

01:42PM EDT - Doubled QAT

01:42PM EDT - Still requires a chipset

01:43PM EDT - ZLIB L9 98% offload

01:44PM EDT - Dynamic Load Balancer

01:44PM EDT - 400M load balancing decisions per second

01:44PM EDT - important for QoS

01:44PM EDT - ideal for packet processing and microservices

01:45PM EDT - 4 x24 UPI links at 16 GT/s (four PCIe 4.0 x16 links for multisocket)

01:46PM EDT - >100 MB LLC

01:46PM EDT - 8 memory channels

01:47PM EDT - Optane 300-series support

01:47PM EDT - SPR+HBM

01:47PM EDT - connected over EMIB

01:47PM EDT - Flat mode and caching mode with DRAM

01:47PM EDT - Can also support optane

01:48PM EDT - INT8 improved through a new accelerator

01:49PM EDT - Industry standard frameworks for CPU based training and inference

01:49PM EDT - Large focus on microservices from initial design

01:50PM EDT - AIA to help service startup time

01:51PM EDT - Scalability with a monolithic view

01:51PM EDT - 10 lots of EMIB

01:51PM EDT - Q&A time

01:52PM EDT - Q: HBM Cache mode have a map? Where do you keep the tags if the HBM is a cache? A: No details quite yet

01:53PM EDT - Q: How is the AI perf of AMX compared to A100? A: No comparison yet

01:54PM EDT - Q: Intel CPU support DDIO, if HBM is cache, where does Data go first? A: Go to L3.

01:55PM EDT - Q: CXL - IBM did CAPI. Can you compare CXL to CAPI? A: Intent of CXL is similar to CAPI. CXL has IO similar to PCIe, but also can consider Accelerators with their own caches

01:55PM EDT - Intel will support CXL.mem in future products, not SPR

01:56PM EDT - Q: Interdie crossing latency A: low single digit nanosecond, little different between vertical and horizontal due to rectangular design

01:57PM EDT - DSA and QAT look like PCIe devices, require drivers (not bare metal), but they are part of the AIA framework. Works with AIA instructions, work with virtualization, but they look like PCIe devices

02:00PM EDT - .

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  • SarahKerrigan - Monday, August 23, 2021 - link

    The early disclosures for IBM's new z processor, Telum, indicate it may have no on-die L3 (but has absolutely immense L2's.) I'm excited to see how that plays out! Reply
  • Ian Cutress - Monday, August 23, 2021 - link

    Can confirm. L3 is virtual on a single chip, and L4 is virtual across chips. It's the future of multi-level caches. Reply
  • SarahKerrigan - Monday, August 23, 2021 - link

    Thanks! Any other deets you can provide on Telum before the presentation? IIRC z15 put higher-level BTBs in eDRAM - are those just SRAM structures now? What's the L1 config look like? Early disclosures implied the SC is gone - are memory controllers integrated into the Telum CP now? Reply
  • Ian Cutress - Monday, August 23, 2021 - link

    It's all one chip :) Presentation is soon, too much to write in a box right now. But I think all your Qs will be answered. Reply
  • SarahKerrigan - Monday, August 23, 2021 - link

    My questions weren't answered, sadly... and normally z HC presentations are so good! Reply
  • SarahKerrigan - Monday, August 23, 2021 - link

    Eh, I take it back. Looking closer, it appears that we're looking at, mostly, a z15 core variant with a refactored branch predictor (hi, lack of eDRAM!), otherwise a similar or identical core, and a new uncore.

    I'm here for it, I guess.
    Reply
  • TeXWiller - Monday, August 23, 2021 - link

    My memory is little hazy on this, but I think it was either Oracle or Fujitsu that had such cache organization in one of their recent models and they got a decent performance with it. Reply
  • Shaunathan - Monday, August 23, 2021 - link

    aww man, i got burrito juice all on my hand Reply
  • Unashamed_unoriginal_username_x86 - Monday, August 23, 2021 - link

    Yo dog thats awful. hope u get better Reply
  • The Hardcard - Monday, August 23, 2021 - link

    Jason Lowe-Power? What a name for someone in the semiconductor industry! He doesn’t need to do anything extra to get his resume read. Reply

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