TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020. When all three phases of the manufacturing facility are completed, its wafer starts capacity will exceed one million 300-mm wafers per year, comparable with other three GigaFabs operated by TSMC. TSMC’s Fab 18 will be located in Tainan (in the Southern Taiwan Science Park), and will be built in three phases. The construction of the first phase or segment of the building will be completed in about a year from now, after which TSMC will move in equipment sometime in early 2019. In about two years from now, the company expects to start volume production of...
In what is becoming an annual tradition, during AMD’s Tech Day here at CES we were given the opportunity to spend some time with Dr. Lisa Su, AMD’s CEO...63 by Ian Cutress on 1/24/2018
TSMC has announced plans to build its first test chips for data center applications using its 7 nm fabrication technology. The chip will use compute cores from ARM, a...12 by Anton Shilov on 9/14/2017
This news piece contains speculation, and suggests silicon implementation based on released products and roadmaps. The only elements confirmed for Project Scorpio are the eight x86 cores, 6 TFLOPs...113 by Ian Cutress on 4/6/2017
At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...37 by Anton Shilov on 3/10/2016