At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the company’s second fabrication process to use extreme ultraviolet (EUV) lithography, which is going to enable TSMC to aggressively increase its transistor density versus prior generations. However, when it comes to performance and power improvements, the gains do not look very significant. Just like other fabs, TSMC will gradually ramp up usage of ASML’s Twinscan NXE:3400 EUV step and scan systems. Next year TSMC will start using EUV tools to pattern non-critical layers of chips made using its second-gen 7 nm fabrication technology (CLN7FF+). Usage of EUV for non-critical layers will bring a number of benefits to...
Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...31 by Anton Shilov on 5/3/2018
This week Xilinx is making public its latest internal project for the next era of specialized computing. The new product line, called Project Everest in the interim, is based...16 by Ian Cutress on 3/19/2018
TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...25 by Anton Shilov on 1/31/2018
In what is becoming an annual tradition, during AMD’s Tech Day here at CES we were given the opportunity to spend some time with Dr. Lisa Su, AMD’s CEO...63 by Ian Cutress on 1/24/2018
TSMC has announced plans to build its first test chips for data center applications using its 7 nm fabrication technology. The chip will use compute cores from ARM, a...12 by Anton Shilov on 9/14/2017
This news piece contains speculation, and suggests silicon implementation based on released products and roadmaps. The only elements confirmed for Project Scorpio are the eight x86 cores, 6 TFLOPs...113 by Ian Cutress on 4/6/2017
At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...37 by Anton Shilov on 3/10/2016