SK Hynix
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this premium type of DRAM. On Tuesday, buried in a note about qualifying the company's 1bnm fab process, the the manufacturer remarked for the first time that it is working on next-generation HBM3E memory, which will enable speeds of up to 8 Gbps/pin and will be available in 2024. Contemporary HBM3 memory from SK Hynix and other vendors supports data transfer rates up to 6.4Gbps/pin, so HBM3E with an 8 Gbpis/pin transfer rate will provide a moderate, 25% bandwidth advantage over existing memory devices. To put this in context, with a single HBM stack using a 1024-bit wide...
JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm
The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...
58 by Anton Shilov on 11/1/2018
KLEVV Launches NEO N500 SSDs Based on SK Hynix’s 72-Layer 3D NAND
SK Hynix’s subsidiary KLEVV has introduced its new client SSDs based on the manufacturer’s 72-layer 3D NAND flash. The KLEVV NEO N500 drives are aimed at entry-level desktops and...
0 by Anton Shilov on 9/14/2018
SK Hynix Set to Build a New Memory Fab
SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...
16 by Anton Shilov on 7/30/2018
Klevv Adds Kolors: RGB-Lit Enthusiast-Class Cras DIMMs & SSD Incoming
Klevv, a subsidiary of SK Hynix, has been around for quite a while targeting mass retail market with mainstream DRAM and SSD products. Recently Klevv decided to address the...
13 by Anton Shilov on 6/7/2018
Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019
Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...
31 by Anton Shilov on 5/3/2018
SK Hynix Announces SSDs with 72-Layer 3D NAND ICs, Own Controllers
SK Hynix this week has said it has completed development of its enterprise-grade SSDs based on its 512 Gb 72-layer 3D TLC NAND chips as well as its own...
7 by Anton Shilov on 2/8/2018
SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs
SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...
9 by Anton Shilov on 2/6/2018
SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...
14 by Anton Shilov on 1/25/2018
Toshiba Signs Deal To Sell Memory Business
After being approved by the board of directors last week, Toshiba's deal to sell their memory business to a consortium led by Bain Capital has been signed and will...
11 by Billy Tallis on 9/28/2017
Toshiba To Proceed With Sale Of Memory Business To Consortium
The latest and possibly final round of bidding for Toshiba's memory business concluded today with Toshiba's board selecting a consortium led by private equity firm Bain Capital as the...
12 by Billy Tallis on 9/20/2017
Samsung & SK Hynix Graphics Memory Prices Increase Over 30% In August
In the midst of a global DRAM shortage, Digitimes reports that the market prices for graphics memory from Samsung and SK Hynix have increased by over 30% for August...
55 by Nate Oh on 8/16/2017
SK Hynix: Customers Willing to Pay 2.5 Times More for HBM2 Memory
SK Hynix was the first DRAM manufacturer to start producing HBM Gen 1 memory in high volume back in 2015. However, the company is somewhat behind its rival Samsung...
23 by Anton Shilov on 8/4/2017
Toshiba Selects Japan-U.S. Consortium As Preferred Buyer For Memory Business
Toshiba has selected a consortium as their preferred bidder in the sale of Toshiba's memory business. The consortium is led by the Innovation Network Corporation of Japan, an investment...
13 by Billy Tallis & Anton Shilov on 6/21/2017
SK Hynix Advances Graphics DRAM: GDDR6 Added to Catalogue, GDDR5 Gets Faster
SK Hynix has added GDDR6 memory chips to its product catalogue, revealing their general specifications and launch timeframe sometimes in Q4 2017. As expected, the new GDDR6 ICs will...
17 by Anton Shilov on 5/20/2017
SK Hynix to Ship GDDR6 Memory for Graphics Cards by Early 2018
In a surprising move, SK Hynix has announced its first memory chips based on the yet-unpublished GDDR6 standard. The new DRAM devices for video cards have capacity of 8...
28 by Anton Shilov on 4/30/2017
SK Hynix Launches 72-Layer 256 Gb 3D TLC NAND with Increased Performance
SK Hynix has formally introduced its fourth-generation 3D NAND memory chips with 72 layers. Initially, the 3D TLC flash chips will be offered in 256 Gb configurations, but by...
3 by Anton Shilov on 4/14/2017
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