SK Hynix

South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese suppliers make 70% - 90% of three materials crucially required for manufacturing these components. As the two countries have a multi-decade-long dispute over compensation for World War II, Japan recently implemented new export rules that could disrupt supply of the important materials to South Korea, which in turn could hurt supply of DRAM, NAND, and various types of displays. Japan-based JSR, Showa Denko (SDK), and Shin-Etsu Chemical control 70% - 90% of the global supply of polyimides (used both for LCDs and OLEDs), photoresists, and high-purity hydrogen fluoride (used to make chips, such as LSI, DRAM...

SK Hynix Starts Production of 128-Layer 4D NAND, 176-Layer Being Developed

SK Hynix has announced it has finished development of its 128-layer 1 terabit 3D TLC NAND flash. The new memory features the company’s charge trap flash (CTF) design, along...

29 by Anton Shilov on 6/26/2019

SK Hynix Launches 2nd Gen Enterprise SSD: 72-Layer 3D NAND & In-House Controller

SK Hynix on Thursday introduced its 2nd generation enterprise-grade NVMe SSDs, which are based entirlely on the company's in-house SSD technology. The new drives offer 4 – 8 TB...

1 by Anton Shilov on 6/21/2019

Essencore 2 TB PCIe 4.0 SSD Enters The Game

One of the underlying themes of this year’s Computex was the number of PCIe 4.0 SSDs on display (or lack thereof). At present it seems that only drives powered...

6 by Ian Cutress on 6/5/2019

KLEVV Cras X RGB: Up to DDR4-4266, Coming at Computex

KLEVV, a partner business of SK Hynix, has always been rather conservative when it comes to speed bins of its memory modules for gamers and overclockers, partly because the...

8 by Anton Shilov on 5/15/2019

SK Hynix Begins Sampling of 96-Layer 1 Tb 3D QLC NAND

SK Hynix recently started sampling of its 1 Tb 96-layer NAND flash memory devices featuring its PUC 3D QLC architecture. The new 1 Tb chip will enable SSD makers...

9 by Anton Shilov on 5/10/2019

Boom to Bust: Memory Makers Plan to Cut NAND Flash Production

A true cyclical market, the NAND flash business goes through periods of booms and periods of busts. Following a very profitable boom year in 2018, it looks like the...

57 by Anton Shilov on 4/26/2019

SK Hynix to Start Using 2nd Gen 10nm-class DRAM Process Technology in 2H 2019

As part of their Q1'19 earnings announcement, SK Hynix has disclosed that the company will both increase its output of DRAM made using its 1st generation 10 nm-class manufacturing...

4 by Anton Shilov on 4/25/2019

SK Hynix Details DDR5-6400

SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...

10 by Anton Shilov on 2/26/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs

GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...

3 by Anton Shilov on 1/14/2019

JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack

JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...

15 by Anton Shilov on 12/19/2018

SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking

SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...

4 by Anton Shilov on 11/16/2018

SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM

SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...

29 by Anton Shilov on 11/15/2018

SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans

SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...

4 by Anton Shilov on 11/8/2018

U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm

The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...

58 by Anton Shilov on 11/1/2018

KLEVV Launches NEO N500 SSDs Based on SK Hynix’s 72-Layer 3D NAND

SK Hynix’s subsidiary KLEVV has introduced its new client SSDs based on the manufacturer’s 72-layer 3D NAND flash. The KLEVV NEO N500 drives are aimed at entry-level desktops and...

0 by Anton Shilov on 9/14/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Klevv Adds Kolors: RGB-Lit Enthusiast-Class Cras DIMMs & SSD Incoming

Klevv, a subsidiary of SK Hynix, has been around for quite a while targeting mass retail market with mainstream DRAM and SSD products. Recently Klevv decided to address the...

13 by Anton Shilov on 6/7/2018

Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019

Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...

31 by Anton Shilov on 5/3/2018

Log in

Don't have an account? Sign up now