SK Hynix

KLEVV, a partner business of SK Hynix, has always been rather conservative when it comes to speed bins of its memory modules for gamers and overclockers, partly because the most popular volume models are still in the DDR4-3000 to DDR4-3600 range. This is going to change sometimes later this year when the company launches its new models of Cras X RGB modules. First introduced at Computex 2018, KLEVV’s Cras X RGB family of memory modules for enthusiasts included 8 GB and 16 GB DIMMs rated for DDR4-3200 CL16 18-18-38 as well as DDR4-3466 CL17 19-19-39 at 1.35V operation. At this year’s Computex later this month the company will launch faster versions of its Cras X RGB modules. The expanded family of Cras X RGB memory sticks...

SK Hynix Begins Sampling of 96-Layer 1 Tb 3D QLC NAND

SK Hynix recently started sampling of its 1 Tb 96-layer NAND flash memory devices featuring its PUC 3D QLC architecture. The new 1 Tb chip will enable SSD makers...

9 by Anton Shilov on 5/10/2019

Boom to Bust: Memory Makers Plan to Cut NAND Flash Production

A true cyclical market, the NAND flash business goes through periods of booms and periods of busts. Following a very profitable boom year in 2018, it looks like the...

56 by Anton Shilov on 4/26/2019

SK Hynix to Start Using 2nd Gen 10nm-class DRAM Process Technology in 2H 2019

As part of their Q1'19 earnings announcement, SK Hynix has disclosed that the company will both increase its output of DRAM made using its 1st generation 10 nm-class manufacturing...

4 by Anton Shilov on 4/25/2019

SK Hynix Details DDR5-6400

SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...

10 by Anton Shilov on 2/26/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs

GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...

3 by Anton Shilov on 1/14/2019

JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack

JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...

15 by Anton Shilov on 12/19/2018

SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking

SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...

4 by Anton Shilov on 11/16/2018

SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM

SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...

29 by Anton Shilov on 11/15/2018

SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans

SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...

4 by Anton Shilov on 11/8/2018

U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm

The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...

58 by Anton Shilov on 11/1/2018

KLEVV Launches NEO N500 SSDs Based on SK Hynix’s 72-Layer 3D NAND

SK Hynix’s subsidiary KLEVV has introduced its new client SSDs based on the manufacturer’s 72-layer 3D NAND flash. The KLEVV NEO N500 drives are aimed at entry-level desktops and...

0 by Anton Shilov on 9/14/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Klevv Adds Kolors: RGB-Lit Enthusiast-Class Cras DIMMs & SSD Incoming

Klevv, a subsidiary of SK Hynix, has been around for quite a while targeting mass retail market with mainstream DRAM and SSD products. Recently Klevv decided to address the...

13 by Anton Shilov on 6/7/2018

Cadence and Micron Demo DDR5-4400 IMC and Memory, Due in 2019

Cadence this week introduced the industry’s first IP interface in silicon for the current provisional DDR5 specification developed by JEDEC. Cadence’s IP and test chip us fabricated using TSMC’s...

31 by Anton Shilov on 5/3/2018

SK Hynix Announces SSDs with 72-Layer 3D NAND ICs, Own Controllers

SK Hynix this week has said it has completed development of its enterprise-grade SSDs based on its 512 Gb 72-layer 3D TLC NAND chips as well as its own...

7 by Anton Shilov on 2/8/2018

SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs

SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...

9 by Anton Shilov on 2/6/2018

SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs

SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...

14 by Anton Shilov on 1/25/2018

Toshiba Signs Deal To Sell Memory Business

After being approved by the board of directors last week, Toshiba's deal to sell their memory business to a consortium led by Bain Capital has been signed and will...

9 by Billy Tallis on 9/28/2017

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