The final presentation of the Hot Chips event this week is from Intel, with a talk on its next generation Xeon Scalable platform, Cascade Lake. We recently learned about Intel’s Xeon Roadmap at the recent Datacenter Insider Summit, consisting of Cascade Lake in 2018, Cooper Lake in 2019, and Ice Lake in 2020, and now Hot Chips is the first chance for Intel to add some more information to the mix. Previously this would have been done at events like IDF, over several hours, but Intel only has 30 minutes on stage here. We picked up the slides before the presentation.
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