NAND

Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles, are qualified to operate in extreme temperature ranges and offer performance levels on par with today’s smartphones. Samsung’s new 256 GB eUFS device is based on the company’s planar MLC NAND flash memory produced using a 10 nm-class process technology as well as a proprietary UFS 2.1 controller supporting data refresh and temperature notification capabilities — both technologies are a part of the UFS 3.0 specification introduced last month and both are supported by Samsung’s 64 GB and 128 GB eUFS products for automotive applications as well as by competing devices. The 256 GB eUFS...

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...

10 by Anton Shilov on 1/31/2018

Integral Launches 512 GB microSDXC Card: UHC-I, U1, Class 10

Integral Memory has released the industry’s highest-capacity microSDXC memory card that one can buy today. Integral’s new 512 GB microSDXC V10, UHS-I U1 card can store half of a...

22 by Anton Shilov on 1/25/2018

Lite-On and Tsinghua Unigroup Create $100 Million Joint Venture for SSD Operations in China

Lite-On has announced that it had signed an agreement with Tsinghua Unigroup to establish a joint venture in China. The JV will develop and build SSDs in Suzhou. The...

6 by Anton Shilov on 1/5/2018

Toshiba Samples eUFS Devices for Vehicles: Extended Temps & Reliability Features

Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips...

15 by Anton Shilov on 12/18/2017

Western Digital, Toshiba And Bain Capital Settle Disputes Over Sale Of Toshiba Memory

Western Digital announced in a press conference this afternoon that they have reached a settlement agreement with Toshiba over Western Digital's objections to the sale of Toshiba's stake in...

11 by Billy Tallis on 12/12/2017

Micron Announces 32GB DDR4 NVDIMM-N Modules

Micron is announcing today their next generation of NVDIMM-N modules combining DDR4 DRAM with NAND flash memory to support persistent memory usage models. The new 32GB modules double the...

56 by Billy Tallis on 11/13/2017

ADATA Launches XPG SX6000 SSDs: 3D TLC, M.2, 512GB for $200

Update 11/2: ADATA notified us about the corrected MSRPs for the XPG SX6000 series SSDs, which are higher than the ones published. ADATA has launched its new 3D TLC-based SSD...

21 by Anton Shilov on 10/27/2017

Toshiba Signs Deal To Sell Memory Business

After being approved by the board of directors last week, Toshiba's deal to sell their memory business to a consortium led by Bain Capital has been signed and will...

9 by Billy Tallis on 9/28/2017

Toshiba To Proceed With Sale Of Memory Business To Consortium

The latest and possibly final round of bidding for Toshiba's memory business concluded today with Toshiba's board selecting a consortium led by private equity firm Bain Capital as the...

12 by Billy Tallis on 9/20/2017

Silicon Power Launches Mobile C50 USB Drive with USB Type-A, Micro-B and Type-C

This week Silicon Power has announced a rather unique series of USB flash drives. Dubbed the Mobile C50, the Swiss army knife-type USB flash drive is a 3-in-1 drive...

12 by Anton Shilov on 7/27/2017

Viking Ships UHC-Silo SSDs: 25 - 50 TB Capacity, Custom eMLC, SAS, $0.4 per GB

Viking Technology has started shipping their new lineup of ultra high capacity (UHC) SSDs designed to replace 3.5” HDDs in capacity-demanding applications that can take advantage of flash memory...

32 by Anton Shilov on 7/15/2017

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...

6 by Anton Shilov on 7/14/2017

Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND

Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...

17 by Anton Shilov on 7/6/2017

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...

36 by Anton Shilov on 7/3/2017

Joint Venture Dispute Between Toshiba and Western Digital Escalates, Toshiba Still Unable to Sell NAND Business

Due to serious financial difficulties, Toshiba is trying to sell off their stake of their very successful flash memory business to keep the rest of the company afloat. Western...

11 by Billy Tallis on 6/29/2017

Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products

Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...

18 by Anton Shilov on 6/28/2017

Toshiba Selects Japan-U.S. Consortium As Preferred Buyer For Memory Business

Toshiba has selected a consortium as their preferred bidder in the sale of Toshiba's memory business. The consortium is led by the Innovation Network Corporation of Japan, an investment...

13 by Billy Tallis & Anton Shilov on 6/21/2017

Western Digital Seeks To Intervene In Toshiba's Sale Of Memory Business

Western Digital, through its SanDisk subsidiary, is seeking arbitration to prevent Toshiba from selling off its stake in their flash memory joint venture without the consent of Western Digital...

12 by Billy Tallis on 5/23/2017

JEDEC: DDR5 to Double Bandwidth Over DDR4, NVDIMM-P Specification Due Next Year

JEDEC made two important announcements about the future of DRAM and non-volatile DIMMs for servers last week. Development of both is proceeding as planned and JEDEC intends to preview...

37 by Anton Shilov on 4/3/2017

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