NAND

Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms of wafer starts per month, but will enable Micron to continue adopting more advanced 3D NAND process technologies with a higher number of layers and bit density. The new Fab 10 Expansion is an integral part of Micron’s Fab 10 complex that was previously comprised of Fab 10N and Fab 10X. Officially, it's known that the new 3D NAND production facility is built on a 165,000 m2 land plot, however Micron is not disclosing much else about the usable cleanroom space or other features of the expansion. Micron is now installing equipment and expects to start production...

Western Digital: Nearly All NAND Capacities Resumed Normal Operations

Western Digital and its manufacturing partner Toshiba Memory Co. (TMC) had managed to resume normal operation of almost all of their joint production lines at their Yokkaichi Operations campus...

31 by Anton Shilov on 8/1/2019

Toshiba Memory To Rebrand As Kioxia

In 2017, Toshiba was forced to sell off its flash memory business to stave off bankruptcy. The memory business was spun off as Toshiba Memory Corporation and sold for...

17 by Billy Tallis on 7/18/2019

Supply of DRAM, NAND & Displays Could Be Disrupted by Japan & South Korea Dispute

South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese...

39 by Anton Shilov on 7/5/2019

Toshiba & WD NAND Production Hit By Power Outage: 6 Exabytes Lost

Toshiba Memory and Western Digital on Friday disclosed that an unexpected power outage in the Yokkaichi province in Japan on June 15 affected the manufacturing facilities that are jointly...

150 by Anton Shilov on 6/28/2019

Toshiba Memory & Western Digital Finalize Fab K1 Investment Agreement

Toshiba Memory and Western Digital on Friday announced that they had finalized a formal agreement regarding a joint investment in the K1 manufacturing facility near Kitakami, Iwate Prefecture, Japan...

1 by Anton Shilov on 5/20/2019

Toshiba Begins to Sample UFS 3.0 Drives: 96L 3D TLC NAND, Up to 2.9 GB/s

Toshiba said late on Tuesday that it had started to sample its first UFS 3.0 storage solution. The device is aimed at mobile applications and promises to offer performance...

0 by Anton Shilov on 1/23/2019

Western Digital Demonstrates 4TB USB-C Thumb Drive Prototype at CES 2019

At CES 2019, Western Digital is demonstrating a prototype of a 4TB thumb drive with a Type-C interface. To be more precise, the form factor is that of a...

19 by Ganesh T S on 1/8/2019

Intel Veteran Becomes Chairman of Toshiba Memory

Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...

3 by Anton Shilov on 10/11/2018

Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center

Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...

6 by Anton Shilov on 9/20/2018

Micron to Expand Its Fab 6 in Virginia, Build New R&D Center

Micron this week announced plans to expand production of DRAM and NAND memory at its fab in Manassas, Virginia. In total, Micron intends to invest $3 billion into the...

11 by Anton Shilov on 8/31/2018

Flash Memory Summit 2018, Yangtze Memory Technology Keynote Live Blog: Unleashing 3D NAND

The final talk of this session is from Yangtze Memory Technology (YMTC). We published their announcement this week, but they have set a very interesting talk for the show...

4 by Ian Cutress & Billy Tallis on 8/7/2018

Flash Memory Summit 2018, SK Hynix Keynote Live Blog: NAND Development

Second keynote of the session is SK Hynix

1 by Ian Cutress & Billy Tallis on 8/7/2018

Flash Memory Summit 2018, Micron Keynote Live Blog: QLC Flash

The afternoon keynote session has talks from Micron, SK Hynix, and YMTC, speaking all about future Flash products. This first talk is titled 'QLC Flash: Metting the Challenges of...

0 by Ian Cutress & Billy Tallis on 8/7/2018

Flash Memory Summit, Toshiba Keynote Live Blog

We're here at Flash Memory Summit! One of the first keynotes of the event is Toshiba, speaking about their use of Flash.

1 by Ian Cutress & Billy Tallis on 8/7/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Intel and Micron To Dissolve 3D XPoint Partnership After 2019

A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class...

19 by Ian Cutress on 7/16/2018

We Found a Prototype 4 TB Intel QLC SSD

The storage industry is getting exciting again. In order to increase capacity of NAND SSDs and lower costs, there are two different routes being taken: either increase the number...

48 by Anton Shilov on 6/9/2018

Toshiba Memory to Build New Fab to Produce BiCS 3D NAND

Toshiba Memory Corp., which is set to become independent from Toshiba in a few days, has announced their intention to start construction of a new BiCS 3D NAND fab...

7 by Anton Shilov on 5/29/2018

Western Digital: 96-Layer 3D NAND Progressing Well, Shipping to Retail Customers

Western Digital this month said that it had started shipments of its fourth-generation BiCS 3D NAND memory to some of its customers. The company did not disclose details, but...

30 by Anton Shilov on 5/29/2018

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