NAND

The storage industry is getting exciting again. In order to increase capacity of NAND SSDs and lower costs, there are two different routes being taken: either increase the number of bits per cell from 3bpc (TLC) to 4bpc (QLC) for a 33% increase, or increase the number of TLC layers per chip from 64 layers to 96 layers for a 50% increase. Each method has benefits and issues, however we have been waiting for the two technologies to actually be found on upcoming drives (rather than just on a press release). As part of the show we found a 4 TB SATA-based drive using a Maxio Technology controller and Intel's latest QLC NAND flash, as well as a drive each from Maxio and SMI...

Toshiba Memory to Build New Fab to Produce BiCS 3D NAND

Toshiba Memory Corp., which is set to become independent from Toshiba in a few days, has announced their intention to start construction of a new BiCS 3D NAND fab...

7 by Anton Shilov on 5/29/2018

Western Digital: 96-Layer 3D NAND Progressing Well, Shipping to Retail Customers

Western Digital this month said that it had started shipments of its fourth-generation BiCS 3D NAND memory to some of its customers. The company did not disclose details, but...

30 by Anton Shilov on 5/29/2018

Micron Starts Construction of Its Third NAND Fab in Singapore

Micron this week broke ground on its new fab in Singapore that will be dedicated to manufacturing 3D NAND flash memory. Set to be completed late next year, Micron...

11 by Anton Shilov on 4/6/2018

Unlimited 5 Year Endurance: The 100TB SSD from Nimbus Data

Nimbus Data on Monday introduced its new lineup of ultra-high capacity SSDs designed to compete against nearline HDDs in data centers. The ExaDrive DC drives use proprietary controllers and...

26 by Anton Shilov on 3/19/2018

Power Outage at Samsung’s Fab Destroys 3.5% of Global NAND Flash Output For March

A half-hour power outage at Samsung’s fab near Pyeongtaek, South Korea, disrupted production and damaged tens of thousands of processed wafers. Media reports claim that the outage destroyed as...

62 by Anton Shilov on 3/16/2018

Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek

Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands, and if unofficial...

16 by Anton Shilov on 3/1/2018

Samsung Begins Mass Production of 256 GB eUFS Devices for Automotive Applications

Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles...

6 by Anton Shilov on 2/12/2018

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...

13 by Anton Shilov on 1/31/2018

Integral Launches 512 GB microSDXC Card: UHC-I, U1, Class 10

Integral Memory has released the industry’s highest-capacity microSDXC memory card that one can buy today. Integral’s new 512 GB microSDXC V10, UHS-I U1 card can store half of a...

23 by Anton Shilov on 1/25/2018

Lite-On and Tsinghua Unigroup Create $100 Million Joint Venture for SSD Operations in China

Lite-On has announced that it had signed an agreement with Tsinghua Unigroup to establish a joint venture in China. The JV will develop and build SSDs in Suzhou. The...

6 by Anton Shilov on 1/5/2018

Toshiba Samples eUFS Devices for Vehicles: Extended Temps & Reliability Features

Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips...

15 by Anton Shilov on 12/18/2017

Western Digital, Toshiba And Bain Capital Settle Disputes Over Sale Of Toshiba Memory

Western Digital announced in a press conference this afternoon that they have reached a settlement agreement with Toshiba over Western Digital's objections to the sale of Toshiba's stake in...

11 by Billy Tallis on 12/12/2017

Micron Announces 32GB DDR4 NVDIMM-N Modules

Micron is announcing today their next generation of NVDIMM-N modules combining DDR4 DRAM with NAND flash memory to support persistent memory usage models. The new 32GB modules double the...

56 by Billy Tallis on 11/13/2017

ADATA Launches XPG SX6000 SSDs: 3D TLC, M.2, 512GB for $200

Update 11/2: ADATA notified us about the corrected MSRPs for the XPG SX6000 series SSDs, which are higher than the ones published. ADATA has launched its new 3D TLC-based SSD...

21 by Anton Shilov on 10/27/2017

Toshiba Signs Deal To Sell Memory Business

After being approved by the board of directors last week, Toshiba's deal to sell their memory business to a consortium led by Bain Capital has been signed and will...

9 by Billy Tallis on 9/28/2017

Toshiba To Proceed With Sale Of Memory Business To Consortium

The latest and possibly final round of bidding for Toshiba's memory business concluded today with Toshiba's board selecting a consortium led by private equity firm Bain Capital as the...

12 by Billy Tallis on 9/20/2017

Silicon Power Launches Mobile C50 USB Drive with USB Type-A, Micro-B and Type-C

This week Silicon Power has announced a rather unique series of USB flash drives. Dubbed the Mobile C50, the Swiss army knife-type USB flash drive is a 3-in-1 drive...

12 by Anton Shilov on 7/27/2017

Viking Ships UHC-Silo SSDs: 25 - 50 TB Capacity, Custom eMLC, SAS, $0.4 per GB

Viking Technology has started shipping their new lineup of ultra high capacity (UHC) SSDs designed to replace 3.5” HDDs in capacity-demanding applications that can take advantage of flash memory...

32 by Anton Shilov on 7/15/2017

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...

6 by Anton Shilov on 7/14/2017

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