NAND

The latest and possibly final round of bidding for Toshiba's memory business concluded today with Toshiba's board selecting a consortium led by private equity firm Bain Capital as the preferred bidder, over competing bids from Western Digital and Foxconn. Toshiba has spent most of 2017 trying to sell off their thriving flash memory business in order to offset devastating losses suffered by their Westinghouse nuclear power division. Those financial problems came to a head at the end of 2016 with Toshiba admitting that the losses could amount to several billion dollars, resulting in their stock price falling by more than 40% over a four day span and their bond ratings being downgraded by Moody's and S&P. As the magnitude of their problems became clearer, Toshiba...

Silicon Power Launches Mobile C50 USB Drive with USB Type-A, Micro-B and Type-C

This week Silicon Power has announced a rather unique series of USB flash drives. Dubbed the Mobile C50, the Swiss army knife-type USB flash drive is a 3-in-1 drive...

12 by Anton Shilov on 7/27/2017

Viking Ships UHC-Silo SSDs: 25 - 50 TB Capacity, Custom eMLC, SAS, $0.4 per GB

Viking Technology has started shipping their new lineup of ultra high capacity (UHC) SSDs designed to replace 3.5” HDDs in capacity-demanding applications that can take advantage of flash memory...

32 by Anton Shilov on 7/15/2017

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...

6 by Anton Shilov on 7/14/2017

Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND

Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...

17 by Anton Shilov on 7/6/2017

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...

36 by Anton Shilov on 7/3/2017

Joint Venture Dispute Between Toshiba and Western Digital Escalates, Toshiba Still Unable to Sell NAND Business

Due to serious financial difficulties, Toshiba is trying to sell off their stake of their very successful flash memory business to keep the rest of the company afloat. Western...

11 by Billy Tallis on 6/29/2017

Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products

Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...

18 by Anton Shilov on 6/28/2017

Toshiba Selects Japan-U.S. Consortium As Preferred Buyer For Memory Business

Toshiba has selected a consortium as their preferred bidder in the sale of Toshiba's memory business. The consortium is led by the Innovation Network Corporation of Japan, an investment...

13 by Billy Tallis & Anton Shilov on 6/21/2017

Western Digital Seeks To Intervene In Toshiba's Sale Of Memory Business

Western Digital, through its SanDisk subsidiary, is seeking arbitration to prevent Toshiba from selling off its stake in their flash memory joint venture without the consent of Western Digital...

12 by Billy Tallis on 5/23/2017

JEDEC: DDR5 to Double Bandwidth Over DDR4, NVDIMM-P Specification Due Next Year

JEDEC made two important announcements about the future of DRAM and non-volatile DIMMs for servers last week. Development of both is proceeding as planned and JEDEC intends to preview...

37 by Anton Shilov on 4/3/2017

Lexar Launches 'JumpDrive Tough' USB Drives up to 128GB: Focusing on Physical Endurance

Over the last week, Lexar has introduced a new series of USB flash drives with enhanced endurance. The new drives are built to survive in tough conditions, such as...

17 by Anton Shilov on 3/29/2017

Sony Announces SF-G UHS-II SD Cards: Up to Nearly 300 MB/s Read/Write Performance

Sony has announced its new lineup of SD cards for advanced 4K/8K, DSLR, and mirrorless cameras. The new SF-G-series memory cards use the UHS-II bus and one of Sony’s...

19 by Anton Shilov on 2/24/2017

Toshiba Samples 64-Layer 512 Gb BiCS 3D NAND, Announces 1 TB BGA SSD

Toshiba on Wednesday said that it had begun to sample its latest BiCS 3D NAND flash memory chips with 64 word layers and 512 Gb capacity. A co-development project...

8 by Anton Shilov on 2/23/2017

Micron 2017 Roadmap Detailed: 64-layer 3D NAND, GDDR6 Getting Closer, & CEO Retiring

At Micron's 2017 Analyst Conference yesterday in Scottsdale, Arizona, Micron executives provided updates on the status and future plans for all their major business units. While no new products...

44 by Billy Tallis on 2/3/2017

SK Hynix Lays Out Plans for 2017: 10nm-Class DRAM, 72-Layer 3D NAND

SK Hynix this week announced financial results for its fiscal year 2016 and also revealed general plans for 2017. As expected, the company intends to start volume production of...

12 by Anton Shilov on 1/28/2017

Toshiba Announces Plan to Sell Minority Stake In NAND Flash Production Business

This morning Toshiba has announced that they will be spinning off their chip production business as part of a broader plan to sell off a minority stake in the...

1 by Ryan Smith & Anton Shilov on 1/27/2017

Toshiba Is Studying The Possibility of Spinning Off NAND Flash Production

Toshiba on Wednesday confirmed that it is studying the possibility of splitting its NAND flash business into a separate company. While nothing has been decided as this point, the...

11 by Anton Shilov on 1/19/2017

SK Hynix to Build a New NAND Fab, Upgrade Existing DRAM Fab

SK Hynix on Thursday announced plans to build a new manufacturing facility to produce NAND flash memory in South Korea, and also upgrade its DRAM production plant in China...

15 by Anton Shilov on 12/23/2016

Micron 3D NAND Update: 2D and 3D NAND Bit Crossover, Gen 2 Hits Production

Micron last week made two announcements regarding its transition to 3D NAND memory. According to the company, the output of 3D NAND at its fabs has surpassed the output...

14 by Anton Shilov on 12/13/2016

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