DRAM

Samsung has completed development of its 3rd-generation 10 nm-class manufacturing process for DRAM as well as the first 8 Gb DDR4 chip that uses the technology. The 1z-nm process technology is said to be the world’s smallest process node for memory, and will enable Samsung to increase productivity without needing to go to extreme ultraviolet lithography (EUVL) at this time. The company plans to start volume production using the technology in the second half of 2019.

CXL Specification 1.0 Released: New Industry High-Speed Interconnect From Intel

With the battleground moving from single core performance to multi-core acceleration, a new war is being fought with how data is moved around between different compute resources. The Interconnect...

46 by Ian Cutress on 3/11/2019

SK Hynix Details DDR5-6400

SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...

10 by Anton Shilov on 2/26/2019

Advantech Unveils 32 GB SQRAM DDR4 DIMMs for HPC

Advantech, a maker of server-grade memory, storage, and other components and solutions, is introducing a new lineup of 32 GB unbuffered DDR4 memory modules. Designed for high-performance computing (HPC...

7 by Anton Shilov on 2/13/2019

Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to $3000

Corsair has released a range of 192 GB DDR4 kits to complement the workstation-focused Intel Xeon W-3175X processor which features 28 cores. The top kit from the new line-up...

9 by Gavin Bonshor on 2/12/2019

Keysight Reveals DDR5 Testing & Validation System

Keysight, an electronic measurement company, has introduced the industry’s first off-the-shelf testing and validation system for DDR5 DRAM. The N6475A DDR5 Tx compliance test software is aimed at developers...

23 by Anton Shilov on 2/6/2019

G.Skill Unveils Trident Z Royal Hexa-Channel 192 GB DDR4-4000 Kit for Xeon W-3175X

G.Skill has released the industry’s first hexa-channel DDR4 memory kits designed specifically for Intel’s 28-core Xeon W-3175X processor for extreme workstations. The top-of-the-range kit features a 192 GB capacity...

14 by Anton Shilov on 1/30/2019

GIGABYTE Adds Support for 128 GB of Memory to Z390 & C246 Motherboards

GIGABYTE has released UEFI BIOS updates for its motherboards based on Intel’s C246 and Z390 chipsets that enable support for 32 GB unbuffered memory modules from Samsung. This enables...

3 by Anton Shilov on 1/24/2019

Double Height DDR4: 32GB Modules from G.Skill and ZADAK Reviewed

Two memory module companies, G.Skill and ZADAK, have developed a new memory format with double capacity DDR4 memory. These new modules put the equivalent of two standard modules onto...

51 by Ian Cutress & Gavin Bonshor on 1/23/2019

ASUS Z390 Platforms Now Support 128 GB of Memory

ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...

8 by Anton Shilov on 1/22/2019

CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs

GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...

3 by Anton Shilov on 1/14/2019

CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD

One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...

5 by Gavin Bonshor on 1/10/2019

CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory

At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...

13 by Gavin Bonshor on 1/9/2019

Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86

It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...

152 by Ian Cutress on 12/12/2018

Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems

Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...

5 by Anton Shilov on 11/26/2018

Your Highness: G.Skill Trident Z Royal, Bling Factor 11

G.Skill this week has officially introduced its Trident Z Royal family of memory modules. This memory featuring crystalline light bars with RGB lighting and polished heat spreaders. The modules...

4 by Anton Shilov on 11/20/2018

SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking

SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...

4 by Anton Shilov on 11/16/2018

SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM

SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...

29 by Anton Shilov on 11/15/2018

In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK

One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...

19 by Ian Cutress on 11/9/2018

Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips

Micron this week announced that it had started mass production of its first LPDDR4X memory devices using its second-generation 10 nm-class process technology. The new memory devices offer standard...

11 by Anton Shilov on 11/8/2018

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