DC RAM Overclocking Performance

Memory overclocking can usually be approached in multiple ways. DDR4 Memory kits come supplied with integrated 'XMP 2.0' profiles which means users don't really need to do anything other than clicking a button inside the BIOS in order to achieve the memory kit's rated performance. However manual tweaking is required to go further.

The fine art of memory overclocking is a long and windy road for minimal performance gains. It almost becomes a performance piece, needing a seasoned expert to get the best out of it. However most users can at least adjust the frequency the primary latencies. The frequency which can be changed via the strap/multiplier and through the base clock generator is more common, while the timings are usually done as the second step once a stable frequency has been found. 

Both of the memory modules we have are equipped with Samsung B-die chips. These chips are often considered some of the best overclocking parts, however there is some natural speculation as to how they will perform in this double height form factor.

To measure the overclockability of the DC RAM, the stock performance with the XMP 2.0 profile applied on both the G.Skill TridentZ RGB DC and ZADAK Shield RGB DC 2x32 GB kits are used as a baseline. We exokired both pushing the frequency as high as could be managed, and then with latencies as tight as much as possible. As WinRAR 5.40 proved one of the more memory sensitive benchmarks in our list, we used this to highlight the performance, if any, from the DC memory.

Highest 24/7 Frequency at 16-16-16: DDR4-3500

The maximum overclock we managed to achieve with a voltage of 1.5 V on the DRAM for each kit is as follows:

G.Skill TridentZ RGB DC - DDR4-3500 16-16-16-38
ZADAK Shield RGB DC - DDR4-3500 16-16-16-38

We were unable to go beyond DDR4-3500 even with 18-18-18 sub-timings.

Best 24/7 Latencies at DDR4-3200: 12-12-12

The tightest timings while keeping the frequency at their XMP rating of DDR4-3200 with a voltage of 1.5 V on the DRAM is as follows:

G.Skill TridentZ RGB DC - DDR4-3200 12-12-12-32
ZADAK Shield RGB DC - DDR4-3200 12-12-12-28

Overall Reasonable Overclock: DDR4-3400 14-14-14 at 1.5 V

The highest achieved DRAM frequency achieved with tighter timing adjustments with a voltage of 1.5 V on each kit is as follows:

G.Skill TridentZ RGB DC - DDR4-3400 14-14-14-34
ZADAK Shield RGB DC - DDR4-3400 14-14-14-32

Encoding: WinRAR 5.40 - Overclocking Performance

As our maximum achieved overclocks show, there isn't much additional headroom available to push the dual capacity DRAM much further than the XMP 2.0 profiles already allow. Both the G.Skill and ZADAK kits allowed us to overclock up to DDR4-3500 with 16-16-16-38 at 1.5 V. Any attempt to go past DDR4-3500 would result in failed POST even with timings slackened as loose as up to CL18. When it came to tightening up the latency timings, both kits experienced similar timings with the G.Skill TridentZ RGB DC allowing for DDR4-3200 14-14-14-32, with the ZADAK Shield RGB DC giving slightly tighter tRAS timing with DDR4-3200 14-14-14-28.

Users thinking that overclocking will be as prosperous as others have achieved on DRAM in 1Rx8 or 2Rx8 featuring Samsung B-die ICs aren't going to be as happy with the headroom on these modules. The headroom available is limited and the performance displayed in our WinRAR test was mirrored here. On the G.Skill TridentZ RGB DC kit a total of 0.9 seconds with a mixture of frequency and timing adjustments equalling DDR4-3400 14-14-14-34 applied. Overclocking the ZADAK Shield RGB DC memory to DDR4-3400 14-14-14-32 proved the best settings that we tried with a reduction of 1.3 seconds. Answering any questions about the overclocking ability of the memory, our testing with the samples we received proved dreary in comparison to what's usually expected from Samsung B-die ICs.

Power Analysis Double Height DDR4 Conclusion
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  • prateekprakash - Thursday, January 24, 2019 - link

    Could you please mention the names of the motherboards which did not post with these memories?
    Also could you please try these with Intel 6xxx/ 7xxx series CPUs with 2xx chipsets ( z270, b250).
  • mito0815 - Thursday, January 24, 2019 - link

    Any thoughts on how scalable this apporach is? I mean...the obvious issues (heatsink fan clearance being one of them) aside, 4-row-high-DIMMs would look absolutely hilarious. I'd buy them. Just for the joke.
  • KarlKastor - Thursday, January 24, 2019 - link

    I don't get why there is a need for double height.
    There are lots of DIMMs in the market, that have 18 ICs per side on a regular DIMM.

    I think it's just marketing, to show visually they have something new. The Cooler occupies the space anyway. But don't get, why every Tech-website mention it's neccessary.
  • Targon - Thursday, January 24, 2019 - link

    I suspect it is all about the memory density. So, rather than trying to get 7nm fab process RAM, these companies are using less expensive chips and just increasing the size of the board to compensate, plus the need to connect the RAM chips on the DIMM. What sort of timings are on these things, 2T, 3T, or 4T for the command rate? How about the latency ratings?
  • KarlKastor - Friday, January 25, 2019 - link

    Mh? I talk not about the number of DRAM Dies. I speak just about the size of the PCB. What has lithographie to do with PCB size?
    Here u have 16 packages per side. There are a lot of normal sized DIMMs outside with that amount of packages.
  • Danvelopment - Friday, January 25, 2019 - link

    What are the use cases? I would have thought that, by the time you need those sort of capacities, you would be better served by a quad channel Xeon.
  • NoSoMo - Friday, January 25, 2019 - link

    Interesting -- now if they could just pair them with some 3D nand and allow hybrid RAM / storage like intel wants to do with optane. Perhaps it'd come in a variant that sees 16GB PC 3000 and a slot similar to M.2 with capacities that mirror that of NVMEs thus moving storage over to the RAM bus and freeing up the PCI bus. The modules would be L shaped so that the storage addition completes the form factor thus allowing it to retain the same profile as these taller units, vs having a module hanging off the side.
  • 13Gigatons - Wednesday, January 30, 2019 - link

    Maybe they could focus on lowering the price????

    Other then that what is the case use?
  • DPete27 - Tuesday, February 12, 2019 - link

    You can fit 2 SODIMMs using a single locking mechanism on each end within the limits of a mITX board. Surely that would be much easier and more universal.
    [img]https://lh3.googleusercontent.com/-L0fCpsbFSWA/We5...[/img]
  • ExclamationMediaLLC - Wednesday, July 10, 2019 - link

    Hi Ian and Gavin! Very helpful article! I’m building a SFF workstation using these modules. I want to remove the heat spreaders but I’m afraid of damaging the DIMMs. I see you guys managed it. How risky is it? Is there anything special I should know about removing the RGB lighting strips? (Yes, everyone, I know it will void the warranty)

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