Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips offer capacities from 16 GB to 128 GB (with a 256 GB option coming in Q2 2018), can handle extreme temperatures and support numerous features designed to improve their reliability and ensure consistent performance. The Toshiba eUFS storage devices for automotive applications are based on the company’s proven 128 Gb MLC NAND flash made using 15 nm process technology as well as an in-house developed controller. The devices are compliant with the UFS 2.1 HS-G3 specification, so they use two full-duplex HS-Gear3 lanes with 5.8 GT/s data transfer rate per lane and can offer a theoretical...
Samsung on Tuesday announced that it had initiated volume production of UFS NAND flash memory chips with 512 GB capacity based on its latest 64-layer 512 Gb V-NAND. The...11 by Anton Shilov on 12/5/2017
Toshiba has announced that it had started sample shipments of its latest UFS storage devices based on its 64-layer BICS3 3D TLC NAND memory. The new devices are compliant...12 by Anton Shilov on 12/4/2017
Samsung today introduced the world’s first flash memory cards in UFS form-factor. The cards are compliant with the UFS Card 1.0 specification and offer performance comparable to that of...37 by Anton Shilov on 7/7/2016
Interestingly enough, we’re seeing something of a division in the mobile storage space, as it seems that some OEMs are focusing their efforts on UFS for internal storage, while...23 by Joshua Ho on 2/25/2016
We've first heard about plans to adopt UFS (Universal Flash Storage) with the announcements of Toshiba and Qualcomm reported over a year ago. While the promised late 2014 schedule...31 by Andrei Frumusanu on 2/25/2015
Since they first started showing up on the market, most smartphones and tablets have used eMMC flash storage. While in some ways similar to the NAND flash used in...8 by Jarred Walton on 1/14/2014