I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking about on chip with new manufacturing technologies or new topologies, or between chips with new communication standards or connectivity paradigms that shake up both bandwidth and efficiency. Moving from monolithic designs to chiplets and stacked silicon requires a fundamental shift in thinking that most of the industry is not yet ready for, from silicon engineers to vendors who design the software that enables silicon engineers to do their thing. You might not be surprised that Intel has a whole department dedicated to these new interconnect and packaging technologies. Ramune Nagisetty works across Intel's broad range...
The best thing about manufacturing Field Programmable Gate Arrays (FPGAs) is that you can make the silicon very big. The nature of the repeatable unit design can absorb issues...31 by Dr. Ian Cutress on 11/5/2019
Last week Intel announced it has started shipments of its Stratix 10 DX FPGA to early adopters. The DC models are designed for next-generation cache-coherent accelerators for custom servers...37 by Anton Shilov & Dr. Ian Cutress on 10/3/2019
One of the key takeaways from Hot Chips last year was that Intel’s EMIB strategy was going to be fixed primarily in FPGAs to begin with. Intel instigated a...7 by Ian Cutress on 2/26/2018
On the back of Intel’s Technology and Manufacturing Day in March, the company presented another iteration of the information at an equivalent event in Beijing this week. Most of...52 by Ian Cutress on 9/19/2017
Today at Hot Chips we have a lot of interesting talks going on. First up is a talk on Intel's latest 14nm FPGA solution: Stratix 10 implementing HBM using...51 by Ian Cutress on 8/22/2017