Storage

Micron this week published its financial results for the third quarter of its fiscal 2018 (ended on May 31), which also included an update concerning its non-volatile memory products and projects. The company confirmed that it is on track to start volume shipments of 96-layer 3D NAND chips (3rd Gen 3D NAND) in the second half of calendar 2018, and said that development of its 4th Gen 3D NAND is proceeding as planned without participation of Intel. At the same time, Micron indicated that sales of its 3D XPoint memory were well below expectations, which hurt the company financially because its fab remained underutilized. 64-Layer 3D NAND Progressing Well, 96-Layer Is On Track At present Micron is ramping up production of its 64-layer 3D TLC NAND...

ADATA Launches XPG SX8200 SSDs Featuring 3D TLC NAND, SM2262 Controller

ADATA on Thursday formally launched its XPG SX8200-series SSDs, which it previously demonstrated at CES earlier this year. The new drives are based on one of the latest controllers...

3 by Anton Shilov on 3/23/2018

Intel Previews Optane Enterprise M.2 SSD

At the Open Compute Project Summit this week, Intel previewed their upcoming enterprise Optane SSD in the M.2 form factor, currently planned to be named the Optane SSD DC...

11 by Billy Tallis on 3/21/2018

Best SSDs: Q2 2018

Since the Holiday 2017 sales, SSD prices in general have declined a small amount. New models using 64-layer 3D TLC NAND flash memory are trickling in, with companies beyond...

30 by Billy Tallis on 3/21/2018

Seagate Announces Exos X14: a Helium-Filled 14 TB PMR HDD

Seagate this week formally introduced its first hard drive with 14 TB capacity aimed at cloud datacenters that does not use shingled magnetic recording. The new Exos X14 HDDs...

10 by Anton Shilov on 3/21/2018

Toshiba Announces KumoScale NVMe over Fabrics Software

Today, Toshiba is launching a new software solution for pooling NVMe-based storage in a datacenter environment. The new KumoScale software implements the NVMe over Fabrics protocol (NVMeoF) and allows...

2 by Billy Tallis on 3/20/2018

The Plextor M8V SATA SSD Review: Toshiba 3D TLC In a Mainstream Drive

Today we're taking a look at Plextor's M8V SSD. This is their latest entry-level SATA SSD and the first SATA drive from Plextor to use 64-layer 3D TLC NAND...

10 by Billy Tallis on 3/20/2018

Unlimited 5 Year Endurance: The 100TB SSD from Nimbus Data

Nimbus Data on Monday introduced its new lineup of ultra-high capacity SSDs designed to compete against nearline HDDs in data centers. The ExaDrive DC drives use proprietary controllers and...

26 by Anton Shilov on 3/19/2018

Toshiba Introduces Datacenter SSDs With 64L 3D NAND

Toshiba is announcing a trio of new enterprise SSD models intended for large-scale datacenter deployments. The new CD5, XD5 and HK6-DC respectively use 2.5" U.2, M.2 22110 and 2.5"...

0 by Billy Tallis on 3/19/2018

ADATA Announces XPG SX950U SATA SSD

ADATA has announced a replacement for their top SATA SSD, finally moving their SATA lineup entirely to 3D TLC NAND flash memory. The outgoing XPG SX950 (based on Micron...

0 by Billy Tallis on 3/14/2018

The Intel Optane SSD 800p (58GB & 118GB) Review: Almost The Right Size

Intel's first Optane products hit the market almost a year ago, putting the much-awaited 3D XPoint memory in the hands of consumers. Today, Intel broadens that family with the...

115 by Billy Tallis on 3/8/2018

Western Digital Announces Client NVMe SSDs With New In-House Controllers

Western Digital has announced their first client NVMe SSDs with their SanDisk 64-layer 3D TLC NAND. These drives are also the first to feature Western Digital's new in-house NVMe...

11 by Billy Tallis on 2/28/2018

Samsung 30.72 TB SSDs: Mass Production of PM1643 Begins

Update 2/21: Adding power consumption figures for the PM1643 drive, new features. Samsung this week announced that it has started mass production of its PM1643-series SSDs. These are monstrous data...

22 by Anton Shilov on 2/20/2018

TEKQ Rapide Thunderbolt 3 External SSD Review

Flash-based external direct-attached storage (DAS) devices have evolved rapidly over the last few years. Starting with simple thumb drives that could barely saturate USB 2.0 bandwidth, we now have...

33 by Ganesh T S on 2/20/2018

The Intel SSD DC P4510 SSD Review Part 1: Virtual RAID On CPU (VROC) Scalability

Today, Intel is introducing their 64-layer 3D TLC NAND to the enterprise SSD market with the new Intel SSD DC P4510 NVMe drive. They are also finally giving us...

20 by Billy Tallis on 2/15/2018

The Latest High-Capacity M.2: The Samsung 860 EVO 2TB SSD, Reviewed

The Samsung 860 EVO is the mainstream side of Samsung's new generation of consumer SATA SSDs, though our 2TB M.2 drive is a bit of a niche product. Like...

37 by Billy Tallis on 2/14/2018

Samsung Begins Mass Production of 256 GB eUFS Devices for Automotive Applications

Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles...

6 by Anton Shilov on 2/12/2018

Patriot Demos Viper M.2 SSDs with Phison E12, Up to 2 TB

In January, Patriot demonstrated its upcoming Viper M.2-branded high-end SSDs. The new drives are powered by Toshiba’s 64-layer BICS 3D NAND flash memory and Phison’s latest PS5012-E12 controller. The...

2 by Anton Shilov on 2/8/2018

The Crucial MX500 500GB SSD Review: A Second Look

After an initial launch of just the 1TB capacity, the full Crucial MX500 lineup is now on the market, but facing new competitors. We look at how the more...

24 by Billy Tallis on 2/2/2018

Plextor Launches M8V SATA SSD

Plextor has introduced the M8V series, their latest budget SATA SSDs, now with 64-layer 3D TLC NAND. Plextor's budget SATA drives tends to use whatever controller and NAND combination...

11 by Billy Tallis on 2/1/2018

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...

13 by Anton Shilov on 1/31/2018

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