Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take a longer time long to develop and are expensive to make. But designing 2.5D multi-die chips has its own peculiarities, which is why Samsung Foundry and its rivals offer their clients a special 2.5D-IC Multi-Die Integration (MDI) design flow that incorporates analysis and implementation for early-stage system-level pathfinding to help overcome potential issues. This month support for Samsung 2.5D-IC MDI flow was added into Synopsys’ chip development software to simplify development process for engineers. Samsung Foundry currently offers 2.5D-IC MDI flow for chips produced using its 7LPP (7 nm with several EUV layers) fabrication process and...

Samsung & TSMC Develop 8nm & 7nm Automotive-Grade Nodes

As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...

29 by Anton Shilov on 10/14/2019

New Tools & IP Accelerate Development of 5nm Arm ‘Hercules’ SoCs

Arm, Synopsys, and Samsung Foundry have developed a set of optimized tools and IP that will enable chip designers to build next-generation SoCs based on Arm’s Hercules processor cores...

8 by Anton Shilov on 10/10/2019

Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track

Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...

42 by Anton Shilov on 7/31/2019

Samsung’s 5nm EUV Technology Gets Closer: Tools by Cadence & Synopsys Certified

Samsung Foundry has certified full flow tools from Cadence and Synopsys for its 5LPE (5 nm low-power early) process technology that uses extreme ultraviolet lithography (EUV). Full flow design...

13 by Anton Shilov on 7/8/2019

Synopsys to Accelerate Samsung’s 7nm Ramp with Yield Explorer Platform

Synopsys has announced an acceleration of development on its yield learning platform designed to speed up ramp up of chips made using Samsung Foundry’s 7LPP (7 nm low power...

16 by Anton Shilov on 7/4/2019

Samsung to Invest $115 Billion in Foundry & Chip Businesses by 2030

Being among the largest contract makers of semiconductors and among leading developers of chips for various applications, Samsung Electronics wants to become the world’s leader in these industries. To...

27 by Anton Shilov on 4/24/2019

Samsung Completes Development of 5nm EUV Process Technology

Samsung Foundry this week announced that it has completed development of its first-generation 5 nm fabrication process (previously dubbed 5LPE). The manufacturing technology uses extreme ultraviolet lithography (EUVL) and...

21 by Anton Shilov on 4/17/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

IBM to use Samsung 7nm EUV for Next-Gen POWER and z CPUs

IBM has announced it has signed an agreement with Samsung Foundry to produce its next-generation processors. This includes processors for IBM Power Systems, IBM z, and LinuxONE systems, all...

24 by Anton Shilov on 12/21/2018

Samsung Starts Mass Production of Chips Using Its 7nm EUV Process Tech

Samsung Foundry on Wednesday said that it had started production of chips using its 7LPP manufacturing technology that uses extreme ultraviolet lithography (EUVL) for select layers. The new fabrication...

42 by Billy Tallis & Anton Shilov on 10/17/2018

Samsung Foundry Updates: 8LPU Added, EUVL on Track for HVM in 2019

Samsung recently hosted its Samsung Foundry Forum 2018 in Japan, where it made several significant foundry announcements. Besides reiterating plans to start high-volume manufacturing (HVM) using extreme ultraviolet lithography...

29 by Anton Shilov on 9/6/2018

Arm and Samsung Extend Artisan POP IP Collaboration to 7LPP and 5LPE Nodes

Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. Under the terms of the agreement, Arm will offer Samsung Foundry...

16 by Anton Shilov on 7/6/2018

Samsung to Pay $400 Million for Infringing FinFET Patent

A federal jury in Texas ordered Samsung Electronics to pay $400 million to a South Korean university for infringing one of fundamental patents related to double gate FinFET transistors...

33 by Anton Shilov on 6/19/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

24 by Anton Shilov on 5/24/2018

Samsung Starts Mass Production of Chips Using 10nm Low Power Plus (10LPP) Process Tech

Samsung Foundry on Wednesday revealed that it has started mass production of SoC products using its second generation 10 nm Low Power Plus (10LPP) fabrication technology. The new manufacturing...

10 by Anton Shilov on 11/29/2017

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