Memory

GlobalFoundries and SiFive announced on Tuesday that they will be co-developing an implementation of HBM2E memory for GloFo's 12LP and 12LP+ FinFET process technologies. The IP package will enable SoC designers to quickly integrate HBM2E support into designs for chips that need significant amounts of bandwidth. The HBM2E implementation by GlobalFoundries and SiFive includes the 2.5D packaging (interposer) designed by GF, with the HBM2E interface developed by SiFive. In addition to HBM2E technology, licensees of SiFive also gain access to the company’s RISC-V portfolio and DesignShare IP ecosystem for GlobalFoundries’ 12LP/12LP+, which will enable SoC developers to build RISC-V-based devices GloFo's advanced fab technology. GlobalFoundries and SiFive suggest that the 12LP+ manufacturing process and the HBM2E implementation will be primarily used for artificial intelligence training and...

GeIL Demonstrates DDR4-5000 Memory Modules: Not for Sale

The rather long lifespan of DDR4 memory has allowed manufacturers to learn how to build modules running at speeds and voltages well above those specified by JEDEC’s standard. Nowadays...

4 by Anton Shilov on 6/5/2019

ADATA Demonstrates 32 GB DDR4 Modules, Built on Micron 16 Gb

Earlier this year Intel enabled support of high-capacity 32 GB memory modules based on 16 Gb memory chips on select client platforms for enthusiasts and prosumers, but until recently...

3 by Anton Shilov on 6/4/2019

Crucial 32 GB DDR4 Modules Found in an ASRock System

In a rather unexpected turn of events, Crucial has unveiled its first 32 GB DDR4 UDIMMs, which are based on Micron's yet-to-be-announced 16 Gb memory chips. The DIMMs will...

10 by Anton Shilov on 6/3/2019

Antec Unsheathes Katana: A New DDR4 Memory Series for Enthusiasts

In the market of PC components for enthusiasts and modders, Antec is trying to find a market to expand with a set of tools that it knows the best...

10 by Anton Shilov on 5/29/2019

Toshiba Memory & Western Digital Finalize Fab K1 Investment Agreement

Toshiba Memory and Western Digital on Friday announced that they had finalized a formal agreement regarding a joint investment in the K1 manufacturing facility near Kitakami, Iwate Prefecture, Japan...

1 by Anton Shilov on 5/20/2019

GeIL Launches Evo Spear Phantom Gaming Edition Memory, Designed For SFF Systems

Following on from a wide range of ASRock Phantom Gaming branded products, memory manufacturer GeIL has announced its new Evo Spear Phantom Gaming Edition memory, which is designed for...

7 by Gavin Bonshor on 5/17/2019

KLEVV Cras X RGB: Up to DDR4-4266, Coming at Computex

KLEVV, a partner business of SK Hynix, has always been rather conservative when it comes to speed bins of its memory modules for gamers and overclockers, partly because the...

8 by Anton Shilov on 5/15/2019

Samsung Samples 32 Gb DDR4 Memory Chips

Samsung recently began sampling of its DDR4 memory chips featuring a 32 Gb capacity. The new products will simplify production of high-capacity memory modules that use multiple DRAM packages.

8 by Anton Shilov on 5/15/2019

Samsung to End B-Die DDR4: The Overclockers' Favorite

For many years leading DRAM module manufacturers have used Samsung’s B-die 8 Gb memory chips for their fastest and most advanced DIMMs. This quarter Samsung intends to discontinue production...

15 by Anton Shilov on 5/14/2019

SMART Modular Announces 32 GB SO-DIMMs for Extreme Environments

SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.

2 by Anton Shilov on 5/9/2019

Micron to Pay Intel $1.3B to $1.5B for IM Flash Stake

Earlier this year, Micron announced their intention to buy out Intel's stake of their memory technology joint venture, IM Flash Technologies. Now, as the process gets underway, Micron is...

26 by Anton Shilov on 5/8/2019

SK Hynix to Start Using 2nd Gen 10nm-class DRAM Process Technology in 2H 2019

As part of their Q1'19 earnings announcement, SK Hynix has disclosed that the company will both increase its output of DRAM made using its 1st generation 10 nm-class manufacturing...

4 by Anton Shilov on 4/25/2019

HyperX Releases Two New Predator 16 GB Memory Kits: DDR4-4266 and DDR4-4600

HyperX has unveiled two new kits of DDR4 memory from its Predator range, offering speeds of DDR4-4266 and DDR4-4600. The new kits come in 2 x 8 GB sets...

10 by Gavin Bonshor on 4/25/2019

The G.Skill Royal Storage Box, Now On Sale: For All Your Royal Memories

Throughout the years we've seen the evolution of the Trident Z range from G.Skill which currently offers users with three different designs of DDR4 memory to choose from. This...

16 by Gavin Bonshor on 4/12/2019

Intel To Align 3rd Generation Optane DCPMM with DDR5: R&D in New Mexico

At Intel’s Data-Centric Innovation Day, Intel clarified with us where it sits in relation to its Optane DC Persistent Memory Strategy.

24 by Ian Cutress on 4/10/2019

Pricing of Intel’s Optane DC Persistent Memory Modules Leaks: From $6.57 Per GB

At least two retailers from the US on Friday have started to take pre-orders on Intel’s Optane DC Persistent Memory modules and therefore had to reveal their prices. Today...

58 by Anton Shilov on 4/5/2019

Kingston Reveals DDR4-2933 Registered DIMMs for Cascade Lake-SP

Coinciding with the launch of Intel’s Xeon ‘Cascade Lake-SP’ platform, Kingston on Tuesday announced its new Server Premier registered DIMMs designed for the latest servers. The modules offer data...

1 by Anton Shilov on 4/2/2019

Samsung Develops Smaller DDR4 Dies Using 3rd Gen 10nm-Class Process Tech

Samsung has completed development of its 3rd-generation 10 nm-class manufacturing process for DRAM as well as the first 8 Gb DDR4 chip that uses the technology. The 1z-nm process...

28 by Anton Shilov on 3/21/2019

Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps

Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well...

25 by Anton Shilov on 3/20/2019

Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones

Samsung said late on Wednesday that it had started volume production of 12 GB LPDDR4X-4266 memory for high-end smartphones. The chip is the highest-density DRAM for mobile applications. The...

19 by Anton Shilov on 3/14/2019

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