Memory

Samsung has quietly added 32 GB unbuffered DDR4 memory modules to its lineup of products. The UDIMMs are based on the company’s 16 Gb chips, which were introduced earlier this year that are already used for 32 GB SO-DIMMs as well as 64 GB RDIMMs. Samsung’s 32 GB UDIMM is rated to operate at DDR4-2666 date rates at the DDR4 standard voltage of 1.2 V. Samsung does not disclose timings, but since the company sells its own memory modules mainly to large PC OEMs, it is highly likely that the 32 GB UDIMM uses the standard JEDEC latencies for DDR4-2666 (i.e., CL17 17-17 or higher). 32 GB UDIMMs will enable system integrators and PC enthusiasts to build PCs with 128 GB of memory using motherboards with...

Samsung Demos 64 GB RDIMM Based on 16 Gb Chips, Promises 256 GB LRDIMMs

Samsung is demonstrating its 64 GB DDR4 memory module based on 16 Gb chips this week at the OCP U.S. Summit. The 64 GB RDIMM that the company is...

11 by Anton Shilov on 3/22/2018

Power Outage at Samsung’s Fab Destroys 3.5% of Global NAND Flash Output For March

A half-hour power outage at Samsung’s fab near Pyeongtaek, South Korea, disrupted production and damaged tens of thousands of processed wafers. Media reports claim that the outage destroyed as...

62 by Anton Shilov on 3/16/2018

Samsung Preps to Build Another Multi-Billion Dollar Memory Fab Near Pyeongtaek

Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands, and if unofficial...

16 by Anton Shilov on 3/1/2018

Apacer Adds DDR4-3600 CL17 and DDR4 3466 CL16 Memory to Commando Series

The new Apacer Commando series DDR4 comes in 16 GB (2x8GB) dual-channel kits with frequencies reaching up to DDR4-3466 CL16 and DDR4-3600 CL17. The sticks were announced late last...

13 by Joe Shields on 2/26/2018

Chinese Xi’an UniIC Semiconductors Starts to Sell DDR4 Chips and Modules

Xi’an UniIC Semiconductors, a memory producer based in China, has started to sell DDR4 DRAM chips and modules that were developed and made in-house. This is the first time...

30 by Anton Shilov on 2/24/2018

Gen-Z Interconnect Core Specification 1.0 Published

The first major release of the Gen-Z systems interconnect specification is now available. The Gen-Z Consortium was publicly announced in late 2016 and has been developing the technology as...

23 by Billy Tallis on 2/13/2018

SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs

SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...

9 by Anton Shilov on 2/6/2018

SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs

SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...

14 by Anton Shilov on 1/25/2018

Samsung Updates on GDDR6 Portfolio: 8 Gb and 16 Gb at Multiple Speeds

Samsung has issued an update to the GDDR6 announcement earlier this month. The company’s GDDR6 lineup will include chips featuring 8 Gb and 16 Gb capacities as well as...

19 by Anton Shilov on 1/25/2018

Micron, Rambus, & Others Team Up To Spur GDDR6 Adoption in Non-GPU Products

For regular AnandTech readers, the drums of GDDR6 have been beating loudly for most of the last year now. The new memory standard replaces the venerable GDDR5 memory, which...

15 by Ryan Smith on 1/23/2018

HyperX at CES 2018: Predator DDR4 with IR Sensors for Better RGB Sync

HyperX announced it has designed IR communication channels into each of their new HyperX Predator DDR4 RGB modules which will allow multiple modules to sync in LED lighting. In...

10 by Joe Shields on 1/19/2018

Samsung Starts Mass Production of 16Gb GDDR6 Memory ICs with 18 Gbps I/O Speed

This week, Samsung has announced that it has started mass production of its GDDR6 memory chips for next-generation graphics cards and other applications. The new chips will be available...

27 by Anton Shilov on 1/18/2018

ADATA at CES 2018: Jellyfish DRAM

LAS VEGAS, NV – Over the years, DRAM heatsinks have gone from non-existent, to gaudy, to death traps with jagged edges, to some form of LED hell. In the...

19 by Ian Cutress on 1/16/2018

Samsung Starts Production of HBM2 “Aquabolt” Memory: 8 GB, 2.4 Gbps

Samsung this week announced that it had started mass production of its second-generation HBM2 memory code-named “Aquabolt”. The new memory devices have 8 GB capacity and operate at 2.4...

17 by Anton Shilov on 1/11/2018

ADATA Unveils New XPG RGB DDR4 Kits: Spectrix D60 4600MHz & Spectrix DS40 SO-DIMMs with LEDs

LAS VEGAS, NV — At CES 2018 this week, ADATA is showcasing two new XPG DDR4 memory models with RGB LEDs: the Spectrix D60 RGB DDR4 and Spectrix DS40...

7 by Nate Oh on 1/10/2018

G.Skill Launches Sniper X Memory: Up to DDR4-3600, Three Camouflage Designs

G.Skill has introduced a new lineup of memory modules primarily aimed at modders rather than enthusiasts. The new Sniper X DIMMs come with three different military-themed heat spreaders. This...

9 by Anton Shilov on 1/6/2018

Speedy SO-DIMMs: G.Skill Launces 64 GB Kit at DDR4-3466 CL17

Over the past couple of months Corsair and G.Skill have introduced multiple 32 GB enthusiast-grade SO-DIMM memory kits for ASRock’s X299E-ITX/ac motherboard, gradually increasing the data transfer rates from...

6 by Anton Shilov on 1/3/2018

Micron Finishes GDDR6 Internal Qualification, Eyes H1'2018 Mass Production

With rumors swirling pretty widely that the next generation of video cards from both vendors will be based around GDDR6 memory, there’s understandably a lot of interest in the...

15 by Ryan Smith on 12/21/2017

Keeping it Quick: G.Skill Launches a 32 GB Quad-Channel DDR4-4000 SO-DIMM Kit at CL18

ASRock’s X299E-ITX/ac is the only Mini-ITX motherboard for Intel’s latest Core i7/Core i9 processors, and also the only consumer motherboard that requires enthusiast-class quad-channel SO-DIMM kits. The appeal of...

3 by Anton Shilov on 12/21/2017

Samsung Starts Production of 8 Gb DDR4-3600 ICs Using 2nd Gen 10nm-Class Tech

Samsung late on Wednesday said that it had initiated mass production of DDR4 memory chips using its second generation '10 nm-class' fabrication process. The new manufacturing technology shrinks die...

24 by Anton Shilov on 12/20/2017

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