Memory

Patriot has expanded its memory offerings for enthusiasts with a brand-new family of products, the Viper 4 Blackout. The new lineup supports data transfer rates of up to 4000 MT/s and is tested for compatibility with AMD’s latest Ryzen 3000/X570 desktop platform. Equipped with matte black aluminum heat spreaders, Patriot’s Viper 4 Blackout memory will be available as 8GB and 16 GB dual-channel kits rated to operate in DDR4-3000 CL16, DDR4-3200 CL16, DDR4-3600 CL17, and DDR4-4000 CL19 modes at 1.35 Volts. Patriot’s Viper 4 Blackout memory modules use a custom 10-layer black PCB to guarantee great signal integrity, but the company does not disclose which chips it uses for its new DIMMs. Meanwhile, by default the modules come with a standard DDR4-2133 JEDEC profile, but they...

Intel to Support 128GB of DDR4 on Core 9th Gen Desktop Processors

One of today’s announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up...

24 by Ian Cutress on 10/15/2018

G.Skill Announces DDR4-4800 and DDR4-4500 Kits for Z390 Boards

Every major CPU platform announcement brings a host of new motherboards and faster memory modules to the market. The launch of Intel’s 9th Gen Core processors and Z390 chipset...

30 by Anton Shilov on 10/12/2018

Intel Veteran Becomes Chairman of Toshiba Memory

Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...

3 by Anton Shilov on 10/11/2018

G.Skill Unveils 32 GB Trident Z RGB DC DDR4: Double Height, Double Capacity Memory

G.Skill has announced its new 32 GB “Double Capacity” memory modules. The Trident Z RGB DC DIMMs are compatible only with select Z390 motherboards from ASUS, and while they...

7 by Anton Shilov on 10/11/2018

Colorful Enters DRAM Module Business: Generic Colorfire & Custom iGame DIMMs

Colorful has introduced its first memory modules, officially adding a new product category that will complement its graphics cards, motherboards, and SSDs. The initial lineup consists of generic DIMMs...

4 by Anton Shilov on 10/1/2018

Double Height, Double Capacity DDR4? ZADAK's New 32 GB UDIMMs

ZADAK, a maker of memory modules from Taiwan, has reportedly published photos of its upcoming unbuffered memory modules featuring a 32 GB capacity. The UDIMMs and SO-DIMMs are the...

22 by Anton Shilov on 9/28/2018

Team Group's Quick Memory: T-Force Xtreem DDR4-4300 / DDR4-4500 CL18

Team Group has introduced its new dual-channel DDR4 memory kits for overclockers - the new T-Force Xtreem kits operate at 4300 MT/s and 4500 MT/s data transfer rates. Team Group’s...

13 by Anton Shilov on 9/20/2018

Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center

Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...

6 by Anton Shilov on 9/20/2018

Samsung Adds 32 GB UDIMMs to Memory Lineup

Samsung has quietly added 32 GB unbuffered DDR4 memory modules to its lineup of products. The UDIMMs are based on the company’s 16 Gb chips, which were introduced earlier...

19 by Anton Shilov on 9/5/2018

Micron to Expand Its Fab 6 in Virginia, Build New R&D Center

Micron this week announced plans to expand production of DRAM and NAND memory at its fab in Manassas, Virginia. In total, Micron intends to invest $3 billion into the...

11 by Anton Shilov on 8/31/2018

Hot Chips 2018: Nanotubes as DRAM from Nantero, a Live Blog

Lots of different types of 'RAM' have been in the news, most noticably Intel's Optane memory and a couple of weeks ago at Flash Memory Summit we had the...

19 by Ian Cutress on 8/21/2018

Inno3D Releases iChill Memory Modules with RGB LEDs, Up to DDR4-4000

Inno3D is primarily known for its graphics cards featuring highly custom cooling systems, but apparently the company has decided to expand its business beyond that. This week Inno3D introduced...

2 by Anton Shilov on 8/14/2018

Flash Memory Summit, Western Digital Keynote Live Blog

Second Keynote for us: Western Digital

0 by Ian Cutress & Billy Tallis on 8/7/2018

MRAM Developer Day, IBM Keynote Live Blog

Third Keynote in this session is from IBM Research: STT-MRAM is Ready for Applications Today.

0 by Ian Cutress on 8/6/2018

MRAM Developer Day, GlobalFoundries Keynote Live Blog

Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.

1 by Ian Cutress on 8/6/2018

MRAM Developer Day, Everspin Keynote: The MRAM Revolution (9:15am PT, 4:15pm UTC)

Prior to Flash Memory Summit, the first order of business is the MRAM Developer Day. The key talks today revolve around Everspin, a leader in MRAM Technology, GlobalFoundries, and...

3 by Ian Cutress & Billy Tallis on 8/6/2018

Yangtze Memory Unveils Xtacking Architecture for 3D NAND: Up to 3 Gbps I/O

Yangtze Memory Technologies Co. (YMTC) on Monday unveiled key details regarding its Xtacking architecture that will be used for its upcoming 3D NAND flash memory chips. The company's technology...

7 by Anton Shilov on 8/6/2018

SK Hynix Set to Build a New Memory Fab

SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...

16 by Anton Shilov on 7/30/2018

Samsung Starts Production of 16 Gb LPDDR4X Chips Using 2nd Gen 10nm Tech

Samsung this week announced that it has begun manufacturing its new LPDDR4X memory chips using its second-generation 10 nm-class fabrication process (which is traditionally called 1y nm). The new...

12 by Anton Shilov on 7/27/2018

Toshiba Begins to Construct New BiCS 3D NAND Fab in Iwate Prefecture

Toshiba Memory Corp. this week held a groundbreaking ceremony for its new BiCS 3D NAND flash memory fab, which is located in Japan's Iwate prefecture. Toshiba anticipates construction to...

5 by Anton Shilov on 7/25/2018

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