5nm

Last week, TSMC made two important announcements concerning its progress with extreme ultraviolet lithography (EUVL). First up, the company has successfully taped out its first customer chip using its second-generation 7 nm process technology, which incorporates limited EUVL usage. Secondly, TSMC disclosed plans to start risk production of 5 nm devices in April. First 7 nm EUV Chip Tapes Out at TSMC TSMC initiated high-volume manufacturing of chips using its first generation 7 nm fabrication process (CLN7FF, N7) in April. N7 is based around deep ultraviolet (DUV) lithography with ArF excimer lasers. By contrast, TSMC’s second-generation 7 nm manufacturing technology (CLN7FF+, N7+) will use extreme ultraviolet lithography for four non-critical layers, mostly in a bid to speed up production and learn how to use ASML’s Twinscan...

Samsung Foundry Updates: 8LPU Added, EUVL on Track for HVM in 2019

Samsung recently hosted its Samsung Foundry Forum 2018 in Japan, where it made several significant foundry announcements. Besides reiterating plans to start high-volume manufacturing (HVM) using extreme ultraviolet lithography...

29 by Anton Shilov on 9/6/2018

Arm and Samsung Extend Artisan POP IP Collaboration to 7LPP and 5LPE Nodes

Arm and Samsung Foundry this week announced plans to extend their collaboration to 7LPP and 5LPE process technologies. Under the terms of the agreement, Arm will offer Samsung Foundry...

5 by Anton Shilov on 7/6/2018

GlobalFoundries Gives 7 nm Capacity Update, Mulls Skipping 5 nm

High-ranking executives of GlobalFoundries this month gave several updates concerning future plans of the contract maker of semiconductors. As it appears, in a bid to provide more tangible advantages...

19 by Anton Shilov on 5/31/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

24 by Anton Shilov on 5/24/2018

TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains

At a special event last week, TSMC announced the first details about its 5 nm manufacturing technology that it plans to use sometime in 2020. CLN5 will be the...

10 by Anton Shilov on 5/8/2018

TSMC Kicks Off Volume Production of 7nm Chips

TSMC last week announced that it had started high volume production (HVM) of chips using their first-gen 7 nm (CLN7FF) process technology. The contract maker of semiconductors says it...

63 by Anton Shilov on 4/24/2018

Change of Strategy: A New GlobalFoundries CEO in Dr. Thomas Caulfield

In a surprising move, GlobalFoundries has announced that its CEO is stepping down. Sanjay Jha, who lead the world’s second largest foundry for four years, was in the past...

15 by Anton Shilov on 3/15/2018

TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...

26 by Anton Shilov on 1/31/2018

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