AM5 Chipsets: X670 and B650, Built by ASMedia

Finally, let’s talk about the chipsets that are going to be driving the new AM5 platform. Kicking things off, we have the B650 and X670 chipsets, as well as their Extreme variations. Since AMD is starting the rollout of their new platform with their high-end CPUs, they are matching this with the rollout of their high-end chipsets.

For this week’s launch, the initial boards available are all from the X670 family. B650 boards will, in turn, be coming next month. We’ll break down the difference between the two families below, but at a high level, X670 offers more I/O options than B650. And while not strictly a feature of the chipset, the market segmentation is such that the bulk of high-end AM5 boards – those boards with a massive amount of VRMs and other overclocker/tweaker-friendly features – will be X670 boards.

That said, for simplicity’s sake we’re going to start with the B650 chipset, and build up from there.

AMD AM5 Chipset Comparison
Feature X670E X670 B650E B650
CPU PCIe (PCIe) 5.0 (Essentially Mandatory) 4.0
(5.0 Optional)
5.0 (Essentially Mandatory) 4.0
(5.0 Optional)
CPU PCIe (M.2 Slots) At Least 1 PCIe 5.0 Slot
Total CPU PCIe Lanes 24
Max Chipset PCIe Lanes 12x 4.0 + 8x 3.0 8x 4.0 + 4x 3.0
SuperSpeed 10Gbps USB Ports 4 CPU + 12 Chipset
or
4 CPU + 10 Chipset + 1 Chipset 20Gbps
or
4 CPU + 8 Chipset + 2 Chipset 20Gbps

4 CPU + 6 Chipset
or
4 CPU + 4 Chipset + 1 Chipset 20Gbps

DDR5 Support Quad Channel (128-bit bus)
Speeds TBD
Wi-Fi 6E Yes
CPU Overclocking Support Y Y Y Y
Memory Overclocking Support Y Y Y Y
Available September 2022 October 2022

B650, AMD’s mainstream AM5 chipset, can best be thought of as a PCIe 4.0 switch with a bunch of additional I/O baked in. And as is typical for chipsets these days, several of the I/O lanes coming from the chipset are flexible lanes that can be reallocated between various protocols. Meanwhile, uplink to the CPU is a PCIe 4.0 x4 connection.

For PCIe connectivity, B650 offers 8 PCIe 4.0 lanes, which can either have PCIe slots or further integrated peripherals (LAN, Wi-Fi, etc) hung off of them. This and the uplink speed are both notable improvements over the B550 chipset, which was PCIe 3.0 throughout, despite Ryzen 3000/5000 offering PCIe 4.0 connectivity. So B650 has a lot more bandwidth coming into it, and available to distribute to peripherals.

There are also a quartet of PCIe 3.0 lanes which are shared with the SATA ports, allowing for either 4 PCIe lanes, 2 lanes + 2 SATA, or 4 SATA ports. Notably, the dedicated SATA ports found on the 500 series chipsets are gone, so motherboards will always have to sacrifice PCIe lanes to enable SATA ports. For the B650 this amounts to a net loss of 2 SATA ports, as the most ports it can drive without a discrete storage controller is 4.

Meanwhile on the USB front, motherboard vendors get more Superspeed USB ports than before. The chipset offers a fixed 4 10Gbps Superspeed ports, and then an additional output can be configured as either a single 20Gbps (2x2) port, or two 10Gbps ports. Finally, the chipset can drive a further 6 USB 2 ports, mostly for on-board peripheral use. There are no USB root ports limited to 5Gbps here, so all USB 3.x ports, whether coming from the CPU or the chipset, are capable of 10Gbps operation.

AMD has once again outsourced chipset development for this generation to ASMedia, who also designed the B550 chipset. AMD has not disclosed a TDP for the chipset, but like B550 before it, it is designed to run with passive cooling.

Outside of the technical capabilities of the B650 chipset itself, AMD is also imposing some feature requirements on motherboard makers as part of the overall AM5 platform, and this is where the Extreme designation comes in. All B650 (and X670) motherboards must support at least 1 PCIe 5.0 x4 connection for storage; Raphael has enough lanes to drive two storage devices at those speeds, but it will be up to motherboard manufacturers if they want to actually run at those speeds (given the difficulty of PCIe 5.0 routing).

Extreme motherboards, in turn, will also require that PCIe 5.0 is supported to at least one PCIe slot – normally, the x16 PCIe Graphics (PEG) slot. Non-extreme motherboards will not require this, and while motherboard vendors could technically do it anyhow, it would defeat the purpose of (and higher margins afforded by) the Extreme branding. Conversely, while AMD has been careful to toe a line about calling 5.0 slots outright mandatory on Extreme motherboards, it’s clear that there’s some kind of licensing or validation program in place where motherboard makers would be driving up their costs for no good reason if they tried to make an Extreme board without 5.0 slots.

It’s frankly more confusing than it should be, owing to a lack of hard and definite rules set by AMD; but the messaging from AMD is that it shouldn’t be a real issue, and that if you see an Extreme motherboard, it will offer PCIe 5.0 to its graphics slot. Past that, offering 5.0 to additional slots, bifurcation support, etc is up to motherboard vendors. The more PCIe 5.0 slots they enable, the more expensive boards are going to be.

Meanwhile the high-end counterpart to the B650 chipset is the X670 chipset, which is pretty much just two B650 chipsets on a single board. While not explicitly confirmed by AMD, as we’ll see in the logical diagram for X670, there’s no way to escape the conclusion that X670 is just using B650 dies daisy chained off of one another to add more I/O lanes.

Officially, X670 is a two-chip solution, using what AMD terms the “downstream” and “upstream” chipsets. The upstream chip is connected to the CPU via a PCIe 4.0 x4 connection, and meanwhile the downstream chip is connected to the upstream chip via another PCIe 4.0 x4 connection.

By doubling up on the number of chips on board, the number of I/O lanes and options are virtually doubled. The sum total of the two chips offers up to 12 PCIe 4.0 lanes (the last 4 are consumed by the upstream chip feeding the downstream chip) and a further 8 PCIe 3.0 lanes that can be shifted between PCIe and up to 8 SATA ports.

Meanwhile on the USB front, there are now 8 fixed USB 2 ports and 8 fixed SuperSpeed USB 10Gbps ports. For USB flex I/O, motherboard makers can select from either 2 20Gbps ports, 1 20Gbps port plus 2 10Gbps ports, or 4 10Gbps ports.

And while this configuration adds more I/O lanes (and thus more I/O bandwidth), it should be noted that all of these I/O lanes are still gated behind the PCIe 4.0 x4 connection going back to the CPU. So the amount of backhaul bandwidth available between the chipsets and the CPU is not any higher than it is on B650. The name of the game here is flexibility; AMD is not designing this platform for lots of sustained, high-speed I/O outside of the CPU-connected x16 PCIe graphics slot and M.2 slots. Rather, it’s designed to have a lot of peripherals attached that are either low bandwidth, or only periodically need high bandwidths. If you need significantly more sustained I/O bandwidth, then in AMD’s ecosystem there is a very clear push towards Threadripper Pro products.

Finally, X670 Extreme (X670E) will impose the same PCIe 5.0 requirements as B650E. This means Extreme boards will offer PCIe 5.0 connectivity for at least one PCIe lane, while X670 boards are expected to come with just PCIe 4.0 slots. These will be the most expensive boards, owing to a combination of requiring two chipsets, as well as the extra costs and redrivers that go into extending PCIe 5.0 farther throughout a motherboard.

On that note, when discussing the new chipsets with AMD, the company did offer an explanation for why X670 daisy chains the chipsets. In short, daisy chaining allows for additional routing – the downstream chipset can be placed relative to the upstream chipset, instead of relative to the CPU (and PCIe devices then placed relative to the chipsets). In other words, this allows for spreading out I/O so that it’s not all so close to the CPU, making better use of the full (E)ATX board. As well, hanging both chipsets off of the CPU would consume another 4 PCIe lanes, which AMD would rather see going to additional storage.

More I/O For AM5: PCIe 5, Additional PCIe Lanes, & More Displays DDR5 & AMD EXPO Memory: Memory Overclocking, AMD's Way
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  • vortmax2 - Sunday, October 16, 2022 - link

    Some people don't want to limit TDP themselves. Nothing wrong with that. Reply
  • Techie2 - Tuesday, September 27, 2022 - link

    What a screwed up launch of Ryzen 7000 CPUs and AM5 mobos by e-tailers. DDR5 EXPO DRAM showed up online a few days ago. On 9-27-22 it looks like e-tailers are actually hiding the four Ryzen 7000 CPUs to sell older stock. The AM5 mobos which have been sitting in inventory for weeks were not posted online until early morning instead of at midnight as in the past. You'd think by now they could figure out how to do a proper launch of a new CPU or platform but evidently not when it's AMD.

    No consumer grade Gen 5 SSDs listed by e-tailers that I could find. Are PC builders suppose to just wait until Nov. to see if they actually show up? AMD's partners may be cooperating with AMD but the purchasing experience is a piss poor sales methodology being employed IMNHO.

    YMMV
    Reply
  • nandnandnand - Tuesday, September 27, 2022 - link

    AMD said weeks ago that PCIe 5.0 SSDs would be coming in November.

    Nobody should be buying this stuff on day 1 unless they like being findom'd by corporations.
    Reply
  • yhselp - Tuesday, September 27, 2022 - link

    First-draft-copy issues aside, this article is written exceptionally well. The information is excellent and extensive as usual, but I feel like there's been a step-up in the way its presented/explained. Kudos and thank you. Reply
  • yhselp - Tuesday, September 27, 2022 - link

    it's* goddamit Reply
  • vortmax2 - Sunday, October 16, 2022 - link

    Great post. So many grammar police on here that can't help but criticize and take away from the actual purpose of the article. Reply
  • HardwareDufus - Tuesday, September 27, 2022 - link

    Clearly both manufacturers are producing vey compelling products this time around. At the $600-$700 mark we have two CPUs trading blows; R9-7950X (Zen4) & just announced i9-13900K (RaptorLake) We will have updates of both lines, with AMD adding 3D Cache and Intel increasing Boost Speeds. Probably can't go wrong with either choice, neither one dominates the other completely.

    I think I'll bite this time around. Yeah I know Zen5 will be a new architecture and Intel will adopt chiplets and all of the benefits that accompany them... But, I think either one of these chips, probably available in volume in 1st quarter 2023, will serve most folks well.

    In the case of Intel, you can continue to use DD4 and 600 series chipsets. However really take advantage of the capabilities of the chip, DDR5 and motherboards featureing 700 series chipsets will be available, on par with Zen 4 requiring a DDR5 and otherboards featuring the new AM5 socket and 600 series chipsets. Apples to Apples when comparing the requirements to go ALL In on performance.
    Reply
  • HardwareDufus - Tuesday, September 27, 2022 - link

    Dang, that was some awesome typing I just did there... Reply
  • nandnandnand - Tuesday, September 27, 2022 - link

    3D cache will dominate over a couple hundred extra MHz in frequency (13900KS). Reply
  • Hifihedgehog - Tuesday, September 27, 2022 - link

    @nandnandnand: That may well be true, but that's the future and months out yet. Ryzen 7000 non X3D has to sell between then and now or AMD is not going to be posting a pretty quarter. The 13900K is far cheaper in platform and unit price and will meet or exceed the 7950X for now. DDR5 and AM5 motherboards coupled with a higher price will be Ryzen 7000 series undoing, and good too. AMD needs to realize people purchase because of intrinsic quality, not brand loyalty. Reply

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