Instruction Changes

Both of the processor cores inside Alder Lake are brand new – they build on the previous generation Core and Atom designs in multiple ways. As always, Intel gives us a high level overview of the microarchitecture changes, as we’ve written in an article from Architecture Day:

At the highest level, the P-core supports a 6-wide decode (up from 4), and has split the execution ports to allow for more operations to execute at once, enabling higher IPC and ILP from workflow that can take advantage. Usually a wider decode consumes a lot more power, but Intel says that its micro-op cache (now 4K) and front-end are improved enough that the decode engine spends 80% of its time power gated.

For the E-core, similarly it also has a 6-wide decode, although split to 2x3-wide. It has a 17 execution ports, buffered by double the load/store support of the previous generation Atom core. Beyond this, Gracemont is the first Atom core to support AVX2 instructions.

As part of our analysis into new microarchitectures, we also do an instruction sweep to see what other benefits have been added. The following is literally a raw list of changes, which we are still in the process of going through. Please forgive the raw data. Big thanks to our industry friends who help with this analysis.

Any of the following that is listed as A|B means A in latency (in clocks) and B in reciprocal throughput (1/instructions).

 

P-core: Golden Cove vs Cypress Cove

Microarchitecture Changes:

  • 6-wide decoder with 32b window: it means code size much less important, e.g. 3 MOV imm64 / clks;(last similar 50% jump was Pentium -> Pentium Pro in 1995, Conroe in 2006 was just 3->4 jump)
  • Triple load: (almost) universal
    • every GPR, SSE, VEX, EVEX load gains (only MMX load unsupported)
    • BROADCAST*, GATHER*, PREFETCH* also gains
  • Decoupled double FADD units
    • every single and double SIMD VADD/VSUB (and AVX VADDSUB* and VHADD*/VHSUB*) has latency gains
    • Another ADD/SUB means 4->2 clks
    • Another MUL means 4->3 clks
    • AVX512 support: 512b ADD/SUB rec. throughput 0.5, as in server!
    • exception: half precision ADD/SUB handled by FMAs
    • exception: x87 FADD remained 3 clks
  • Some form of GPR (general purpose register) immediate additions treated as NOPs (removed at the "allocate/rename/move ellimination/zeroing idioms" step)
    • LEA r64, [r64+imm8]
    • ADD r64, imm8
    • ADD r64, imm32
    • INC r64
    • Is this just for 64b addition GPRs?
  • eliminated instructions:
    • MOV r32/r64
    • (V)MOV(A/U)(PS/PD/DQ) xmm, ymm
    • 0-5 0x66 NOP
    • LNOP3-7
    • CLC/STC
  • zeroing idioms:
    • (V)XORPS/PD, (V)PXOR xmm, ymm
    • (V)PSUB(U)B/W/D/Q xmm
    • (V)PCMPGTB/W/D/Q xmm
    • (V)PXOR xmm

Faster GPR instructions (vs Cypress Cove):

  • LOCK latency 20->18 clks
  • LEA with scale throughput 2->3/clk
  • (I)MUL r8 latency 4->3 clks
  • LAHF latency 3->1 clks
  • CMPS* latency 5->4 clks
  • REP CMPSB 1->3.7 Bytes/clock
  • REP SCASB 0.5->1.85 Bytes/clock
  • REP MOVS* 115->122 Bytes/clock
  • CMPXVHG16B 20|20 -> 16|14
  • PREFETCH* throughput 1->3/clk
  • ANDN/BLSI/BLSMSK/BLSR throughput 2->3/clock
  • SHA1RNDS4 latency 6->4
  • SHA1MSG2 throughput 0.2->0.25/clock
  • SHA256MSG2 11|5->6|2
  • ADC/SBB (r/e)ax 2|2 -> 1|1

Faster SIMD instructions (vs Cypress Cove):

  • *FADD xmm/ymm latency 4->3 clks (after MUL)
  • *FADD xmm/ymm latency 4->2 clks(after ADD)
  • * means (V)(ADD/SUB/ADDSUB/HADD/HSUB)(PS/PD) affected
  • VADD/SUB/PS/PD zmm  4|1->3.3|0.5
  • CLMUL xmm  6|1->3|1
  • CLMUL ymm, zmm 8|2->3|1
  • VPGATHERDQ xmm, [xm32], xmm 22|1.67->20|1.5 clks
  • VPGATHERDD ymm, [ym32], ymm throughput 0.2 -> 0.33/clock
  • VPGATHERQQ ymm, [ym64], ymm throughput 0.33 -> 0.50/clock

Regressions, Slower instructions (vs Cypress Cove):

  • Store-to-Load-Forward 128b 5->7, 256b 6->7 clocks
  • PAUSE latency 140->160 clocks
  • LEA with scale latency 2->3 clocks
  • (I)DIV r8 latency 15->17 clocks
  • FXCH throughput 2->1/clock
  • LFENCE latency 6->12 clocks
  • VBLENDV(B/PS/PD) xmm, ymm 2->3 clocks
  • (V)AESKEYGEN latency 12->13 clocks
  • VCVTPS2PH/PH2PS latency 5->6 clocks
  • BZHI throughput 2->1/clock
  • VPGATHERDD ymm, [ym32], ymm latency 22->24 clocks
  • VPGATHERQQ ymm, [ym64], ymm latency 21->23 clocks

 

E-core: Gracemont vs Tremont

Microarchitecture Changes:

  • Dual 128b store port (works with every GPR, PUSH, MMX, SSE, AVX, non-temporal m32, m64, m128)
  • Zen2-like memory renaming with GPRs
  • New zeroing idioms
    • SUB r32, r32
    • SUB r64, r64
    • CDQ, CQO
    • (V)PSUBB/W/D/Q/SB/SW/USB/USW
    • (V)PCMPGTB/W/D/Q
  • New ones idiom: (V)PCMPEQB/W/D/Q
  • MOV elimination: MOV; MOVZX; MOVSX r32, r64
  • NOP elimination: NOP, 1-4 0x66 NOP throughput 3->5/clock, LNOP 3, LNOP 4, LNOP 5

Faster GPR instructions (vs Tremont)

  • PAUSE latency 158->62 clocks
  • MOVSX; SHL/R r, 1; SHL/R r,imm8  tp 1->0.25
  • ADD;SUB; CMP; AND; OR; XOR; NEG; NOT; TEST; MOVZX; BSSWAP; LEA [r+r]; LEA [r+disp8/32] throughput 3->4 per clock
  • CMOV* throughput 1->2 per clock
  • RCR r, 1 10|10 -> 2|2
  • RCR/RCL r, imm/cl 13|13->11|11
  • SHLD/SHRD r1_32, r1_32, imm8 2|2 -> 2|0.5
  • MOVBE latency 1->0.5 clocks
  • (I)MUL r32 3|1 -> 3|0.5
  • (I)MUL r64 5|2 -> 5|0.5
  • REP STOSB/STOSW/STOSD/STOSQ 15/8/12/11 byte/clock -> 15/15/15/15 bytes/clock

Faster SIMD instructions (vs Tremont)

  • A lot of xmm SIMD throughput is 4/clock instead of theoretical maximum(?) of 3/clock, not sure how this is possible
  • MASKMOVQ throughput 1 per 104 clocks -> 1 per clock
  • PADDB/W/D; PSUBB/W/D PAVGB/PAVGW 1|0.5 -> 1|.33
  • PADDQ/PSUBQ/PCMPEQQ mm, xmm: 2|1 -> 1|.33
  • PShift (x)mm, (x)mm 2|1 -> 1|.33
  • PMUL*, PSADBW mm, xmm 4|1 -> 3|1
  • ADD/SUB/CMP/MAX/MINPS/PD 3|1 -> 3|0.5
  • MULPS/PD 4|1 -> 4|0.5
  • CVT*, ROUND xmm, xmm 4|1 -> 3|1
  • BLENDV* xmm, xmm 3|2 -> 3|0.88
  • AES, GF2P8AFFINEQB, GF2P8AFFINEINVQB xmm 4|1 -> 3|1
  • SHA256RNDS2 5|2 -> 4|1
  • PHADD/PHSUB* 6|6 -> 5|5

Regressions, Slower (vs Tremont):

  • m8, m16 load latency 4->5 clocks
  • ADD/MOVBE load latency 4->5 clocks
  • LOCK ADD 16|16->18|18
  • XCHG mem 17|17->18|18
  • (I)DIV +1 clock
  • DPPS 10|1.5 -> 18|6
  • DPPD 6|1 -> 10|3.5
  • FSIN/FCOS +12% slower

 

Power: P-Core vs E-Core, Win10 vs Win11 CPU Tests: Core-to-Core and Cache Latency, DDR4 vs DDR5 MLP
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  • Netmsm - Monday, November 8, 2021 - link

    @Wrs Assume we give you this, just drop AMD related things.
    Let's focus on performance per watt of new Intel Architecture. I asked some questions about this which is a pertinent topic to this article but you dodged. Just talk about 241 watt being sucked by 12900k :))
  • ajollylife - Sunday, November 7, 2021 - link

    To be fair Intel's def not perfect. The i225v lan bug comes to mind
  • DominionSeraph - Saturday, November 6, 2021 - link

    When Intel doesn't have this issue it is AMD.
    Intel demands validation and spends hundreds of millions on engineers to help motherboard manufacturers fix their issues before release because they realize that the motherboard is an INSEPERABLE part of the equation. You can fanboi all you want over the CPU, but if there are no good motherboards you have a terrible system.
    AMD just dumps their chip on the market, leaving the end-user with a minefield of motherboard issues among every manufacturer.
    When Intel has the problem solved but AMD doesn't, it's an AMD issue.
  • Qasar - Saturday, November 6, 2021 - link

    DominionSeraph have you tried this on a different x570 board ? it COULD be just that board, as was already stated. i have been running a 5900x now for about a week, and no issues at all with disk access, its the same as the 3900x i replaced, and im using an asus x570 e-gaming board.
    maybe take a step back, realize that its NOT an amd issue, but a BOARD issue. to be fair, intel has had its own issues over the years as well, while you see them as perfect, sorry to break it to you, but intel also isnt perfect
  • Netmsm - Sunday, November 7, 2021 - link

    Oh I got it, the fact that you're encountering unusual issues, despite myriads of people who haven't complained of the same problem you have, means that AMD got many incompatibility issues.
    That's a brilliant reasoning which brings us to a pure conclusion: AMD is bad. We're done here.
  • Dug - Monday, November 15, 2021 - link

    @DominionSeraph
    "Note Intel doesn't allow "dog sh1t motherboards" to happen, especially at the $300+ price point. That makes it an AMD issue."

    You obviously haven't looked at or experienced the issues that plague many motherboards. Maybe just read some reviews or visit manufactures forums to get an idea of how bad it is before making such a naïve statement.
    It has more to do with the manufacturer of the board than the CPU.
    That is like saying nvidia doesn't make crap video cards. Well you need to look at all the failures by each manufacturer, not nvidia itself.
  • madseven7 - Saturday, November 6, 2021 - link

    You put that chip in an ASROCK motherboard. That's the reason for the issues.
  • xhris4747 - Tuesday, November 9, 2021 - link

    Lol 😅
  • FLORIDAMAN85 - Friday, November 12, 2021 - link

    I, too, have made the error of purchasing an ASRock board.
  • mode_13h - Saturday, November 13, 2021 - link

    So far, my ASRock Rack server board is still going strong.

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