GIGABYTE X570 Aorus Xtreme

Moving onto GIGABYTE's launch day X570 product stack, and it seems to have upped the ante in a number of areas over the previous X470 generation of motherboards. Firstly, GIGABYTE has done a slightly different approach with its power delivery configurations; on paper, they look much higher spec than on previous AM4 models. One prime example of this is in the GIGABYTE X570 Aorus Xtreme which as it stands, is the brand's current flagship model, and is feature-packed with numerous premium componentry, as well as a beefy 16-phase power delivery for the CPU. The other unique feature for the X570 Aorus Xtreme is it's currently the only X570 model at launch to passively cool the warm running X570 chipset.

The X570 Aorus Xtreme is the current flagship from GIGABYTE with a large looking 16-phase power delivery for users looking to overclock the latest Ryzen 3000 series processors, as well as a solid high-end feature set. Across the majority of the PCB, we get Aorus themed armor with three PCIe 4.0 x4 M.2 slots each with its own heatsink which moulds into the PCB cover. There are also six SATA ports with support for RAID 0, 1 and 10 arrays. The CPU VCore section of the power delivery uses two 8-pin 12 V CPU power inputs to deliver power to the processor.

The chipset heatsink onboard the X570 Aorus Xtreme is also one of the only models so far that relies on passive cooling which is interesting as we know the X570 chipset will run with two variants, an 11 W and 15 W. On the rear panel cover is an Aorus Falcon design, with multiple areas with RGB LEDs that users can customize with the Aorus RGB Fusion software. In the top right-hand corner is a power and reset switch, with a small debug LED, and front panel USB 3.1 G2 Type-C port. There are three full-length PCIe 4.0 slots with no PCIe 4.0 x1 slots featured on this model. One of the aspects GIGABYTE is known for focusing on with its high-end models is the onboard audio solution. Adding to the implementation of a Realtek ALC1220 HD audio codec is an ESS Sabre 9218 DAC, with WIMA audio capacitors. 

On the rear panel is a large number of inputs and outputs which includes five USB 3.1 G2 Type-A, one USB 3.1 G2 Type-C, two USB 3.1 G1 Type-A, and four USB 2.0 ports. There are two antenna connectors for the integrated Intel AX200 Wi-Fi 6 802.11ax wireless interface, as well as two Ethernet ports which are powered by an Aquantia AQC107 10 G, and Intel I211-AT Gigabit NIC pairing. The Realtek ALC1220-VB HD audio codec adds five 3.5 mm audio jacks and an S/PDIF optical output. Also featured is a clear CMOS switch and Q-Flash Plus BIOS flashing button.

The GIGABYTE X570 Aorus Xtreme is a fine example of what vendors can do for its flagship models on the X570 chipset with plenty of USB 3.1 G2 ports on the rear panel. Dual networking with a 10 G NIC, Wi-Fi 6 capability, and 16-phase power delivery for the CPU make the X570 Aorus Xtreme very attractive. This model has an MSRP of $699 which represents the top end of the X570 product stack at launch, but with everything on offer, it was always expected to be expensive.

Colorful CVN X570 Gaming Pro V14 GIGABYTE X570 Aorus Master
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  • Mr Perfect - Tuesday, July 9, 2019 - link

    Yeah, I'm having flashbacks over here. Weedy little fans screaming along at 6000RPM, then choking up on a dust bunny or wearing out the bearing.

    Do we know what process they used for the X570? Is it the same 55nm they used for the X470? Here's hoping they shrink it a little for X670.
  • DigitalFreak - Tuesday, July 9, 2019 - link

    14nm
  • erotomania - Tuesday, July 9, 2019 - link

    55nm
  • DanNeely - Wednesday, July 10, 2019 - link

    no. X470 and below were 55nm (designed by ASMedia on an ancient process to keep everything cheap as dirt), X570 was done in house on 14nm. Ryzen 3's IO die is also 14nm (the much larger Epyc one was done at 12nm).
  • erotomania - Wednesday, July 10, 2019 - link

    Weedy, man! Those weedy fans
  • sing_electric - Wednesday, July 10, 2019 - link

    Given how little chipsets benefit from process shrinks, some part of me honestly wonders if there's any sense in going even further back to the future and dividing the chipset into a north/southbridge (or some other similar config) so that the heat can at least be spread out, getting rid of the need for a failure-prone mechanical part on your motherboard.
  • YoloPascual - Tuesday, July 9, 2019 - link

    z77 extreme 4 to x570 extreme 4 👊👊
  • The_Assimilator - Wednesday, July 10, 2019 - link

    I also owned a Z77 Extreme 4 at one time, and the X570 version is probably the closest to perfect that I've seen offered so far. If only it had a couple of extra USB ports on the back panel, it'd be a shoe-in.
  • rUmX - Tuesday, July 9, 2019 - link

    Hoping for price cuts on Intel cpus because no matter how good Ryzen is, these boards are way too expensive.
  • Karmena - Tuesday, July 9, 2019 - link

    Then get X470 or B450 boards. Or even X370 or B350 boards, you are in no way forced to use these latest mobos.

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