Final Thoughts

ARM has certainly been busy, refreshing several key technologies for the next generation of SoCs. DynamIQ might not be as flashy as a new CPU, but as a replacement for big.LITTLE it’s every bit as important. It will be interesting to see how ARM’s partners utilize its flexibility. Will we continue to see the same 4+4 combination of big and little cores at the high end and 8 little cores in the low end to midrange? Or will we see new 7+1 or 3+1 combinations with a single A75 surrounded by A55s? Currently only the A75/A55 are compatible with DynamIQ, and the new CPUs cannot be mixed with older cores using big.LITTLE. This means we will not see the A35 used in mobile outside of MediaTek’s Helio X30.

DynamIQ is an upgrade to bL in other ways too. Placing both the big and little cores inside the same cluster brings several benefits: making the L2 caches local to each CPU and adding an optional L3 cache improves overall memory performance, thread migration latency is reduced, and CPUs can be powered up/down more quickly, which could lead to better battery life.

The A55’s extra performance is a welcome change. This should yield tangible improvements to the user experience in mobile applications, certainly for devices that use A55 cores exclusively. Even devices with A75 cores should still see some benefit considering how threads spend most of their time running on the little cores.

ARM already pushed throughput through the A53’s 2-wide in-order core about as far as it could. Given the power and area targets for A53/A55, going wider or out of order are not possible at this stage. Instead, ARM focused on improving the memory system, reducing latency and improving utilization of the in-order core by keeping it fed with data. The increased performance comes with a small bump in power, but overall efficiency is better.

For the A75, the move to 3-wide decode, improvements throughout the cache hierarchy, and tweaks to improve its out-of-order capability should yield clear performance gains over the A73 in both integer and floating-point workloads. At the same frequency, the A72 actually performs better than A73 in some situations. I expect this will not be the case with A75.

According to ARM’s numbers, the A75’s performance gains help it maintain the same efficiency as the A73, but power consumption is higher, which concerns me a little. ARM has an implementation team optimizing its reference design, so its power numbers are sort of a target for SoC vendors. Because of pressure to reduce time to market, vendors do not always have the same amount of time to optimize their designs, resulting in higher power consumption and lower efficiency. Hopefully, vendors put in the effort to match or get close to ARM’s numbers.

ARM’s primary goal for A72 was reducing power, for A73 it was improving power efficiency, and for A75 it's improving performance. What will be the goal for the next core, which will be coming from ARM’s Austin team that produced the A72? Will it look similar to A75, or will there be a significant shift in philosophy like we saw with A72 to A73? There is communication and cross pollination of ideas between teams so there's sure to be some similarities, especially with the execution pipes. The biggest changes should be in the front end, and I would not be surprised to see an extra ALU pipe with the move to 7nm.

If all goes according to plan, we should see the first SoCs using DynamIQ and the A75/A55 in Q1 2018 (maybe Q4 2017) on 10nm.

Cortex-A55 Microarchitecture
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  • Meteor2 - Monday, May 29, 2017 - link

    How?
  • Paul A. Clayton - Monday, May 29, 2017 - link

    The A55 design is constrained not merely by area and power but also by configurability. Being able to vary the L1 cache sizes from 16 KiB to 64 KiB means that the pipeline structure and cycle time is not optimized for one size. Targeting multiple processes and design factors (e.g., SRAM libraries can be tuned for different performance/area/power tradeoffs) also constrains optimization.

    While ARM might have had in mind a particular implementation for optimization (for which it might provide hard cores), it is still limited to providing acceptable designs for other implementations. Some microarchitectural optimizations might strongly depend on implementation details which are outside of ARM's control.

    There are probably also higher-risk design possibilities that were not explored simply because the resources were not available. Having multiple design teams with similar targets typically would mean wasting effort, but such provides a potential for a better design. It would be difficult for ARM to charge for the cost of unused designs given that other designs are available.

    Targeting a broad range of workloads also means a design will tend to be worse than a design targeting a narrower range of workloads.
  • Kevin G - Monday, May 29, 2017 - link

    Of course they could but would those changes have permitted it still be within the design constraints of the A55? Small die size and lower power are two characteristics that are not compromised for the A55. Faster is easy to do with more power but considering that the A55 is the little core, higher power consumption is to be avoided. Similarly a faster core might be done with a larger die area. There are trade offs here but the pressure from ARM's customers is to keep this as small as possible.

    Considering those constraints, I considering any improvements to be rather impressive. If there is a silver bullet that ARM could have used to make it faster/smaller/consumer less power in these designs without violating the constraints they have in place, I'd like know what it was.
  • tipoo - Monday, May 29, 2017 - link

    Alas, still waiting to find out how different Apples Zephyr is from standard Little cores like it. It's nearly twice as big.
  • jjj - Monday, May 29, 2017 - link

    "What will be the goal for the next core, which will be coming from ARM’s Austin team that produced the A72? "

    That was my main question too but my hope was that the next core is aiming for much higher IPC. They need it for server and dual big core configs in mobile on 7nm.
    Or maybe they don't quite need it really, A75 is really fast and if the next core adds 15-20% higher IPC combined with higher clocks enabled by the process, that's quite a lot and rather amazing from a perf density perspective.

    Not much talk about area, any clue how A75 + DynamIQ compare to previous solutions - ofc the cache part is easy to factor in.

    It is interesting that A75 scales better with higher clocks, any guesses for clocks at 2W? A laptop with 4b4L would be rather nice.

    A55 not targeting higher clocks seems a bit odd, would mean that power goes down if folks move from A53 on 16FF to A55 on 7nm so maybe ARM has another update before 7nm.
  • Meteor2 - Monday, May 29, 2017 - link

    I think these are still mobile CPUs. It's up to Cavium et al to do ARM ISA-compatible designs for servers. ARM's not that bothered; the mobile market is far larger.
  • jjj - Monday, May 29, 2017 - link

    ARM is very eager to go server and just a year ago ARM was targeting 25% share in server by 2020. This gen does highlight infrastructure as they call it, a large segment where they've been gaining share and the next step is server.
    7nm is where it starts really, TSMC has the HPC version of the process and ARM needs to be ready too with the core that follows A75.
    What's is unclear is the strategy. A75 is already desktop class so they could just increase IPC some more but maybe they can aim higher. It seems that the Austin team got an extra year to work on the next core so that's 3 years, could be an entirely new design.
  • Kevin G - Monday, May 29, 2017 - link

    ARM in the server space is sound much like the hype of Linux on the desktop: always 'next year'.

    The challenges ARM designs have had have been to simply get out to market. AMD's Seattle chip is indeed out but suffered two years of delays and most of the design wins have evaporated due to it. AMD's K12 efforts are MIA right now. Similarly Cavium's ThunderX line is interesting but not the game changer it was hyped to be. Broadcom has exited the ARM server market after promoting an interesting design (SMT on ARM!). Applied Micro's efforts for ARM servers have been lost to corporate mergers. Caldexa folded years ago.

    The one interesting ray of hope is that there are indeed some customers like Microsoft, Facebook, Google and Amazon who are interesting in ARM's low power nature to certain workloads. Microsoft has a version of Windows Server running on ARM but is not releasing it publicly, rather keeping it tied to their Azure cloud services. I have yet to hear where MS has gotten their ARM hardware from though. Google has dipped their toe into chip development for their deep learning efforts and it would be a straight forward process to piece together their own server designs from licensed IP blocks now that they have the in-house expertise to do it (saying they can and them doing it are two different things). In the end, the big cloud providers who could have spurred the ARM server space for everyone may keep the ARM server idea private to themselves while the rest of the market gets to deal with x86. Considering that x86 is perceived as higher power and higher cost, this serves the cloud providers well as it give incentive for companies to migrate to their cloud solutions instead of looking at ARM alternatives.

    The other difficulty for ARM in the market place right now is that Intel preemptively released their response: the Xeon D. Intel was doing a performance/watt play there and it paid for for the low end server market. In most cases, the Xeon D for a pure single socket server was a better choice than the Xeon E5 1xxxx or Xeon E3 line up. I suspect that Intel management sees Xeon D as 'too good' and thus hasn't been quick to bring an updated Sky Lake version to market.
  • Wilco1 - Monday, May 29, 2017 - link

    Please read: http://www.anandtech.com/show/11189/appliedmicro-x... - it says both Vulcan and XGene are alive. You forgot to mention QC's Centric (48 cores on 10nm, available this year). There are also 64-core/256GB DRAM beasts made by HiSilicon.
  • jjj - Monday, May 29, 2017 - link

    If you assume a 15-20% IPC gain over A75 for ARM's 7nm core and clock it past 4GHz for server, that's somewhat the worst case scenario for where ARM is in server in 2018-2019. We can assume DinamIQ evolves a bit by then too.
    That wouldn't be bad at all and ARM has extraordinary perf density. They might deliver more than that, we'll see.

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