Last week we reported on Fibocom, an Intel partner, had announced a new M.2 module featuring the Intel XMM8160 5G modem to be used in CPEs as well as upcoming PCs and laptops. During the Mobile World Congress show, we actually saw this M.2 module on the Fibocom booth, but to our surprise, we also saw a similar M.2 module for Qualcomm’s X55 modem over at the Qualcomm booth.

Intel and Fibocom to Co-Develop a 5G M.2 Module for System Integration

Fibocom Wireless is a company that has won investment from Intel Capital and develops wireless modules as well as communication solutions. As part of the Mobile World Congress event...

1 by Ian Cutress on 2/25/2019

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