Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles, are qualified to operate in extreme temperature ranges and offer performance levels on par with today’s smartphones. Samsung’s new 256 GB eUFS device is based on the company’s planar MLC NAND flash memory produced using a 10 nm-class process technology as well as a proprietary UFS 2.1 controller supporting data refresh and temperature notification capabilities — both technologies are a part of the UFS 3.0 specification introduced last month and both are supported by Samsung’s 64 GB and 128 GB eUFS products for automotive applications as well as by competing devices. The 256 GB eUFS...
JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...13 by Anton Shilov on 1/31/2018
LAS VEGAS, NV — At CES, SSD controller vendor Phison is showing off a range of controller ICs and drive reference designs that are close to hitting the shelves. Phison's...9 by Billy Tallis on 1/10/2018
Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips...15 by Anton Shilov on 12/18/2017