3D QLC

Western Digital's SanDisk subsidiary and Toshiba have a long history of jointly developing and manufacturing NAND flash memory. While that relationship has been strained by Toshiba's recent financial troubles and attempts to sell of their share of the memory business, the companies are continuing to develop new flash memory technology and are still taking turns making new announcements. In recent months both companies have started sampling SSDs using their 64-layer BiCS3 TLC 3D NAND and have announced that their next generation BiCS4 3D NAND will be a 96-layer design. Yesterday Western Digital made a small announcement about their other main strategy for increasing density: storing more bits per memory cell. Western Digital will introduce four bit per cell QLC parts built on their 64-layer BiCS3...

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...

36 by Anton Shilov on 7/3/2017

Log in

Don't have an account? Sign up now