Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips offer capacities from 16 GB to 128 GB (with a 256 GB option coming in Q2 2018), can handle extreme temperatures and support numerous features designed to improve their reliability and ensure consistent performance. The Toshiba eUFS storage devices for automotive applications are based on the company’s proven 128 Gb MLC NAND flash made using 15 nm process technology as well as an in-house developed controller. The devices are compliant with the UFS 2.1 HS-G3 specification, so they use two full-duplex HS-Gear3 lanes with 5.8 GT/s data transfer rate per lane and can offer a theoretical...
At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...38 by Anton Shilov on 3/10/2016
With Computex only a week away, SanDisk is taking a head start today with the release of Z400s SSD. SanDisk is aiming to cater two different markets with the...25 by Kristian Vättö on 5/26/2015
Courtesy of Custom PC Review At Flash Memory Summit, Toshiba was showcasing their latest 15nm 128Gbit MLC NAND wafer that has been developed in partnership with SanDisk. I simply could...12 by Kristian Vättö on 8/22/2014