BTX Cooling and Airflow Explained

We know the purpose of the BTX design and why each component is placed where it is, but the question is, will it work? Will a single CPU heatsink fan be able to effectively cool all of the critical components in a system? In our preview of BTX last year we explained the placement of each component as well as showed a top view of the heat paths in a BTX system. The CPU, Northbridge, Southbridge, and VGA card are all inline which creates a single path for air to flow and in one single direction, from front to back through the thermal module.


From the picture we see the flow of air pushed back through the CPU thermal module towards the Northbridge, Southbridge, and VGA card. As this air flows around the CPU, it warms up, as we can see from the red areas to the left and right of the CPU. This warm air then flows over the Northbridge and seems to cool as it travels further back in the chassis. At the left we see the channel of air flowing to the left over the memory and out through the PSU. The channel on the right flows straight back to the VGA card and out through groups of holes in the back of the case.

Intel will incorporate various other features that will help their CPUs perform at an efficient level no matter the conditions beginning with the Pentium 4 6xx series chips scheduled for Q1 of 2005. One feature is an enhanced version of their mobile processor SpeedStep technology called just that, Enhanced SpeedStep Technology; EIST or EST. EIST will allow the operating system to lower the CPU's power state during idleness which will reduce heat dissipation and power consumption. Another feature which will have a great effect on a system's thermal conditions as well as safety is the Thermal Management feature. This feature allows the CPU to immediately cut its clock speed to a fraction of its normal operating clock speed when the motherboard detects it is operating at temperatures out of the norm.  There are a lot of Centrino-eque technologies at work here.  The lessons learned from Pentium M have played heavily on system design as well as processor design. 

So how will Intel's new BTX form factor affect third party manufacturers specializing in cooling equipment? The fact of the matter is that cooling hardware will always be required. We have seen in past ATX case reviews that no matter how many fans are in a case, a single 80mm fan at the front as an intake, or a set of six 80mm fans throughout a mid tower case, current hardware will operate under normal loads. Users, however, still prefer to spend their money on extra cooling equipment to get the most out of their systems. Intel has been bundling their heatsink fans with their CPU's since the beginning while third party manufacturers like Zalman and Thermaltake provide solutions for enthusiasts who prefer custom hardware. So the market for third part hardware will still be there for the BTX form factor as it has been for ATX.

BTX Cooling and Airflow First Look: AOpen B300 microBTX case
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  • L3p3rM355i4h - Thursday, February 10, 2005 - link

    Seems to be good for the OEM market, but what about us people who *actually* care about computers? Front exhuaust has to be the stupidest thing ever. Why was it so hard just to reverse the layout, so it would be atleast somewhat compatable with the current ATX standard.

    And the guy/gal who made up the "ATX II" standard, maybe you should contact AMD or someone. They might be interested.
  • EthernaL - Friday, May 19, 2006 - link

    What if I really LIKE my BIG ATX tower?
    Maybe I have temperature problems in summer... maybe is not all the efficient that could be but I really love this design and I don't want to move to a small design and I don't want to buy the whole thing again.

    Another nice thing with the computers we currently have is the possibility to give our friends/relatives old pieces once we upgrade our computer (my sister's computer is build that way :P )

    So, again, another decission based ONLY on money without thinking in what we (the users) want or need. Thanks Intel, I hate you more than ever, and if you 'force us' to move to that technology I hope your business will go bankrupt.
  • IntelUser2000 - Sunday, November 21, 2004 - link

    "From the picture we see the flow of air pushed back through the CPU thermal module towards the Northbridge, Southbridge, and VGA card. As this air flows around the CPU, it warms up, as we can see from the red areas to the left and right of the CPU. This warm air then flows over the Northbridge and seems to cool as it travels further back in the chassis. At the left we see the channel of air flowing to the left over the memory and out through the PSU. The channel on the right flows straight back to the VGA card and out through groups of holes in the back of the case."

    Well doesn't look like to me that hot air comes out front.
  • MadAd - Friday, November 19, 2004 - link

    One question im having in my mind is how big of a paintbrush will i need to get inbetween those fins - talk about a dust trap.

    At least a majority of atx heatsink designs have easy to clean fins, and boy do they need cleaning sometimes, this is going to be worse.

    Cue the repair calls in years to come, $50 an hour for removing wads of the customers cat/dog/children from around the cooler after the safety backoff system renders the machine temporatily gonadless.
  • epiv - Thursday, November 18, 2004 - link

    Intel can and should make BTX backward and forward compeitable with ATX so we can decide if a new BTX case and PSU is worth the money.
    I am a poor student and I already spend money on a good case and PSU. My case should be able to handle more heat than a regular BTX case. I really hope I will not have to get a new case and PSU when I upgrade my computer.
  • trikster2 - Wednesday, November 17, 2004 - link


    facts? I actually own the silverstone version of the oppus case, so I am actually speaking from experience. Vertical vs horizontal lowprofile vs full height has a lot to do with heat disapation
  • Myrandex - Tuesday, November 16, 2004 - link

    I wonder how BTX had a NDA because Gateway has been selling BTX computers at best buy for over a month at least
  • Cygni - Tuesday, November 16, 2004 - link

    Dont you bring facts into this, Kris! Trikster2 doesnt want any of that!
  • KristopherKubicki - Tuesday, November 16, 2004 - link

    trikster2: The Opus case was chosen because it was the same volume as the mBTX case. I don't really see how a mATX tower and an mBTX case are going to differ significantly.

    Kristopher
  • ceefka - Tuesday, November 16, 2004 - link

    How can this possibly translate into lower cost for end users? Thank you, Intel.

    I am also disappointed by Intel's approach. Uhm, we have a hot CPU; let's make a cooler case!

    Since they invented this in their own backyard without creating a wide support it looks like an ego-trip.

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