The Foldable Huawei Mate X: Coming to China on November 15th for ~$2074

Foldable smartphones from Huawei and Samsung attracted quite a lot of public attention at Mobile World Congress early this year, but launches were delayed as companies had to polish...

17 by Anton Shilov on 10/23/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

8 by Anton Shilov on 10/22/2019

AOC Reveals Agon AG273QX: A 27-Inch 165 Hz FreeSync 2 Monitor

AOC has introduced its new Agon-series 27-inch gaming display featuring a variable refresh rate of up to 165 Hz enabled by AMD’s FreeSync 2 technology. Like all Agon monitors...

16 by Anton Shilov on 10/22/2019

Team Group Quietly Launches 32 GB DDR4 Memory Modules

Team Group has quietly added 32 GB unbuffered DDR4 memory modules to its product catalogue and plans to start sales in the near future. The modules will feature JEDEC-standard...

8 by Anton Shilov on 10/22/2019

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...

5 by Anton Shilov on 10/22/2019

AMD May Be Prepping More 280 W EPYC Enterprise CPUs

Back in September, AMD announced its 64-core EPYC 7H12 processor - a 280 W TDP behemoth with an increased base frequency designed specifically for the high-performance computing market. Based...

22 by Anton Shilov on 10/21/2019

Lenovo: Foldable ThinkPad X1 to Launch in 2020

At Canalys Channels Forum last week, Lenovo finally revealed launch timeframe for its foldable ThinkPad X1 hybrid notebook that was first revealed in May. The company says that the...

9 by Anton Shilov on 10/21/2019

AMD Ryzen 7 3750X with 105 W TDP: Spotted at AMD

AMD has accidentally published its Product Master list - a list with all of its consumer, enterprise, and OEM parts listed. In the latest publication, it reveals multiple CPUs...

34 by Anton Shilov on 10/21/2019

Details About 3rd Generation Ryzen Threadripper Appear: 24 and 32 Cores, Up to 280 W

AMD has already officially confirmed plans to launch its 3rd Generation Ryzen Threadripper processors this November, but naturally kept all the details to itself. At the time, it stated...

19 by Anton Shilov on 10/21/2019

Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel

Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...

14 by Anton Shilov on 10/21/2019

Chips&Media Launches Wave510A Hardware AV1 Decoder IP

Chips&Media this month has started to license out its Wave510A hardware decoder IP, the industry’s first AV1 video decoder. The base decoder core supports decoding up to 4Kp60, but...

25 by Anton Shilov on 10/21/2019

Xiaomi Reveals 34-Inch Mi Surface Display: 144Hz WQHD w/FreeSync

While Xiaomi is best known in the west for its smartphone products, like other electronics conglomorates, the company produces a significant selection of electronics products, and that variety is...

14 by Anton Shilov on 10/18/2019

Arctic’s Freezer 50 TR Air Cooler w/ RGB for AMD’s Threadripper Launched

Arctic has formally introduced its Freezer 50 TR cooler for AMD’s Ryzen Threadripper processors, which promises to remain quiet even when the CPU gets hot. The socket TR4-only cooler...

10 by Anton Shilov on 10/18/2019

TSMC Radically Boosts CapEx to Expand Production Capacities, To Reach $14B For 2019

Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...

18 by Anton Shilov on 10/18/2019

Dynabook Updates Support Policies, Now Offers 3 & 4 Year Warranties For Some Models

Back in the day, virtually all PCs came standard with a three-year warranty with some makers offering to extend it to five years. Due to cut-throat competition on the...

4 by Anton Shilov on 10/17/2019

Philips Reveals 346B1C 34-Inch 100 Hz Curved UltraWide Monitor with USB-C Docking

Philips has introduced its new 346B1C ultrawide curved monitor, which is designed for business and professional users looking for a large display offering USB Type-C docking. The Philips 346B1...

35 by Anton Shilov on 10/17/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

Razer Unveils Optical Laptop Keyboard

Razer has introduced the industry’s first notebook keyboard based on optical switches. The low-profile keyboard promises tactile feedback of mechanical switches as well as near instant actuation required by...

12 by Anton Shilov on 10/16/2019

LGA4677 Socket Spotted: Future Server Socket with PCIe 5.0 Support

TE Connectivity, a maker of various connectivity solutions in general and CPU sockets in particular, has revealed its roadmap describing future sockets for what looks like a range of...

17 by Anton Shilov on 10/16/2019

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