AMD has accidentally published its Product Master list - a list with all of its consumer, enterprise, and OEM parts listed. In the latest publication, it reveals multiple CPUs that could potentially be released in the future. The document, which is dated September 2019, indicates that AMD may be mulling to launch its Ryzen 7 3750X product with a 105 W TDP, though does not disclose its specifications or if it is OEM-only.


From AMD's Master Product Document

As the product number suggests, AMD’s Ryzen 7 3750X will sit between the eight-core Ryzen 7 3800X and the eight-core Ryzen 7 3700X, which leads to a suggestion that we are dealing with another eight-core CPU with SMT. Meanwhile, the base frequency difference between the Ryzen 7 3700X and 3800X is only 300 MHz, which is pretty narrow, whereas the former features a mainstream TDP of 65 W, while the latter can go all the way to 105W.

AMD 'Matisse' Ryzen 3000 Series CPUs
AnandTech Cores
Threads
Base
Freq
Boost
Freq
L2
Cache
L3
Cache
PCIe
4.0
Chiplets
IO+CPU
TDP Price
(SEP)
Ryzen 9 3950X 16C 32T 3.5 4.7 8 MB 64 MB 16+4+4 1+2 105W $749
Ryzen 9 3900X 12C 24T 3.8 4.6 6 MB 64 MB 16+4+4 1+2 105W $499
Ryzen 9 3900 12C 24T 3.1 4.3 6 MB 64 MB 16+4+4 1+2 65W -
Ryzen 7 3800X 8C 16T 3.9 4.5 4 MB 32 MB 16+4+4 1+1 105W $399
Ryzen 7 3750X? 8C? 16T? ? ? 4 MB? 32 MB? 16+4+4 1+1 105W ?
Ryzen 7 3700X 8C 16T 3.6 4.4 4 MB 32 MB 16+4+4 1+1 65W $329
Ryzen 5 3600X 6C 12T 3.8 4.4 3 MB 32 MB 16+4+4 1+1 95W $249
Ryzen 5 3600 6C 12T 3.6 4.2 3 MB 32 MB 16+4+4 1+1 65W $199
Ryzen 5 3500X 6C 6T 3.6 4.1 3 MB 32 MB 16+4+4 1+1 65W -

Keeping in mind that AMD already has a rather diverse Ryzen 3000 (aka Matisse) family and the fact that the company may have various ideas how to improve its product lineup, it is not particularly easy to make predictions about future products, especially if they may end up as OEM-only products, inside desktops of only one or two partners. The only thing that is certain at this point is that AMD might be considering to strengthen its desktop family if it feels necessary.

AMD’s Product Master document seems to be aimed at the company’s sales teams and contains OPN codes along with US ECCN, HTS, and CCATS codes that are required by the US export regulators. While the list mentions numerous products, at least some of them are potential or partner-specific products.

Related Reading

Sources: AMD, Reddit, Tom’s Hardware, Komachi_Ensaka/Twitter, Planet3DNow.de

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  • airdrifting - Monday, October 21, 2019 - link

    What's the point? Filling the non-existing gap between 3700X and 3800X? Or does it have IGP? Reply
  • tarqsharq - Monday, October 21, 2019 - link

    I'm betting on a two core die layout with extra cache. So 4+4 core dies and probably 64 meg of L3 like the 3900X. Reply
  • extide - Monday, October 21, 2019 - link

    Unlikely. Such a product would probably be a 3850X, but I doubt they would ever make such a product.

    It is far more likely to be some sort of OEM only SKU for some big partner with a specific request.
    Reply
  • RU482 - Tuesday, October 22, 2019 - link

    lol, OEM requested SKU. that's a laugh. They're binning handicapped parts Reply
  • Korguz - Tuesday, October 22, 2019 - link

    and there is an issue with that ?? i bet intel does the same thing.... it could also be known as die harvesting..... Reply
  • artifex - Tuesday, October 22, 2019 - link

    Intel's been doing binning for market segmentation reasons since... well, back in the Coppermine days, it was well assumed here and at Tom's Hardware and SharkyExtreme that it was all pretty much the same silicon, and therefore plenty of room for overclocking the lower ones. So I got a slocket and overclocked a 600 MHz P3 to 733(?) just by changing the jumpers and it ran fine for years. So before then, I'm sure. Reply
  • porina - Monday, October 21, 2019 - link

    There is one other scenario where two dies might make sense: if AMD have a bunch of "one good CCX" dies that can run 4+0 but not 2+2. Since L3 is tied to CCX, you still get 16MB/CCX so no extra. Such an arrangement could still have an advantage in that each CCD has separate write bandwidth to IOD. Reply
  • scineram - Tuesday, October 22, 2019 - link

    IMO the 3800X should have been their dual CCD 8 core processor to properly differentiate it from the 3700X. Reply
  • cjrcl - Tuesday, October 22, 2019 - link

    (4+0)+(4+0) will be of 32 MiB L3 while (2+2)+(2+2) will be of 64 MiB L3.
    The first one would be called 3850X and the second one 3750X.
    Reply
  • cjrcl - Tuesday, October 22, 2019 - link

    typo, should swap 3850 and 3750. Reply

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