Instruction Changes

Both of the processor cores inside Alder Lake are brand new – they build on the previous generation Core and Atom designs in multiple ways. As always, Intel gives us a high level overview of the microarchitecture changes, as we’ve written in an article from Architecture Day:

At the highest level, the P-core supports a 6-wide decode (up from 4), and has split the execution ports to allow for more operations to execute at once, enabling higher IPC and ILP from workflow that can take advantage. Usually a wider decode consumes a lot more power, but Intel says that its micro-op cache (now 4K) and front-end are improved enough that the decode engine spends 80% of its time power gated.

For the E-core, similarly it also has a 6-wide decode, although split to 2x3-wide. It has a 17 execution ports, buffered by double the load/store support of the previous generation Atom core. Beyond this, Gracemont is the first Atom core to support AVX2 instructions.

As part of our analysis into new microarchitectures, we also do an instruction sweep to see what other benefits have been added. The following is literally a raw list of changes, which we are still in the process of going through. Please forgive the raw data. Big thanks to our industry friends who help with this analysis.

Any of the following that is listed as A|B means A in latency (in clocks) and B in reciprocal throughput (1/instructions).

 

P-core: Golden Cove vs Cypress Cove

Microarchitecture Changes:

  • 6-wide decoder with 32b window: it means code size much less important, e.g. 3 MOV imm64 / clks;(last similar 50% jump was Pentium -> Pentium Pro in 1995, Conroe in 2006 was just 3->4 jump)
  • Triple load: (almost) universal
    • every GPR, SSE, VEX, EVEX load gains (only MMX load unsupported)
    • BROADCAST*, GATHER*, PREFETCH* also gains
  • Decoupled double FADD units
    • every single and double SIMD VADD/VSUB (and AVX VADDSUB* and VHADD*/VHSUB*) has latency gains
    • Another ADD/SUB means 4->2 clks
    • Another MUL means 4->3 clks
    • AVX512 support: 512b ADD/SUB rec. throughput 0.5, as in server!
    • exception: half precision ADD/SUB handled by FMAs
    • exception: x87 FADD remained 3 clks
  • Some form of GPR (general purpose register) immediate additions treated as NOPs (removed at the "allocate/rename/move ellimination/zeroing idioms" step)
    • LEA r64, [r64+imm8]
    • ADD r64, imm8
    • ADD r64, imm32
    • INC r64
    • Is this just for 64b addition GPRs?
  • eliminated instructions:
    • MOV r32/r64
    • (V)MOV(A/U)(PS/PD/DQ) xmm, ymm
    • 0-5 0x66 NOP
    • LNOP3-7
    • CLC/STC
  • zeroing idioms:
    • (V)XORPS/PD, (V)PXOR xmm, ymm
    • (V)PSUB(U)B/W/D/Q xmm
    • (V)PCMPGTB/W/D/Q xmm
    • (V)PXOR xmm

Faster GPR instructions (vs Cypress Cove):

  • LOCK latency 20->18 clks
  • LEA with scale throughput 2->3/clk
  • (I)MUL r8 latency 4->3 clks
  • LAHF latency 3->1 clks
  • CMPS* latency 5->4 clks
  • REP CMPSB 1->3.7 Bytes/clock
  • REP SCASB 0.5->1.85 Bytes/clock
  • REP MOVS* 115->122 Bytes/clock
  • CMPXVHG16B 20|20 -> 16|14
  • PREFETCH* throughput 1->3/clk
  • ANDN/BLSI/BLSMSK/BLSR throughput 2->3/clock
  • SHA1RNDS4 latency 6->4
  • SHA1MSG2 throughput 0.2->0.25/clock
  • SHA256MSG2 11|5->6|2
  • ADC/SBB (r/e)ax 2|2 -> 1|1

Faster SIMD instructions (vs Cypress Cove):

  • *FADD xmm/ymm latency 4->3 clks (after MUL)
  • *FADD xmm/ymm latency 4->2 clks(after ADD)
  • * means (V)(ADD/SUB/ADDSUB/HADD/HSUB)(PS/PD) affected
  • VADD/SUB/PS/PD zmm  4|1->3.3|0.5
  • CLMUL xmm  6|1->3|1
  • CLMUL ymm, zmm 8|2->3|1
  • VPGATHERDQ xmm, [xm32], xmm 22|1.67->20|1.5 clks
  • VPGATHERDD ymm, [ym32], ymm throughput 0.2 -> 0.33/clock
  • VPGATHERQQ ymm, [ym64], ymm throughput 0.33 -> 0.50/clock

Regressions, Slower instructions (vs Cypress Cove):

  • Store-to-Load-Forward 128b 5->7, 256b 6->7 clocks
  • PAUSE latency 140->160 clocks
  • LEA with scale latency 2->3 clocks
  • (I)DIV r8 latency 15->17 clocks
  • FXCH throughput 2->1/clock
  • LFENCE latency 6->12 clocks
  • VBLENDV(B/PS/PD) xmm, ymm 2->3 clocks
  • (V)AESKEYGEN latency 12->13 clocks
  • VCVTPS2PH/PH2PS latency 5->6 clocks
  • BZHI throughput 2->1/clock
  • VPGATHERDD ymm, [ym32], ymm latency 22->24 clocks
  • VPGATHERQQ ymm, [ym64], ymm latency 21->23 clocks

 

E-core: Gracemont vs Tremont

Microarchitecture Changes:

  • Dual 128b store port (works with every GPR, PUSH, MMX, SSE, AVX, non-temporal m32, m64, m128)
  • Zen2-like memory renaming with GPRs
  • New zeroing idioms
    • SUB r32, r32
    • SUB r64, r64
    • CDQ, CQO
    • (V)PSUBB/W/D/Q/SB/SW/USB/USW
    • (V)PCMPGTB/W/D/Q
  • New ones idiom: (V)PCMPEQB/W/D/Q
  • MOV elimination: MOV; MOVZX; MOVSX r32, r64
  • NOP elimination: NOP, 1-4 0x66 NOP throughput 3->5/clock, LNOP 3, LNOP 4, LNOP 5

Faster GPR instructions (vs Tremont)

  • PAUSE latency 158->62 clocks
  • MOVSX; SHL/R r, 1; SHL/R r,imm8  tp 1->0.25
  • ADD;SUB; CMP; AND; OR; XOR; NEG; NOT; TEST; MOVZX; BSSWAP; LEA [r+r]; LEA [r+disp8/32] throughput 3->4 per clock
  • CMOV* throughput 1->2 per clock
  • RCR r, 1 10|10 -> 2|2
  • RCR/RCL r, imm/cl 13|13->11|11
  • SHLD/SHRD r1_32, r1_32, imm8 2|2 -> 2|0.5
  • MOVBE latency 1->0.5 clocks
  • (I)MUL r32 3|1 -> 3|0.5
  • (I)MUL r64 5|2 -> 5|0.5
  • REP STOSB/STOSW/STOSD/STOSQ 15/8/12/11 byte/clock -> 15/15/15/15 bytes/clock

Faster SIMD instructions (vs Tremont)

  • A lot of xmm SIMD throughput is 4/clock instead of theoretical maximum(?) of 3/clock, not sure how this is possible
  • MASKMOVQ throughput 1 per 104 clocks -> 1 per clock
  • PADDB/W/D; PSUBB/W/D PAVGB/PAVGW 1|0.5 -> 1|.33
  • PADDQ/PSUBQ/PCMPEQQ mm, xmm: 2|1 -> 1|.33
  • PShift (x)mm, (x)mm 2|1 -> 1|.33
  • PMUL*, PSADBW mm, xmm 4|1 -> 3|1
  • ADD/SUB/CMP/MAX/MINPS/PD 3|1 -> 3|0.5
  • MULPS/PD 4|1 -> 4|0.5
  • CVT*, ROUND xmm, xmm 4|1 -> 3|1
  • BLENDV* xmm, xmm 3|2 -> 3|0.88
  • AES, GF2P8AFFINEQB, GF2P8AFFINEINVQB xmm 4|1 -> 3|1
  • SHA256RNDS2 5|2 -> 4|1
  • PHADD/PHSUB* 6|6 -> 5|5

Regressions, Slower (vs Tremont):

  • m8, m16 load latency 4->5 clocks
  • ADD/MOVBE load latency 4->5 clocks
  • LOCK ADD 16|16->18|18
  • XCHG mem 17|17->18|18
  • (I)DIV +1 clock
  • DPPS 10|1.5 -> 18|6
  • DPPD 6|1 -> 10|3.5
  • FSIN/FCOS +12% slower

 

Power: P-Core vs E-Core, Win10 vs Win11 CPU Tests: Core-to-Core and Cache Latency, DDR4 vs DDR5 MLP
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  • blanarahul - Thursday, November 4, 2021 - link

    "Using all the eight E-cores, at 3.9 GHz, brings the package power up to 48 W total."

    This sounds amazing for inexpensive (i3 class) laptop processors since Gracemont sips power and doesn't take much die space.
  • Great_Scott - Thursday, November 4, 2021 - link

    I'd actually prefer a all-Gracemont CPU for Laptops. Seems like it would be better for intentionally maximizing battery life. Skylake+ level performance is perfect for most use cases.
  • TheinsanegamerN - Thursday, November 4, 2021 - link

    Indeed, they have it backwards for laptops, it should be 2-6 gracemont cores then 1-2 power cores for a CPU, not the other way around.
  • karmapop - Thursday, November 4, 2021 - link

    I'm guessing you missed the articles describing the two separate mobile dies for Alder Lake? We've got Alder Lake-P (6P + 8E) for performance mobile designs, and Alder Lake-M (2P + 8E) for the ultra mobile low power SKUs.
  • at_clucks - Saturday, November 6, 2021 - link

    I'm very happy with exactly-Skylake-level performance in my desktop :). I'd more than gladly take the same performance and cut the power in half. I'm sure there's quite a big market for that kind of performance in a lower powered package regardless of form factor (mobile, desktop).
  • Meteor2 - Tuesday, November 9, 2021 - link

    There really is. I may well pick up a 2P+8E ADL laptop, but a desktop box would suit me better
  • mode_13h - Wednesday, November 10, 2021 - link

    Keep an eye on ASRock. They sell mini-ITX motherboards with that class of SoC.

    https://www.asrock.com/mb/index.us.asp#Intel%20CPU
  • Spunjji - Friday, November 5, 2021 - link

    That's actually not great in power terms compared to what AMD can do with 8 Zen 3 cores on TSMC N7 - but yeah, in the context of die area, something built around (say) 2 P cores and 4 E cores can probably put in a very good showing for inexpensive devices.
  • Netmsm - Thursday, November 4, 2021 - link

    Becomes competitive to previous AMD's.
  • EnglishMike - Thursday, November 4, 2021 - link

    Previous AMDs support DDR5 and PCR 5.0?

    Huh. That one slipped by me...

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