Power Delivery Thermal Analysis

One of the most requested elements of our motherboard reviews revolves around the power delivery and its componentry. Aside from the quality of the components and its capability for overclocking to push out higher clock speeds which in turn improves performance, is the thermal capability of the cooling solutions implemented by manufacturers. While almost always fine for users running processors at default settings, the cooling capability of the VRMs isn't something that users should worry too much about, but for those looking to squeeze out extra performance from the CPU via overclocking, this puts extra pressure on the power delivery and in turn, generates extra heat. This is why more premium models often include heatsinks on its models with better cooling designs, heftier chunks of metal, and in some cases, even with water blocks.


The 8-phase power delivery operating at 6+2 on the GIGABYTE B550I Aorus Pro AX

Testing Methodology

Out method of testing out if the power delivery and its heatsink are effective at dissipating heat, is by running an intensely heavy CPU workload for a prolonged method of time. We apply an overclock which is deemed safe and at the maximum that the silicon on our AMD Ryzen 7 3700X processor allows. We then run the Prime95 with AVX2 enabled under a torture test for an hour at the maximum stable overclock we can which puts insane pressure on the processor. We collect our data via three different methods which include the following:

  • Taking a thermal image from a birds-eye view after an hour with a Flir Pro thermal imaging camera
  • Securing two probes on to the rear of the PCB, right underneath CPU VCore section of the power delivery for better parity in case the first probe reports a faulty reading
  • Taking a reading of the VRM temperature from the sensor reading within the HWInfo monitoring application

The reason for using three different methods is that some sensors can read inaccurate temperatures, which can give very erratic results for users looking to gauge whether an overclock is too much pressure for the power delivery handle. With using a probe on the rear, it can also show the efficiency of the power stages and heatsinks as a wide margin between the probe and sensor temperature can show that the heatsink is dissipating heat and that the design is working, or that the internal sensor is massively wrong. To ensure our probe was accurate before testing, I binned 10 and selected the most accurate (within 1c of the actual temperature) for better parity in our testing.

For thermal image, we use a Flir One camera as it gives a good indication of where the heat is generated around the socket area, as some designs use different configurations and an evenly spread power delivery with good components will usually generate less heat. Manufacturers who use inefficient heatsinks and cheap out on power delivery components should run hotter than those who have invested. Of course, a $700 flagship motherboard is likely to outperform a cheaper $100 model under the same testing conditions, but it is still worth testing to see which vendors are doing things correctly.

Thermal Analysis Results


We measured 51.9°C on the hottest part of CPU socket area during our testing

The GIGABYTE B550I Aorus Pro AX is using an 8-phase design that operates in a 6+2 configuration. It consists of six Intersil ISL99390 90 A power stages for the CPU VCore, and two ISL99390 90 A power stages for the SoC. (insert doubler). Cooling the power delivery is a large single heatsink that molds into the design of the board's plastic rear panel cover and is connected to the M.2 and chipset heatsink. It relies primarily on brute mass and good passive airflow within a chassis. 

Looking at the GIGABYTE B550I Aorus Pro AX's power delivery thermal results in comparison to other AM4 models we've tested with our Ryzen 7 3700X processor, it performs pretty well all things considered. We typically see higher temperatures on mini-ITX motherboards which is a direct result of cramped componentry on a small PCB. Where an ATX size model can utilize PCB space to split power deliveries into two elements with one to two heatsinks to dissipate the heat more effectively, the GIGABYTE power delivery operates in a single strip with a single heatsink doing all of the heat removal.

We observed a reading of 61°C from our first K-type probe on the rear, with our second consistent with a slight variance of 59°C. This is also consistent with the reading from the board's VRM temperature sensor of 61°C, which shows the heatsink is efficiently removing heat as our thermal imaging camera shows the hottest part around the socket reached just shy of 52°C. This is good for a mini-ITX model and it shows GIGABYTE has another highly efficient power delivery design on its hands.

Ryzen 3000 Overclocking GIGABYTE B550I Aorus Pro AX Conclusion
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  • meacupla - Tuesday, December 8, 2020 - link

    yup, that's exactly what happens.

    The only remaining fix I could think of was replacing the soldered in BIOS chips
  • star-affinity - Tuesday, December 15, 2020 - link

    Just wanted to say that my problems was resolved with a new power supply! So now the Gigabyte motherboard is working fine again, believe it or not. :)
  • duploxxx - Tuesday, December 8, 2020 - link

    not to mention cold boot - bios resets - unable to save q-fan profiles etc...
    I was very impressed by the x370 although it lacked some easy visual design.
    The x570 gigabyte is not worth the money, would stay away from it as much as possible.

    I also own an Asrock B450 board, a much better bios layout.
  • Dug - Tuesday, December 8, 2020 - link

    Strange. I have Gigabyte going back to p965 with no issue.
    No issue with my x570 aorus pro wifi like you describe either, like thousands of others.
  • kkilobyte - Tuesday, December 8, 2020 - link

    I - and others - have zero idea on what is triggering the issue. There is clearly something fishy going on with the power distribution on the Aorus X570, but so far, it was not possible to pinpoint the origin of it. ErP, USB load, PSU, DisplayPort, Sleep modes, RAM modules all have been suspected, but none of those elements led to anything conclusive. There is a +20 pages thread on hardforum.com about it. I tried to probe the issue with my scope, but it happens completely randomly; so far, it happened to me 3 times in about 8 months, and last time it happened, I was in a hurry and couldn't test.

    Doing a CMOS reset through the jumper doesn't solve the issue; it could thus mean that it is not a cmos-ram corruption, but a more fundamental electrical issue. My best bet is that somehow a power spike at shutdown is sometimes high enough to wrongly toggle a signal line that 'locks' one of the components kept alive by the battery.

    Finding the solution would require identifying the components that are kept powered by the cmos battery; without precise motherboard schematics, however, that's going to be difficult; even if it gets identified, I don't see how it would be solved without some sort of hardware hacking.

    My personal solution is to design an arduino-based circuit that plugs on the battery connector of the motherboard, and allows a 'reset' through a front panel button. It's less than ideal, but that's better than having to open the case and remove my gfx card just to get the battery out.
  • mkarwin - Tuesday, December 15, 2020 - link

    Well if CMOS reset does not fix the issue there's either a failing BIOS chip or circuitry throughout the board's layers... Theoretically one could pinpoint the issue by replacing the BIOS chip...
    BTW. I honestly wonder why they haven't thought of putting BIOS(es) on microSD cards, some of those smaller ones would be dirt cheap nowadays and capacituous enough to handle modern UEFI BIOSes - easy to remove/replace/reflash, could maybe improve the consumer attitude towards the issue if it is related to BIOS chips...
  • hansip87 - Monday, December 7, 2020 - link

    What i don't understand with AMD mini ITX board is how few are their USB ports available at the back. one of the reasons why i chose going intel route was that there is this cheap Asrock Z490 itx board with 8 USB ports at the back. Sure it;s not the only factor but why can't any of AMD ITX boards do the same?
  • romrunning - Monday, December 7, 2020 - link

    Well, you can always just get a plug-in USB hub if you need more. I think the mfgs don't add as many USB ports mostly as a cost-savings.
  • mkarwin - Tuesday, December 15, 2020 - link

    Seems quite odd considering they are still asking more ($) for less (size & features)... It's not like they're running out of space on I/O shield, there's no integrated massive cooling openings in most cases, so adding eg. 4 extra even 2.0 USB ports would be more beneficial than having 3 display outputs for the integrated Radeon solutions... I could see a future where more integrated display outputs is beneficial - if they allow adding those server/compute accelerators without display outputs so that they could pass through the display to those board integrated ports. Otherwise, I think maybe 1 HDMI is enough. Especially if you can use said HDMI to pass through audio from the integrated card as well...
  • jeremyshaw - Monday, December 7, 2020 - link

    Probably the massive AMD AM4 keep out area. It doesn't really matter for mATX and ATX, but for mITX, every mm^2 matters. But every B550 ITX board is flawed in some way.

    ASUS hates rear I/O altogether, ASRock ditches the S/PDIF and doesn't have all that many USB ports (still more than ASUS). Gigabyte's never head of USB-C headers, and MSI gets all of that right, but has a proprietary backplate.

    X570 came out a year earlier and is worse in many ways. ASUS is pricing their top end board for people without sense, and all of the X570 mITX boards from all other vendors lack the USB-C header. All of them are also 1GbE only, which seems like a waste for such a fast platform. ASRock has TB3, but only one M.2 slot, and very few USB ports.

    In the end, I've held off upgrading my old AB350 Fata1ity ITX, since nothing is really appealing w.r.t. upgrading (not to mention almost twice the price!). Ryzen 5000 might force my hand, but I'd still rather not "upgrade" to boards that are very flawed (IMO) vs their Intel counterparts.

    On Intel, all is not perfect, but there are more "perfect" boards that don't have these same issues.

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