UCIe Consortium Incorporates, Adds NVIDIA and Alibaba As Members
Among the groups with a presence at this year’s Flash Memory Summit is the UCIe Consortium, the recently formed group responsible for the Universal Chiplet Interconnect Express (UCIe) standard...
21 by Ryan Smith on 8/4/2022
SK hynix Announces 238 Layer NAND - Mass Production To Start In H1'2023
As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first...
9 by Ryan Smith on 8/4/2022
Phison and Seagate Announce X1 SSD Platform: U.3 PCIe 4.0 x4 with 128L eTLC
Phison and Seagate have been collaborating on SSDs since 2017 in the client as well as SMB/SME space. In April 2022, they had announced a partnership to develop and...
15 by Ganesh T S on 8/2/2022
OpenCAPI to Fold into CXL - CXL Set to Become Dominant CPU Interconnect Standard
With the 2022 Flash Memory Summit taking place this week, not only is there a slew of solid-state storage announcements in the pipe over the coming days, but the...
8 by Ryan Smith on 8/1/2022
Silicon Motion Announces SM8366 PCIe 5.0 x4 NVMe Controller and MonTitan SSD Solutions Platform for Enterprise Storage
In the lead up to the Flash Memory Summit next week, many vendors have started announcing their new products. Today, Silicon Motion is unveiling their first enterprise-focused PCIe 5.0...
3 by Ganesh T S on 7/28/2022
Micron’s 232 Layer NAND Now Shipping: 1Tbit, 6-Plane Dies With 50% More I/O Bandwidth
Ahead of next week’s Flash Memory Summit, Micron this morning is announcing that their next-generation 232 layer NAND has begun shipping. The sixth generation of Micron’s 3D NAND technology...
18 by Ryan Smith on 7/26/2022
TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard
TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...
13 by Anton Shilov on 7/21/2022
Western Digital 22TB WD Gold, Red Pro, and Purple HDDs Hit Retail
Western Digital's 'What's Next' event back in May 2022 had seen the announcement of its 22TB platform based on ePMR and OptiNAND (with ArmorCache). At the event, WD indicated...
22 by Ganesh T S on 7/19/2022
Samsung Starts 3nm Production: The Gate-All-Around (GAAFET) Era Begins
Capping off a multi-year development process, Samsung’s foundry group sends word this morning that the company has officially kicked off production on its initial 3nm chip production line. Samsung’s...
22 by Ryan Smith on 6/30/2022
ASRock Releases Raptor Lake BIOS Updates For Its 600 Series Motherboards
While Intel has yet to officially announce its next (13th) generation of Core processors, this isn't stopping motherboard manufacturers from releasing products for them. Always eager to slide ahead...
3 by Gavin Bonshor on 6/29/2022
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by Anton Shilov on 6/29/2022
TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm
We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...
20 by Anton Shilov on 6/29/2022
As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling
One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...
40 by Anton Shilov on 6/27/2022
AMD Updates Ryzen Embedded Series, R2000 Series With up to Four Cores and Eight Threads
One area of AMD's portfolio that perhaps doesn't garner the same levels of attention as its desktop, mobile, and server products is its embedded business. In early 2020, AMD...
20 by Gavin Bonshor on 6/22/2022
Lenovo ThinkStation P360 Ultra Melds Desktop Alder Lake and NVIDIA Professional Graphics
Over the last decade or so, advancements in CPU and GPU architectures have combined extremely well with the relentless march of Moore's Law on the silicon front. Together, these...
11 by Ganesh T S on 6/21/2022
TSMC to Expand Capacity for Mature and Specialty Nodes by 50%
TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...
13 by Anton Shilov on 6/16/2022
TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...
24 by Anton Shilov on 6/16/2022
AMD's Desktop CPU Roadmap: 2024 Brings Zen 5-based "Granite Ridge"
As part of AMD's Financial Analyst Day 2022, it has provided us with a look at the company's desktop client CPU roadmap as we advance towards 2024. As we...
37 by Gavin Bonshor on 6/9/2022
Updated AMD Notebook Roadmap: Zen 4 on 4nm in 2023, Zen 5 By End of 2024
As we've come to expect during AMD's Financial Analyst Day (FAD), we usually get small announcements about big things coming in the future. This includes updated product roadmaps for...
23 by Gavin Bonshor on 6/9/2022
AMD Announces Genoa-X: 4th Gen EPYC with Up to 96 Zen 4 Cores and 1GB L3 V-Cache
As AMD makes strides in snatching market share with its high-performance x86 processor designs in the server market, it has announced some of its upcoming 4th generations EPYC families...
12 by Gavin Bonshor on 6/9/2022
Facebook
Twitter
RSS