Qualcomm Unveils Snapdragon 6 Gen 1 and 4 Gen 1 SoCs: Updating Mid-Range and Entry-Level Phones
Qualcomm this morning is taking the wraps off a pair of new SoCs for the mid-range and entry-level smartphone markets. Refreshing the company’s longstanding 600 and 400 series of...
17 by Ryan Smith on 9/6/2022
AMD EXPO Memory Technology: One Click Overclocking Profiles For Ryzen 7000
During AMD's 'together we advance_PCs event, the company unveiled its latest Zen 4-based Ryzen 7000 processors to the world, as well as its AM5 platforms, including X670E, X670, B650E...
34 by Gavin Bonshor on 8/30/2022
AMD Announces B650 Extreme Chipset for Ryzen 7000: PCIe 5.0 For Mainstream
Over the last couple of months, the rumor mill surrounding AMD's impending Ryzen 7000 processors for desktops has been in overdrive. Although Lisa Su unveiled Zen 4 back at...
24 by Gavin Bonshor on 8/29/2022
Intel Kicks Off Fab Co-Investment Program with Brookfield: New Fabs to be Jointly Owned
Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the...
28 by Anton Shilov on 8/24/2022
ASUS Unveils Crosshair X670E Gene, Premium Micro-ATX AM5 Motherboard for Ryzen 7000
Over the years, multiple motherboards have captivated the market at various price points. Models like the Hero and the Formula are staples of ASUS's premium but popular ROG-themed offerings...
29 by Gavin Bonshor on 8/23/2022
Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...
26 by Anton Shilov on 8/19/2022
AMD Announces Ryzen 7000 Reveal Livestream for August 29th
In a brief press release sent out this morning, AMD has announced that they will be delivering their eagerly anticipated Ryzen 7000 unveiling later this month as a live...
52 by Ryan Smith on 8/16/2022
UCIe Consortium Incorporates, Adds NVIDIA and Alibaba As Members
Among the groups with a presence at this year’s Flash Memory Summit is the UCIe Consortium, the recently formed group responsible for the Universal Chiplet Interconnect Express (UCIe) standard...
21 by Ryan Smith on 8/4/2022
SK hynix Announces 238 Layer NAND - Mass Production To Start In H1'2023
As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first...
9 by Ryan Smith on 8/4/2022
Phison and Seagate Announce X1 SSD Platform: U.3 PCIe 4.0 x4 with 128L eTLC
Phison and Seagate have been collaborating on SSDs since 2017 in the client as well as SMB/SME space. In April 2022, they had announced a partnership to develop and...
15 by Ganesh T S on 8/2/2022
OpenCAPI to Fold into CXL - CXL Set to Become Dominant CPU Interconnect Standard
With the 2022 Flash Memory Summit taking place this week, not only is there a slew of solid-state storage announcements in the pipe over the coming days, but the...
8 by Ryan Smith on 8/1/2022
Silicon Motion Announces SM8366 PCIe 5.0 x4 NVMe Controller and MonTitan SSD Solutions Platform for Enterprise Storage
In the lead up to the Flash Memory Summit next week, many vendors have started announcing their new products. Today, Silicon Motion is unveiling their first enterprise-focused PCIe 5.0...
3 by Ganesh T S on 7/28/2022
Micron’s 232 Layer NAND Now Shipping: 1Tbit, 6-Plane Dies With 50% More I/O Bandwidth
Ahead of next week’s Flash Memory Summit, Micron this morning is announcing that their next-generation 232 layer NAND has begun shipping. The sixth generation of Micron’s 3D NAND technology...
18 by Ryan Smith on 7/26/2022
TSMC and ASML: Demand for Chips Remains Strong, But Getting Fab Tools Is Hard
TSMC's revenue this year is going to set an all-time record for the company, thanks to high demand for chips as well as increased prices that its customers are...
13 by Anton Shilov on 7/21/2022
Western Digital 22TB WD Gold, Red Pro, and Purple HDDs Hit Retail
Western Digital's 'What's Next' event back in May 2022 had seen the announcement of its 22TB platform based on ePMR and OptiNAND (with ArmorCache). At the event, WD indicated...
22 by Ganesh T S on 7/19/2022
Samsung Starts 3nm Production: The Gate-All-Around (GAAFET) Era Begins
Capping off a multi-year development process, Samsung’s foundry group sends word this morning that the company has officially kicked off production on its initial 3nm chip production line. Samsung’s...
22 by Ryan Smith on 6/30/2022
ASRock Releases Raptor Lake BIOS Updates For Its 600 Series Motherboards
While Intel has yet to officially announce its next (13th) generation of Core processors, this isn't stopping motherboard manufacturers from releasing products for them. Always eager to slide ahead...
3 by Gavin Bonshor on 6/29/2022
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by Anton Shilov on 6/29/2022
TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm
We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...
20 by Anton Shilov on 6/29/2022
As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling
One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...
40 by Anton Shilov on 6/27/2022
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