Corsair Obsidian 900D Case Review: Think Big, That's Only HALF as Large

Testing Methodology

For testing full ATX cases, we use the following standardized testbed in stock and overclocked configurations to get a feel for how well the case handles heat and noise.

Each case is tested in a stock configuration and an overclocked configuration that generates substantially more heat (and thus may produce more noise). The system is powered on and left idle for fifteen minutes, the thermal and acoustic results recorded, and then stressed by running seven threads in Prime95 (in-place large FFTs) on the CPU and OC Scanner (maximum load) on the GPU. At the end of fiteen minutes, thermal and acoustic results are recorded. This is done for the stock settings and for the overclock, and if the enclosure has a fan controller, these tests are repeated for each setting. Ambient temperature is also measured after the fifteen idle minutes but before the stress test and used to calculate the final reported results.

For the "full fat" testbed, the GTX 560 Ti is swapped out for a pair of GTX 580s, and three hard disks are added to fill out the case.

Thank You!

Before moving on, we'd like to thank the following vendors for providing us with the hardware used in our testbed.

• Thank you to Puget Systems for providing us with the Intel Core i7-2700K.
• Thank you to Gigabyte for providing us with the GA-Z77X-UD4H motherboard.
• Thank you to Crucial for providing us with the Ballistix Smart Tracer memory.
• Thank you to Cooler Master for providing us with the Hyper 212 Evo heatsink and fan unit.
• Thank you to Kingston for providing us with the SSDNow V+ 100 SSD.
• Thank you to CyberPower for providing us with the Samsung BD-ROM/DVD+/-RW drive.
• Thank you to HGST for providing us with the trio of hard drives.
• And thank you to SilverStone for providing us with the power supply.