ASRock Unveils Three New X299 Motherboards For Cascade Lake-X

With Intel's new Cascade Lake-X HEDT processors coming soon, ASRock has announced three new motherboards - the Steel Legend, the Creator, and the Taichi CLX. The trio is spearheaded...

10 by Gavin Bonshor on 10/25/2019

Intel Launches Cascade Lake-X Processors: 18-core Review Later Today

Earlier in October, Intel announced that it would be launching its next generation high-end desktop processors in November. That day has come, and Intel expects its hardware to be...

41 by Dr. Ian Cutress on 10/25/2019

Intel Announces Q3 FY 2019 Earnings: Record Results

Today Intel announced their earnings for the third quarter of the 2019 fiscal year, which ended September 29, and the company has set a record for revenue thanks to...

39 by Brett Howse on 10/24/2019

Crucial Introduces X8 Portable SSD

Micron's consumer brand Crucial is entering the portable SSD market with the new Crucial X8 Portable SSD. The X8 has a USB-C 10Gb/s (USB 3.1 Gen 2) connection and...

7 by Billy Tallis on 10/24/2019

Micron Finally Announces A 3D XPoint Product: Micron X100 NVMe SSD

Micron and Intel co-developed 3D XPoint memory as a high-performance alternative to flash, but so far only Intel has brought products to market, under their Optane brand. Despite owning...

30 by Billy Tallis on 10/24/2019

Realtek 2.5 GbE PCIe Cards Now For Sale

A Japanese company has started sales of its 2.5 GbE network card that uses a Realtek controller. The adapter is a low-profile PCIe 2.0 x1 board that is compatible...

53 by Anton Shilov on 10/24/2019

Micron Announces 5300 And 7300 Series Enterprise SSDs

Among several announcements today, Micron is updating two families of enterprise/datacenter SSDs to use their latest 96-layer 3D TLC NAND flash memory. SATA Update The new 5300 series SATA drives are...

2 by Billy Tallis on 10/24/2019

x86 PC Smaller than an iPhone: GIGABYTE's GA-PICO3350 with an Apollo Lake CPU

Hidden underneath the mass of news is a new small Pico-ITX based SoC motherboard from GIGABYTE, the GA-PICO3350. Smaller than the latest iPhone 11 smartphone, the GIGABYTE GA-PICO3350 is...

14 by Gavin Bonshor on 10/24/2019

Philips Brilliance 272P7VUBNB: A Sub-$350 27-Inch 4K IPS Monitor with 65W USB PD & GbE

In previous years monitor capabilities such as 4K resolutions, USB-C docking, and GbE connectivity have been premium features that have only been available in high-end monitors. However the price...

20 by Anton Shilov on 10/24/2019

Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12...

30 by Anton Shilov on 10/24/2019

Intel Files Antitrust Suit Against SoftBank-Controlled Firm Over Patent Aggregation

Intel this week filed an lawsuit against Fortress Investment Group, a patent assertion entity controlled by SoftBank. Responding to a series of patent infringement lawsuits that Fortress has brought...

21 by Anton Shilov on 10/23/2019

The Foldable Huawei Mate X: Coming to China on November 15th for ~$2074

Foldable smartphones from Huawei and Samsung attracted quite a lot of public attention at Mobile World Congress early this year, but launches were delayed as companies had to polish...

17 by Anton Shilov on 10/23/2019

TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm

TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...

27 by Anton Shilov on 10/23/2019

Arm Announces New Ethos-N57 and N37 NPUs, Mali-G57 Valhall GPU and Mali-D37 DPU

Today Arm is announcing four new products in its NPU, GPU and DPU portfolio. The company is branding its in-house machine learning processor IPs the Ethos line-up detailing more...

13 by Andrei Frumusanu on 10/23/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

8 by Anton Shilov on 10/22/2019

AOC Reveals Agon AG273QX: A 27-Inch 165 Hz FreeSync 2 Monitor

AOC has introduced its new Agon-series 27-inch gaming display featuring a variable refresh rate of up to 165 Hz enabled by AMD’s FreeSync 2 technology. Like all Agon monitors...

16 by Anton Shilov on 10/22/2019

Team Group Quietly Launches 32 GB DDR4 Memory Modules

Team Group has quietly added 32 GB unbuffered DDR4 memory modules to its product catalogue and plans to start sales in the near future. The modules will feature JEDEC-standard...

8 by Anton Shilov on 10/22/2019

New Tools Simplify Development of 2.5D Multi-Die 7nm Designs at Samsung Foundry

Advanced packaging technologies simplify production and increase performance of highly-complex multi-die SoCs as the semiconductor industry is looking at chiplet approach as an alternative to large dies that take...

5 by Anton Shilov on 10/22/2019

AMD May Be Prepping More 280 W EPYC Enterprise CPUs

Back in September, AMD announced its 64-core EPYC 7H12 processor - a 280 W TDP behemoth with an increased base frequency designed specifically for the high-performance computing market. Based...

22 by Anton Shilov on 10/21/2019

Lenovo: Foldable ThinkPad X1 to Launch in 2020

At Canalys Channels Forum last week, Lenovo finally revealed launch timeframe for its foldable ThinkPad X1 hybrid notebook that was first revealed in May. The company says that the...

9 by Anton Shilov on 10/21/2019
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