DUV

Samsung this week announced that its 8LPP fabrication process, which it formally introduced earlier this year, had passed qualification tests. The manufacturing technology will be used to produce advanced SoCs next year and will be Samsung’s final leading edge process based solely on DUV lithography before the company adopts EUV for select layers with its 7LPP process node. The 8LPP fabrication technology is an evolution of Samsung’s 10 nm node that uses narrower metal pitches and promises a 10% area reduction (at the same complexity) as well as a 10% lower power consumption (at the same frequency and complexity) compared to the 10LPP process. Samsung does not disclose which standard cell libraries are used by the 8LPP, but the 10LPP relies on 8.75T and 10.5T...

GlobalFoundries Details 7 nm Plans: Three Generations, 700 mm², HVM in 2018

Keeping an eye on the ever-evolving world of silicon lithography, GlobalFoundries has recently disclosed additional details about its 7 nm generation of process technologies. As announced last September, the...

75 by Anton Shilov on 6/23/2017

Samsung and TSMC Roadmaps: 8 and 6 nm Added, Looking at 22ULP and 12FFC

Samsung and TSMC have made several important announcements about the present and future of their semiconductor manufacturing technologies in March. Samsung revealed that it had shipped over 70 thousand...

88 by Anton Shilov on 5/5/2017

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