Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND
Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...
17 by Anton Shilov on 7/6/2017
Mining Cards Update: Zotac, Manli and Biostar Products Formally Confirmed
Although ASUS and Sapphire cryptocurrency mining cards were officially outed last week, other pieces of evidence have suggested other vendors were also producing cryptomining cards. Both the GPU manufacturers...
11 by Nate Oh on 7/6/2017
Biostar Goes Mining: New TB250-BTC PRO Motherboard and RX 470D Mining GPU
With cryptocurrency mining specific motherboards and even graphics cards becoming the new normal for certain manufacturers in their offerings, Biostar has thrown two new products into the ring: the...
22 by Nate Oh on 7/5/2017
NVIDIA and Baidu Sign Multi-Facet AI Tech Partnership for Tesla, DRIVE PX2, & SHIELD TV
This morning NVIDIA and Chinese Internet juggernaut Baidu are announcing that they have signed a multi-faceted AI technology partnership that will see the Internet giant utilize NVIDIA’s hardware for...
3 by Ryan Smith on 7/5/2017
Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?
Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...
37 by Anton Shilov on 7/3/2017
Nokia 6 to Hit U.S. Market on July 10: 5.5-inch LCD, Snapdragon 430, $229
HMD Global has announced that it would begin sales of its Nokia 6 smartphone in the U.S. in early July. The product will be available in two colors and...
27 by Anton Shilov on 7/3/2017
GIGABYTE Joins AM4 Mini-ITX Club with GA-AB350N-Gaming Wi-Fi Motherboard
GIGABYTE has announced its first Mini-ITX motherboard for AMD’s AM4 processors. The GA-AB350N-Gaming WIFI (or simply AB350N-Gaming) Mini-ITX is based on AMD’s ‘performance-class’ B350 chipset and provides modern features...
23 by Anton Shilov on 7/3/2017
ASUS Launches XG-C100C 10 GBase-T Adapter: Aquantia AQC107, $99
ASUS this week released the first inexpensive vendor-based consumer-grade 10 GbE / 10GBase-T card powered by an Aquantia silicon. The card can be installed in any modern PC with...
26 by Anton Shilov on 7/3/2017
LG’s 34UC89G 21:9 Curved Display with G-Sync, 144 to 166 Hz, Available for $999
LG has begun to sell its new ultra-wide curved display that appears to be its first monitor to support NVIDIA’s G-Sync technology. The LG 34UC89G resembles the 34UC79G display...
21 by Anton Shilov on 7/3/2017
GIGABYTE Announces AORUS GeForce GTX 1080 Ti Waterforce Xtreme Edition 11G and Waterforce WB Xtreme Edition 11G
Following up after last week’s teasers, GIGABYTE has officially announced two ultra-high-end graphics cards under its AORUS brand: the AORUS GeForce GTX 1080 Ti Waterforce Xtreme Edition 11G and...
26 by Nate Oh on 6/30/2017
TechInsights Confirms Apple’s A10X SoC Is TSMC 10nm FF; 96.4mm2 Die Size
One of the more intriguing mysteries in the Apple ecosystem has been the question over what process the company would use for the A10X SoC, which is being used...
87 by Ryan Smith on 6/29/2017
NVIDIA Releases 384.76 WHQL Game Ready Driver
Update: On 7/4/17, NVIDIA released the 384.80 hotfix driver resolving Watch Dogs 2 crashes on startup. A few weeks have passed since driver version 382.53, and it’s time again for...
4 by Nate Oh on 6/29/2017
G.Skill Announces Quad-Channel DDR4-4200 Kit for Intel Skylake-X CPUs
G.Skill this past week has formally announced its quad-channel memory kits designed for the latest Intel Core i7 (Skylake-X) CPUs and the Intel X299 platform. The flagship 64 GB...
11 by Anton Shilov on 6/29/2017
Western Digital Launches New My Passport Ultra HDDs: New Enclosure, Up to 4 TB
Western Digital this week refreshed its My Passport Ultra lineup of small form-factor external HDDs. The new hard drives use a new enclosure and come with software that backs...
26 by Anton Shilov on 6/29/2017
AMD Inadvertently Reveals Ryzen 3 1300 & 1200 Details
If you were paying close attention to this morning’s announcement of AMD’s new Ryzen Pro SKUs, then you likely noticed something interesting: the non-X PRO chips all have the...
47 by Ryan Smith on 6/29/2017
Joint Venture Dispute Between Toshiba and Western Digital Escalates, Toshiba Still Unable to Sell NAND Business
Due to serious financial difficulties, Toshiba is trying to sell off their stake of their very successful flash memory business to keep the rest of the company afloat. Western...
11 by Billy Tallis on 6/29/2017
Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products
Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...
18 by Anton Shilov on 6/28/2017
Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip
Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital...
22 by Anton Shilov on 6/28/2017
Qualcomm Announces Snapdragon Wear 1200 SoC: LTE Categories M1 & NB1 for Wearables & Smart Trackers
Back around this time last year, Qualcomm introduced their Snapdragon Wear 1100, the company’s first SoC specifically designed for budget, low-power wearable devices. The humble SoC featured just a...
16 by Ryan Smith on 6/28/2017
Qualcomm Announces Snapdragon 450 Midrange SoC
Kicking off today is second Mobile World Congress of the year, MWC Shanghai. As the de facto home of smartphone manufacturing, and home for an increasing number of major...
17 by Ryan Smith on 6/28/2017
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