Memory

Samsung on Tuesday announced that it is increasing production volumes of its 8 GB, 8-Hi HBM2 DRAM stacks due to growing demand. In the coming months the company’s 8 GB HBM2 chips will be used for several applications, including those for consumers, professionals, AI, as well as for parallel computing. Meanwhile, AMD’s Radeon Vega graphics cards for professionals and gamers will likely be the largest consumers of HBM2 in terms of volume. And while AMD is traditionally a SK Hynix customer, the timing of this announcement with AMD's launches certainly suggests that AMD is likely a Samsung customer this round as well. Samsung’s 8 GB HBM Gen 2 memory KGSDs (known good stacked die) are based on eight 8-Gb DRAM devices in an 8-Hi stack...

Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming

Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...

6 by Anton Shilov 6 days ago

Patriot Publishes List of AMD Ryzen Compatible DIMMs: Up to DDR4-3400, 64 GB

Patriot has published a list of its memory modules that are verified and compatible with AMD Ryzen processors. This includes the Viper 4 and Viper Elite modules that are...

3 by Anton Shilov & Joe Shields on 7/13/2017

Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND

Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...

17 by Anton Shilov on 7/6/2017

Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?

Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...

36 by Anton Shilov on 7/3/2017

G.Skill Announces Quad-Channel DDR4-4200 Kit for Intel Skylake-X CPUs

G.Skill this past week has formally announced its quad-channel memory kits designed for the latest Intel Core i7 (Skylake-X) CPUs and the Intel X299 platform. The flagship 64 GB...

11 by Anton Shilov on 6/29/2017

Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products

Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...

17 by Anton Shilov on 6/28/2017

Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip

Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital...

22 by Anton Shilov on 6/28/2017

Micron Discusses GDDR: 16 Gbps GDDR5X, 16 nm GDDR6 and GDDR5

Micron has made a number of announcements in recent weeks regarding its GDDR memory for graphics cards, game consoles and networking applications. The company is reporting that they've been...

20 by Anton Shilov on 6/18/2017

DRAM and Motherboard Makers Demonstrate Quad-Channel DDR4-4000+ Operation

Over the course of Computex, manufacturers of memory modules and motherboards alike took to the show to showcase the latest developments in high-speed quad-channel memory configurations. Powered by Intel’s...

16 by Anton Shilov on 6/9/2017

SK Hynix Advances Graphics DRAM: GDDR6 Added to Catalogue, GDDR5 Gets Faster

SK Hynix has added GDDR6 memory chips to its product catalogue, revealing their general specifications and launch timeframe sometimes in Q4 2017. As expected, the new GDDR6 ICs will...

17 by Anton Shilov on 5/20/2017

CORSAIR Unveils Dominator Platinum Special Edition Torque 32GB DDR4 Memory Kits

Corsair has just launched a flamboyant new addition to its flagship Dominator Platinum memory series in the form of two 32GB DDR4 kits that have apparently been designed to...

17 by Patrick MacMillan on 5/16/2017

SK Hynix to Ship GDDR6 Memory for Graphics Cards by Early 2018

In a surprising move, SK Hynix has announced its first memory chips based on the yet-unpublished GDDR6 standard. The new DRAM devices for video cards have capacity of 8...

27 by Anton Shilov on 4/30/2017

G.Skill Announces 16 GB DDR4-4333 Memory Kit for Intel Kaby Lake CPUs

G.Skill on Friday announced its new top-of-the-range DDR4 memory kit for dual-channel PCs running Intel’s Kaby Lake processors. The new Trident Z kit for operates at 4333 MT/s (DDR4-4333)...

23 by Anton Shilov on 4/15/2017

G.Skill Announces Trident Z RGB DDR4 Kits with 16 GB Modules, Up to 128 GB

G.Skill has recently launched new Trident Z RGB memory kits, this time aimed at Intel X99 platforms, and following the RGB trend they give owners of high-end desktops an...

11 by Anton Shilov on 4/10/2017

JEDEC: DDR5 to Double Bandwidth Over DDR4, NVDIMM-P Specification Due Next Year

JEDEC made two important announcements about the future of DRAM and non-volatile DIMMs for servers last week. Development of both is proceeding as planned and JEDEC intends to preview...

37 by Anton Shilov on 4/3/2017

Corsair Vengeance RGB DDR4 Memory Modules with LEDs Now on Sale

Corsair last week started to sell its first Vengeance RGB memory modules, equipped with full sets of RGB LEDs that can change their colors using OS software. Right now...

19 by Anton Shilov on 3/29/2017

SK Hynix Lays Out Plans for 2017: 10nm-Class DRAM, 72-Layer 3D NAND

SK Hynix this week announced financial results for its fiscal year 2016 and also revealed general plans for 2017. As expected, the company intends to start volume production of...

12 by Anton Shilov on 1/28/2017

Toshiba Announces Plan to Sell Minority Stake In NAND Flash Production Business

This morning Toshiba has announced that they will be spinning off their chip production business as part of a broader plan to sell off a minority stake in the...

1 by Ryan Smith & Anton Shilov on 1/27/2017

Toshiba Is Studying The Possibility of Spinning Off NAND Flash Production

Toshiba on Wednesday confirmed that it is studying the possibility of splitting its NAND flash business into a separate company. While nothing has been decided as this point, the...

11 by Anton Shilov on 1/19/2017

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